Patents by Inventor Chi Wong
Chi Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12205861Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.Type: GrantFiled: August 2, 2023Date of Patent: January 21, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen, Shin-Puu Jeng
-
Patent number: 12085516Abstract: Systems and methods for non-contact characterization of semiconductor devices. Systems may include: an infrared radiation source directing radiation towards the semiconductor device; a radiation directing device positioned proximal the infrared radiation source to direct radiation towards an opposing side of the semiconductor device, the semiconductor device receivable between the radiation directing device and the infrared radiation source; and a radiation detector proximal to the infrared radiation source to sense radiation associated with a plurality of infrared wavebands from the semiconductor device for determining a dopant profile property of the semiconductor device. The sensed radiation may include radiation originating from the infrared radiation source reflected from the semiconductor device. The sensed radiation may include radiation originating from the radiation directing device and emerging from the semiconductor device.Type: GrantFiled: December 4, 2020Date of Patent: September 10, 2024Assignee: AURORA SOLAR TECHNOLOGIES (CANADA) INC.Inventors: Hamidreza Ghoddami, Johnson Kai Chi Wong, Gordon Deans
-
Publication number: 20240288184Abstract: The present invention relates to a clean room module, which includes: a housing defining an accommodation cavity therein and formed with an air inlet and an air outlet; a gas circulation device arranged at the housing, with two ends thereof being connected to the air inlet and the air outlet respectively, the housing and the gas circulation device being both sealed to define a confined space without gas exchange with outside; and a filter arranged in the gas circulation device, wherein the gas in the accommodation cavity is drawn out from the air outlet through the gas circulation device, filtered by the filter, and sent back to the accommodation cavity from the air inlet. The clean room module of the present application can significantly reduce the time required for the accommodation cavity to reach a preset cleanliness after the cleaning function is activated.Type: ApplicationFiled: May 27, 2022Publication date: August 29, 2024Inventors: Ho Chi Wong, Ka Wai Chan, Tak Man Leung, Lap Fung Chan, Fei Long Chen
-
Publication number: 20240243098Abstract: A semiconductor package includes a package substrate, an interposer on and electrically connected to the package substrate, a central logic die disposed on and electrically connected to the interposer, peripheral function dies disposed on and electrically connected to the interposer and located in proximity to the central logic die, and at least one dummy die disposed between the central logic die and the peripheral function dies so as to form a rectangular shaped die arrangement. The at least one dummy die is disposed at a corner position of the rectangular shaped die arrangement.Type: ApplicationFiled: December 17, 2023Publication date: July 18, 2024Applicant: MEDIATEK INC.Inventors: Pei-Haw Tsao, Te-Chi Wong
-
Publication number: 20240194556Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.Type: ApplicationFiled: February 16, 2024Publication date: June 13, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen, Shin-Puu Jeng
-
Publication number: 20240178159Abstract: A coreless substrate package includes a coreless substrate; a package device mounted on a coreless substrate; an underfill material filling into a space between the package device and the coreless substrate; a stiffener ring disposed on a top surface of the coreless substrate along perimeter of the coreless substrate; and a gap fill material disposed in a gap between the stiffener ring and the package device.Type: ApplicationFiled: November 6, 2023Publication date: May 30, 2024Applicant: MEDIATEK INC.Inventors: Pei-Haw Tsao, Te-Chi Wong
-
Patent number: 11908764Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.Type: GrantFiled: August 31, 2021Date of Patent: February 20, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen, Shin-Puu Jeng
-
Publication number: 20230386956Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.Type: ApplicationFiled: August 2, 2023Publication date: November 30, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen, Shin-Puu Jeng
-
