Abstract: A memory card connector includes a lower dielectric housing part having a terminal-mounting base and a pair of side wall sections extending forwardly from opposite sides of the base. An upper dielectric housing part is mounted on top of the lower housing part and has a terminal-mounting roof. A card locating plate is connected at opposite sides thereof to the side wall sections of the lower housing part and combines therewith to define a first card-receiving space beneath the plate. The card locating plate is spaced from the roof of the upper housing part and combines therewith to define a second card-receiving space above the plate.

Abstract: A memory card connector includes an insulative housing which at least in part defines a card-receiving space for the insertion thereinto of a memory card. A cover is positioned over at least a part of the housing. A card eject mechanism is mounted on the housing and includes a slide member movable with the memory card in an insertion/ejection direction. The cover has a guide track and the slide member has a track follower to guide and stabilize the movement of the slide member in the insertion/ejection direction.

Abstract: A memory card connector includes a dielectric housing having a terminal-mounting base and a pair of side wall sections extending forwardly from opposite sides of the base. A card locating plate is connected at opposite sides thereof to the side wall sections of the housing and combine therewith to define a card-receiving space beneath the plate. A prevention element is provided on the card locating plate for preventing a memory card from being inserted into the card-receiving space in an incorrect orientation of the card.

Abstract: A memory card connector includes an insulative housing having a rear terminal-mounting section and at least one side wall section extending forwardly from one end of the rear section and defining a card-receiving space therebetween. First and second switch terminals are mounted on the housing and have first and second contact portions, respectively. A third switch terminal is mounted on the housing and has a pair of third contact portions engageable by the first and second contact portions of the first and second switch terminals, respectively, in response to inserting a memory card into the card-receiving space. The third switch terminal includes an elongated base having opposite ends, with at least the opposite ends of the base fixed to the housing. A pair of contact spring arms are cantilevered from the opposite ends of the base, whereby the opposite ends form a pair of fulcrums for flexing of the contact spring arms. Free ends of the arms form the third contact portions of the third switch terminal.

Abstract: A memory card connector includes an insulative housing having a rear terminal-mounting section and at least one side wall section extending forwardly from one end of the rear section defining a card-receiving space therebetween. A first switch terminal is mounted on the housing and has a first contact portion at the card-receiving space. A second switch terminal is mounted on the housing and has a second contact portion at the card-receiving space. A third switch terminal is mounted on the housing and has a pair of third contact portions engageable by the first and second contact portions of the first and second switch terminals, respectively, in response to inserting a memory card into the card-receiving space. The third switch terminal is a generally planar plate-like member. The third switch terminal includes a central body portion and a pair of connecting arms projecting from opposite sides of the central body portion.

Abstract: A cleaner and method for removing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: A memory card connector has a cavity for receiving a memory card. An insulative housing includes a rear terminal-mounting section at the rear of the cavity and which mounts a plurality of connector terminals. The terminals have forwardly extending contact portions for engaging appropriate contacts on the memory card. The housing has a base forwardly of the rear terminal-mounting section. The base has a baffle surface located between a pair of the forwardly extending contact portions. A first switch terminal is mounted on the housing and has a contact portion near the rear of the cavity. A second switch terminal is mounted on the housing and has a flexible contact arm engageable by the memory card and movable by the card into engagement with the contact portion of the first switch terminal. The flexible contact arm has a depending baffle projection engageable with the baffle surface on the base of the housing for locating the flexible contact arm.

Abstract: An ejection mechanism for an electronic card connector, wherein the electronic card connector includes an insulative housing for receiving an electronic card, and the ejection mechanism includes a slider slidably mounted on an arm portion of the insulative housing, a support portion extending from the arm portion of the insulative housing, a lock arm fixed at one end to the slider, wherein the lock arm includes a retention portion for engaging a corresponding slot of the electronic card during insertion and ejection of the card, and a horizontal portion supported on the support portion, whereby it can securely retain the electronic card during card insertion, yet allow easy removal of the electronic card during ejection.

Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: An ejection mechanism for an electronic card connector, wherein the electronic card connector includes an insulative housing for receiving an electronic card, and the ejection mechanism includes a slider slidably mounted on an arm portion of the insulative housing, a support portion extending from the arm portion of the insulative housing, a lock arm fixed at one end to the slider, wherein the lock arm includes a retention portion for engaging a corresponding slot of the electronic card during insertion and ejection of the card, and a horizontal portion supported on the support portion, whereby it can securely retain the electronic card during card insertion, yet allow easy removal of the electronic card during ejection.

