Patents by Inventor Chia-Chen Chang

Chia-Chen Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220384247
    Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first isolation structure which has a first corner. The semiconductor device also includes a first well region with a first conductive type. The semiconductor device includes further includes a gate structure over the first well region and covers a portion of the first corner of the first isolation structure. In addition, the semiconductor device includes a first doped region and a second doped region disposed on two opposites of the gate structure. Each of the first doped region and the second doped region has the first conductive type. The semiconductor device also includes a first counter-doped region in the first well region with a second conductive type different from the first conductive type. The first counter-doped region covers the first corner of the first isolation structure.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Inventors: CHIA-CHEN CHANG, YUAN-CHENG YANG, YUN-CHI WU
  • Publication number: 20220384637
    Abstract: A method for making a semiconductor device includes forming a ROX layer on a substrate and a patterned silicon oxynitride layer on the patterned ROX layer; conformally forming a dielectric oxide layer to cover the substrate, the patterned silicon oxynitride layer, and the patterned ROX layer; and fully oxidizing the patterned silicon oxynitride layer to form a fully oxidized gate oxide layer on the substrate.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsu-Hsiu PERNG, Yun-Chi WU, Chia-Chen CHANG, Cheng-Bo SHU, Jyun-Guan JHOU, Pei-Lun WANG
  • Publication number: 20220373731
    Abstract: A light guide plate, a backlight module and a display device are provided. The light guide plate is configured to be coupled to a light source. The light guide plate includes a light-emitting surface, a bottom surface, a light-incident surface, plural stripe-shaped microstructures and plural light guiding microstructures. The bottom surface is opposite to the light-emitting surface. The light-incident surface is connected between the light-emitting surface and the bottom surface. The stripe-shaped microstructures are disposed on the at least one of the light-emitting surface and the bottom surface, and each of the stripe-shaped microstructures has two opposing side surfaces and an active surface. The side surfaces are respectively connected to two opposite sides of the active surface. The light-guiding microstructures are disposed between any adjacent two of the stripe-shaped microstructures and arranged along an extending direction of each of the stripe-shaped microstructures.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 24, 2022
    Inventors: Hao CHEN, Chin-Ting WENG, Chia-Yin CHANG, Feng-Nien TSAI
  • Patent number: 11508843
    Abstract: A method for making a semiconductor device includes forming a ROX layer on a substrate and a patterned silicon oxynitride layer on the patterned ROX layer; conformally forming a dielectric oxide layer to cover the substrate, the patterned silicon oxynitride layer, and the patterned ROX layer; and fully oxidizing the patterned silicon oxynitride layer to form a fully oxidized gate oxide layer on the substrate.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsu-Hsiu Perng, Yun-Chi Wu, Chia-Chen Chang, Cheng-Bo Shu, Jyun-Guan Jhou, Pei-Lun Wang
  • Publication number: 20220361327
    Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.
    Type: Application
    Filed: February 8, 2022
    Publication date: November 10, 2022
    Inventors: CHIA-SHUAI CHANG, CHIEN-CHEN LEE, JUI-HUNG HSU
  • Publication number: 20220359793
    Abstract: A semiconductor device includes a semiconductor layered structure, an electrode unit, and an anti-adsorption layer. The electrode unit is disposed on an electrode connecting region of the semiconductor layered structure, and is a multi-layered structure. The anti-adsorption layer is disposed on a top surface of the electrode unit opposite to the semiconductor layered structure. Also disclosed herein is a light-emitting system including the semiconductor device.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Gong CHEN, Chuan-gui LIU, Ting-yu CHEN, Su-hui LIN, Ling-yuan HONG, Sheng-hsien HSU, Kang-wei PENG, Chia-hung CHANG
  • Publication number: 20220361321
    Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.
    Type: Application
    Filed: January 11, 2022
    Publication date: November 10, 2022
    Inventors: CHIA-SHUAI CHANG, CHIEN-CHEN LEE, YA-HAN CHANG
  • Publication number: 20220360692
    Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 ?m. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.