Publication number: 20230093929Abstract: This disclosure describes embodiments of systems, methods, and non-transitory computer readable storage media that can display icons for target digital content items and candidate destination folders within different sections of a multi-section graphical user interface (GUI) and adjust a corresponding file storage structure to reflect organization changes indicated by user interactions that move digital-content-items icons into folder icons. For example, the disclosed system can (i) display, within a first section of a multi-section GUI, icons representing digital content items and (ii) display, within a second section of the multi-section GUI, icons representing folders as candidate destination folders. Then, the disclosed systems can detect user interactions that move digital-content-item icons to folder icons and adjust an underlying file storage structure to reflect the organization indicated by the user interaction.Type: ApplicationFiled: September 24, 2021Publication date: March 30, 2023Inventors: Hsuan Chi Wong, Jennifer Lukban, Mahlet Tiruneh, Yuxin Xu
-
Publication number: 20230067914Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.Type: ApplicationFiled: August 31, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen, Shin-Puu Jeng
-
Publication number: 20220412896Abstract: Systems and methods for non-contact characterization of semiconductor devices. Systems may include: an infrared radiation source directing radiation towards the semiconductor device; a radiation directing device positioned proximal the infrared radiation source to direct radiation towards an opposing side of the semiconductor device, the semiconductor device receivable between the radiation directing device and the infrared radiation source; and a radiation detector proximal to the infrared radiation source to sense radiation associated with a plurality of infrared wavebands from the semiconductor device for determining a dopant profile property of the semiconductor device. The sensed radiation may include radiation originating from the infrared radiation source reflected from the semiconductor device. The sensed radiation may include radiation originating from the radiation directing device and emerging from the semiconductor device.Type: ApplicationFiled: December 4, 2020Publication date: December 29, 2022Inventors: Hamidreza GHODDAMI, Johnson Kai Chi WONG, Gordon DEANS
-
Patent number: 9762553Abstract: In embodiments of the present invention improved capabilities are described for managing digital rights management (DRM) protected content sharing in a networked secure collaborative computer data exchange environment through a secure exchange facility managed by an intermediate organizational entity amongst users of a plurality of other organizational entities, wherein computer data content and access rights for the computer data content is shared between a first and second user, the computer data content and access rights for the computer data content are transformed into a DRM protected computer data content through communications with a DRM engine, wherein the DRM engine is selected based on a content type of the computer data content, and the DRM engine is provided by an entity other than the intermediate organizational entity and other than any of the plurality of other organizational entities.Type: GrantFiled: January 12, 2017Date of Patent: September 12, 2017Inventors: Christopher Todd Ford, Visal Chandrakant Acharya, Richard David Anstey, Wasif Qayyum Awan, Amir M. Azmi, Selom Harry Azuma, Wade Michael Callison, Clement Cazalot, Mayank Choudhary, Peter W. Cleary, Benedict Robert Dsilva, Fuat Ertunc, Simon Genzer, John William Giudice, Douglas McLean Gordon, Jonathan Gorin, Mushegh Hakhinian, John Held, Ronald W. Hovsepian, Ganesh Kannan, John Landy, David Scott Lindsay, Dario R. Lirio, Himali Mahajan, Olivier Mangez, Kevin L. McCarthy, Kevin McNulty, Jerry Lee Meyer, Anupam Miharia, Constantin Miroslav, Andrew James Mitchell, Uli P. Mittermaier, Harshal Morparia, Alex Negrea, Yana Nikolayeva, Madhavi Parimi, Matthew A. Porzio, Vedang Shailesh Purohit, Liviu Rozin, Godsway Sappor, Glenn Schwartz, Fahim Siddiqui, Nanu Swamy, Paul Tearnen, Karla Toyloy-Mattera, Sudhakar Velamoor, Margin Vora, Michael Joseph Waluk, Charlie Weiblen, Peter Wenzel, Jeffery Chi Wong, Tony Yip, Khurram Ghafoor
-
Patent number: 9697329Abstract: Various aspects of the invention provide systems and methods for improving the privacy-protection of the exchange of STD's test results and the utility of STD test results. One aspect of the invention provides a computer-implemented method of improving privacy-protection during the exchange of STD test results by preventing the exchange of STD test results if user-definable criteria are not met and deliberately obscuring the cause of prevented attempts at exchanging STD test results. The method includes providing a software application for importing STD test results; inputting criteria; attempting to exchange STD test results; and either preventing or allowing the exchange of STD test results at a plurality of stages. Another aspect of the invention provides a computer-implemented method of improving the utility of STD test results by recommending safe sexual contact practices and sexual health-related products and services based upon the use of algorithms.Type: GrantFiled: August 10, 2015Date of Patent: July 4, 2017Inventor: Michael Wei-Chi Wong