Abstract: A new optical sensing device containing fiber Bragg gratings, a scanning bandpass filter, an interferometer and multiple photodetectors is disclosed. The present invention also describes a new system and method for fibre Bragg grating (FBG) sensor interrogation and multiplexing. The new system combines a scanning Fabry-Perot (SFP) bandpass filter used to wavelength-multiplex multiple gratings in a single fiber, and an unbalanced Mach-Zehnder fibre interferometer made with a 3×3 coupler to detect strain-induced wavelength shifts. A passive technique for interferometer drift compensation using non-sensing FBGs is included in the system. A complete prototype system interrogates four gratings in a single fiber at a Nyquist sampling rate up to 10 kHz, with a noise floor measured near 4 n&egr; Hz−1/2 above 0.1 Hz. The inclusion of the interferometer drift compensation technique is shown to make quasi-static measurements feasible.

Abstract: Purge bars for blowing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: A bandwidth tunable fiber Bragg grating (FBG) device performs tuning in an optical transmission circuit by placing a grating in a compliant material, which is transversely loaded to create longitudinal strain through the Poisson effect of materials. Careful application of various load magnitudes along the length of the grating through the compliant material creates a strain gradient along the length of the grating, which chirps the grating thus resulting in altering the bandwidth of the grating. Tuning the grating bandwidth results, effectively, in tuning the dispersion of light being reflected off the grating. Insertion of such a device in the optical link allows for dynamic dispersion compensation in the link. The ability of the device to ‘dial-in’ a desired amount of dispersion is what makes it valuable.

Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

Abstract: A photo sensing device uses surface-emitting LED as light emitter to increase responsive of light receiver and prevent the short circuit of connection wires, and the manufacturing method thereof. The light emitter is directly mounted on top front surface of an encapsulating epoxy enclosing a light receiver. The light emitted from backside of the light emitter passes through the encapsulating epoxy and is directly absorbed by the light receiver. The response is enhanced as compared with prior art.

Abstract: The invention was originally developed to determine the strain-relief capability of a fusion splice protector as well as the compressive stress imparted to a fusion splice by the splice protector. The invention also permits performance and comparative analyses of splice protectors as well as any package in which the optical fiber is at least partially disposed. To those ends a fiber Bragg grating (FBG) is axially arranged relative to the package such that a free or reference section of the FBG protrudes from the package while a shielded section lies within the package. Broadband light is supplied to the FBG which reflects certain wavelengths that are measured by an optical spectrum analyzer. The FBG reflected spectra will be split into two peaks as the reference and shielded sections experience different amounts or types of stress thereby providing a powerful analysis tool.

Abstract: A new optical sensing device containing fiber Bragg gratings, a scanning bandpass filter, an interferometer and multiple photodetectors is disclosed. The present invention also describes a new system and method for fibre Bragg grating (FBG) sensor interrogation and multiplexing. The new system combines a scanning Fabry-Perot (SFP) bandpass filter used to wavelength-multiplex multiple gratings in a single fiber, and an unbalanced Mach-Zehnder fibre interferometer made with a 3×3 coupler to detect strain-induced wavelength shifts. A passive technique for interferometer drift compensation using non-sensing FBGs is included in the system. A complete prototype system interrogates four gratings in a single fiber at a Nyquist sampling rate up to 10 kHz, with a noise floor measured near 4 n&egr; Hz−½ above 0.1 Hz. The inclusion of the interferometer drift compensation technique is shown to make quasi-static measurements feasible.

Abstract: The invention was originally developed to determine the strain-relief capability of a fusion splice protector as well as the compressive stress imparted to a fusion splice by the splice protector. The invention also permits performance and comparative analyses of splice protectors as well as any package in which the optical fiber is at least partially disposed. To those ends a fiber Bragg grating (FBG) is axially arranged relative to the package such that a free or reference section of the FBG protrudes from the package while a shielded section lies within the package. Broadband light is supplied to the FBG which reflects certain wavelengths that are measured by an optical spectrum analyzer. The FBG reflected spectra will be split into two peaks as the reference and shielded sections experience different amounts or types of stress thereby providing a powerful analysis tool.