    Type: Application
    Filed: February 9, 2022
    Publication date: November 10, 2022
    Inventors: CHIA-SHUAI CHANG, CHIEN-CHEN LEE, JUI-HUNG HSU
  • Patent number: 11430918
    Abstract: A semiconductor device includes a semiconductor layered structure, an electrode unit, and an anti-adsorption layer. The electrode unit is disposed on an electrode connecting region of the semiconductor layered structure. The anti-adsorption layer is disposed on a top surface of the electrode unit opposite to the semiconductor layered structure and is electrically connected to the electrode unit. The anti-adsorption layer has an adsorption capacity for at least one of gaseous contaminants and particulate contaminants which is lower than that of the electrode unit. Also disclosed herein is a light-emitting system including the semiconductor device.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: August 30, 2022
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Gong Chen, Chuan-gui Liu, Ting-yu Chen, Su-hui Lin, Ling-yuan Hong, Sheng-hsien Hsu, Kang-wei Peng, Chia-hung Chang
  • Publication number: 20220267906
    Abstract: The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin and surfactants. Activators of the invention are preferably employed for electroless copper deposition.
    Type: Application
    Filed: December 1, 2021
    Publication date: August 25, 2022
    Inventor: Chia-Chen CHANG
  • Patent number: 11405389
    Abstract: A system includes first electronic devices and a digital signature carrier. Each of the first electronic devices has a network identifier distinct from another. The digital signature carrier is configured for recording a connective information list. The connective information list includes the network identifiers of all of the first electronic devices. A second electronic device includes a digital signature reader. The second electronic device is configured to read the digital signature carrier by the digital signature reader, extract the connective information list comprising the network identifiers and pair the second electronic device with each of the first electronic devices according to the network identifiers.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: August 2, 2022
    Assignee: HTC Corporation
    Inventors: Yung-Hsiang Chiu, Chi-Chen Cheng, Chia-Wei Chen, Wei-Chih Chang, Yu-Cheng Lee, Chung-Ying Yeh
  • Patent number: 11384326
    Abstract: A target particle transferring device is disclosed, which comprises: (a) a substrate with a thickness of T and a width of W, having top and bottom portions, the top portion having a top surface and the bottom portion having a bottom surface; (b) a notch structure formed in the bottom portion of the substrate, comprising: a groove with a width of W1, located at a distance oft below the top surface of the substrate, wherein the groove is formed in the bottom portion from the bottom surface extending toward the top portion; and (c) a target substrate portion with a width of W2 and a thickness of T, located in the top and bottom portions of the substrate and being surrounded by the groove. Methods of transferring a target particle from one device to another is also disclosed.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: July 12, 2022
    Assignee: NATIONAL HEALTH RESEARCH INSTITUTES
    Inventors: Chia-Hsien S. Hsu, Ching-Hui Lin, Duane S. Juang, Hao-Chen Chang
  • Publication number: 20220216300
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a pair of source/drain features formed in a semiconductor substrate and a gate stack formed over a portion of the semiconductor substrate that is between the pair of source/drain features. The semiconductor device structure also includes gate spacers extend along opposing sidewalls of the gate stack and protrude above an upper surface of the gate stack. Additionally, the semiconductor device structure includes a first capping layer formed over the gate stack and spaced apart from the upper surface of the gate stack by a gap. Opposing sidewalls of the first capping layer are covered by portions of the gate spacers that protrude above the upper surface of the gate stack.
    Type: Application
    Filed: March 22, 2022
    Publication date: July 7, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tien-Lu LIN, Che-Chen WU, Chia-Lin CHUANG, Yu-Ming LIN, Chia-Hao CHANG
  • Patent number: 11378894
    Abstract: The present disclosure provides a lithography system. The lithography system includes an exposing module configured to perform a lithography exposing process using a mask secured on a mask stage; and a cleaning module integrated in the exposing module and designed to clean at least one of the mask and the mask stage using an attraction mechanism.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: July 5, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shang-Chieh Chien, Jeng-Horng Chen, Jui-Ching Wu, Chia-Chen Chen, Hung-Chang Hsieh, Chi-Lun Lu, Chia-Hao Yu, Shih-Ming Chang, Anthony Yen
  • Patent number: 11378767
    Abstract: A lens adjusting mechanism includes a light-valve case, a lens case, one fastener, and a leaf spring assembly. The light-valve case has an emitting opening and a first opening edge, disposed on the peripheral portion of the emitting opening. The lens case has a light-path entrance and a light-path exit. The lens case also has a second opening edge. The second opening edge is disposed on the peripheral portion of the light-path entrance. The fastener is connected between the first opening edge and the second opening edge. The leaf spring assembly has at least one leaf contact. The leaf spring assembly is disposed between the first opening edge and the second opening edge. The leaf contact contacts the first opening edge or the second opening edge. The fastener is used to adjust the distance between the first opening edge and the second opening edge.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: July 5, 2022
    Assignee: Young Optics Inc.