-
Publication number: 20170142076Abstract: In embodiments of the present invention improved capabilities are described for managing digital rights management (DRM) protected content sharing in a networked secure collaborative computer data exchange environment through a secure exchange facility managed by an intermediate organizational entity amongst users of a plurality of other organizational entities, wherein computer data content and access rights for the computer data content is shared between a first and second user, the computer data content and access rights for the computer data content are transformed into a DRM protected computer data content through communications with a DRM engine, wherein the DRM engine is selected based on a content type of the computer data content, and the DRM engine is provided by an entity other than the intermediate organizational entity and other than any of the plurality of other organizational entities.Type: ApplicationFiled: January 12, 2017Publication date: May 18, 2017Inventors: Christopher Todd Ford, Visal Chandrakant Acharya, Richard David Anstey, Wasif Qayyum Awan, Amir M. Azmi, Selom Harry Azuma, Wade Michael Callison, Clement Cazalot, Mayank Choudhary, Peter W. Cleary, Benedict Robert Dsilva, Fuat Ertunc, Simon Genzer, John William Giudice, Douglas McLean Gordon, Jonathan Gorin, Mushegh Hakhinian, John Held, Ronald W. Hovsepian, Ganesh Kannan, John Landy, David Scott Lindsay, Dario R. Lirio, Himali Mahajan, Olivier Mangez, Kevin L. McCarthy, Kevin McNulty, Jerry Lee Meyer, Anupam Miharia, Constantin Miroslav, Andrew James Mitchell, Uli P. Mittermaier, Harshal Morparia, Alex Negrea, Yana Nikolayeva, Madhavi Parimi, Matthew A. Porzio, Vedang Shailesh Purohit, Liviu Rozin, Godsway Sappor, Glenn Schwartz, Fahim Siddiqui, Nanu Swamy, Paul Tearnen, Karla Toyloy-Mattera, Sudhakar Velamoor, Margin Vora, Michael Joseph Waluk, Charlie Weiblen, Peter Wenzel, Jeffrey Chi Wong, Tony Yip, Khurram Ghafoor
-
Patent number: 9613190Abstract: An example method for managing digital rights management (DRM) protected content sharing in a networked secure collaborative computer data exchange environment includes establishing, by a secure exchange facility and managed by an intermediate organizational entity, a procedure that allows a user from a first entity to share access to computer data content with a user from a second entity based on indicated access rights. The method includes transforming the computer data content into DRM protected content, utilizing a DRM engine provided by a separate entity. The method includes granting access to the content to the second user, providing permissioned control to entities utilizing a number of data storage nodes, and managing secure data exchange of the content and metadata, without the secure exchange facility having access to the content. The method includes operations to support content services including data transformation, filtering, analytics, and searching tools for the content.Type: GrantFiled: April 22, 2015Date of Patent: April 4, 2017Assignee: Intralinks, Inc.Inventors: Christopher Todd Ford, Visal Chandrakant Acharya, Richard David Anstey, Wasif Qayyum Awan, Amir M. Azmi, Selom Harry Azuma, Wade Michael Callison, Clement Cazalot, Mayank Choudhary, Peter W. Cleary, Benedict Robert Dsilva, Fuat Ertunc, Simon Genzer, John William Giudice, Douglas McLean Gordon, Jonathan Gorin, Mushegh Hakhinian, John Held, Ronald W. Hovsepian, Ganesh Kannan, John Landy, David Scott Lindsay, Dario R. Lirio, Himali Mahajan, Olivier Mangez, Kevin L. McCarthy, Kevin McNulty, Jerry Lee Meyer, Anupam Miharia, Constantin Miroslav, Andrew James Mitchell, Uli P. Mittermaier, Harshal Morparia, Alex Negrea, Yana Nikolayeva, Madhavi Parimi, Matthew A. Porzio, Vedang Shailesh Purohit, Liviu Rozin, Godsway Sappor, Glenn Schwartz, Fahim Siddiqui, Nanu Swamy, Paul Tearnen, Karla Toyloy-Mattera, Sudhakar Velamoor, Margin Vora, Michael Joseph Waluk, Charlie Weiblen, Peter Wenzel, Jeffery Chi Wong, Tony Yip, Khurram Ghafoor
-
Patent number: 9509104Abstract: A connector assembly is electrically coupled to an electronic device. The connector assembly includes a supporting assembly supporting the electronic device, an adjusting frame, and a connecting element. The adjusting frame is slidably fixed on the supporting assembly. The connecting element is slidably fixed on the adjusting frame and electrically coupled to the electronic device. The connecting element includes a connector and a cable electrically coupled to the connector. The connector includes a plurality of plugs in different sizes and types. When the electronic device is fixed on the supporting assembly, the adjusting frame is slid to the supporting assembly and the connector is rotated to choose one of the plugs to be coupled to the electronic device.Type: GrantFiled: September 22, 2015Date of Patent: November 29, 2016Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shih-Chi Wong, Chien-Hung Lee