    Inventors: Yu-Chen Chang, Chia-Chang Lee
  • Publication number: 20220209218
    Abstract: A negative electrode and a lithium ion battery employing the same are provided. The negative electrode includes an active layer and a composite layer disposed on the active layer. The composite layer includes a lithiophilic nanoparticle, a metal nanoparticle and a binder. The binding energy (?E) of the lithiophilic nanoparticle with lithium is less than or equal to ?2.5 eV. The metal nanoparticle has a standard Gibbs free energy of reaction (?rG) less than 0. The weight ratio of the lithiophilic nanoparticle to the metal nanoparticle is from 1:1 to 8:1, and the amount of binder is from 10 wt % to 25 wt %, based on the total weight of the lithiophilic nanoparticle and the metal nanoparticle.
    Type: Application
    Filed: December 7, 2021
    Publication date: June 30, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Hsin WU, Chih-Ching CHANG, Chia-Chen FANG
  • Publication number: 20210199733
    Abstract: A method of detecting a biological sample includes the following steps. A magnetic sensor chip is provided, wherein the magnetic sensor chip includes a substrate and a magnetic sensing layer located on the substrate. Probes are connected to the magnetic sensor chip. A sample solution containing biological samples labeled with a first marker is provided on the magnetic sensor chip, so that the biological samples labeled with the first marker are hybridized with the probes. Magnetic beads labeled with a second marker are provided on the magnetic sensor chip, so that the magnetic beads labeled with the second marker are bound onto the biological samples labeled with the first marker. A signal sensed by the magnetic sensing layer is detected by a magnetic sensor.
    Type: Application
    Filed: December 29, 2020
    Publication date: July 1, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Tai Chen, Shih-Ya Chen, Yi-Chen Liu, Ching-Fang Lu, Chia-Chen Chang, Erh-Fang Lee
  • Patent number: 10997691
    Abstract: The present application discloses a method of interpolating an image including a pixel array formed of multiple pixels. The method includes: determining a position of an interpolation point relative to the pixel array; determining weights of an edge direction of the pixel array at the position of the interpolation point in a plurality of preset edge directions based on pixel values of a plurality of pixels adjacent to the interpolation point; selecting, for each preset edge direction, one or more corresponding pixel sub-arrays covering the interpolation point from the pixel array to calculate an interpolation pixel value of the interpolation point; calculating a weighted interpolation pixel value of the interpolation point based on the weights of the edge direction of the pixel array at the position of the interpolation point in the preset edge directions and the interpolation pixel value of the interpolation point corresponding to each preset edge direction.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: May 4, 2021
    Assignee: MONTAGE LZ TECHNOLOGIES (CHENGDU) CO., LTD.
    Inventors: Mengchi He, Binxuan Sun, Ke Wu, Chia Chen Chang
  • Patent number: 10848007
    Abstract: A battery includes a housing, and a wireless energy extracting device installed in the housing. The wireless energy extracting device includes: an RF generator module for wirelessly receiving an RF charging signal to generate electrical energy; a capacitor module; and an energy management module coupled to the RF generator module and the capacitor module, adapted to be coupled further to an energy consuming device, and performing electrical energy transfer from at least the RF generator module to at least the energy consuming device. Therefore, the battery has relatively low electrical energy loss and thus relatively high energy usage efficiency, and can be charged even if the battery is installed in the energy consuming device.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: November 24, 2020
    Assignee: TLHM CO., LTD.
    Inventors: Nai-Chen Wang, Yong-Keong Tay, Chia-Chen Chang
  • Patent number: 10680468
    Abstract: A wireless energy extracting device includes: a radio frequency (RF) generator module for wirelessly receiving an RF charging signal to generate electrical energy; a capacitor module; and an energy management module coupled to the RF generator module and the capacitor module, and used to be coupled further to an energy consuming device. The energy management module performs electrical energy transfer from at least the RF generator module to at least the energy consuming device. Therefore, the wireless energy extracting device has relatively low electrical energy loss and thus relatively high energy usage efficiency.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 9, 2020
    Assignee: TLHM CO., LTD.
    Inventors: Nai-Chen Wang, Yong-Keong Tay, Chia-Chen Chang