-
Publication number: 20160087381Abstract: A connector assembly is electrically coupled to an electronic device. The connector assembly includes a supporting assembly supporting the electronic device, an adjusting frame, and a connecting element. The adjusting frame is slidably fixed on the supporting assembly. The connecting element is slidably fixed on the adjusting frame and electrically coupled to the electronic device. The connecting element includes a connector and a cable electrically coupled to the connector. The connector includes a plurality of plugs in different sizes and types. When the electronic device is fixed on the supporting assembly, the adjusting frame is slid to the supporting assembly and the connector is rotated to choose one of the plugs to be coupled to the electronic device.Type: ApplicationFiled: September 22, 2015Publication date: March 24, 2016Inventors: SHIH-CHI WONG, CHIEN-HUNG LEE
-
Patent number: 9244493Abstract: A charger includes a main body and a keyboard module received in the main body. The main body includes a case, a printed circuit board and a fastening member received in the housing. The fastening member includes two fastening frames formed on two opposite sides of the housing. The keyboard module includes a supporting member, a keyboard assembly, and a flexible circuit board electrically connected with the printed circuit board. The keyboard assembly is disposed on the supporting member. Two opposite sides of one of the two fastening frames and the supporting member respectively define a guiding slot, and two opposite sides of another one of the two fastening frames and the supporting member respectively form a track. The two tracks are separately received in the corresponding guiding slots. The supporting member and the keyboard assembly can slide out from the housing along the tracks.Type: GrantFiled: March 7, 2014Date of Patent: January 26, 2016Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chien-Hung Lee, Shih-Chi Wong
-
Publication number: 20150310188Abstract: In embodiments of the present invention improved capabilities are described for managing digital rights management (DRM) protected content sharing in a networked secure collaborative computer data exchange environment through a secure exchange facility managed by an intermediate organizational entity amongst users of a plurality of other organizational entities, wherein computer data content and access rights for the computer data content is shared between a first and second user, the computer data content and access rights for the computer data content are transformed into a DRM protected computer data content through communications with a DRM engine, wherein the DRM engine is selected based on a content type of the computer data content, and the DRM engine is provided by an entity other than the intermediate organizational entity and other than any of the plurality of other organizational entities.Type: ApplicationFiled: April 22, 2015Publication date: October 29, 2015Inventors: Christopher Todd Ford, Visal Chandrakant Acharya, Richard David Anstey, Wasif Qayyum Awan, Amir M. Azmi, Selom Harry Azuma, Wade Michael Callison, Clement Cazalot, Mayank Choudhary, Peter W. Cleary, Benedict Robert Dsilva, Fuat Ertunc, Simon Genzer, John William Giudice, Douglas McLean Gordon, Jonathan Gorin, Mushegh Hakhinian, John Held, Ronald W. Hovsepian, Ganesh Kannan, John Landy, David Scott Lindsay, Dario R. Lirio, Himali Mahajan, Olivier Mangez, Kevin L. McCarthy, Kevin McNulty, Jerry Lee Meyer, Anupam Miharia, Constantin Miroslav, Andrew James Mitchell, Uli P. Mittermaier, Harshal Morparia, Alex Negrea, Yana Nikolayeva, Madhavi Parimi, Matthew A. Porzio, Vedang Shailesh Purohit, Liviu Rozin, Godsway Sappor, Glenn Schwartz, Fahim Siddiqui, Nanu Swamy, Paul Tearnen, Karla Toyloy-Mattera, Sudhakar Velamoor, Margin Vora, Michael Joseph Waluk, Charlie Weiblen, Peter Wenzel, Jeffrey Chi Wong, Tony Yip, Khurram Ghafoor
-
Publication number: 20150128067Abstract: A system and method for sharing data between devices are provided. A source device detects one or more receiving devices that are operated in a mode to receive data from the source device. The source device detects a user action that signifies intent of a user to transmit data to the one or more receiving devices. In response to detecting the user action, the source device identifies data that is in a state designated to be transmitted. The identified content is transmitted to the one or more receiving devices.Type: ApplicationFiled: November 16, 2011Publication date: May 7, 2015Inventors: Alison Han-Chi Wong, Itai Vonshak, Eric Liu, Stefan Marti, Seung Wook Kim
