Abstract: A projection apparatus is provided, including a lens module, a movement element, a sensing element, and a lens control element. When the lens module moves to the origin position, the lens control element controls an image beam to focus on a first position on a reference plane in one of the tele mode and the wide mode, the lens control element controls the image beam to focus on a second position on the reference plane in the other mode, and the lens control element determines whether there is an offset between the first position and the second position. When the offset exists, the lens control element adjusts a movement parameter value of the movement element based on the offset value between the first position and the second position, so that the image beam is focused on the same position on the reference plane in the tele mode and wide mode.

Abstract: A method is provided for fabricating a semiconductor wafer having a device side, a back side opposite the device side and an outer periphery edge. Suitably, the method includes: forming a top conducting layer on the device side of the semiconductor wafer; forming a passivation layer over the top conducting layer, the passivation layer being formed so as not to extend to the outer periphery edge of the semiconductor wafer; and forming a protective layer over the passivation layer, the protective layer being spin coated over the passivation layer so as to have a smooth top surface at least in a region proximate to the outer periphery edge of the semiconductor wafer.

Abstract: A projection apparatus is provided, including a lens module, a movement element, a sensing element, and a lens control element. When the lens module moves to the origin position, the lens control element controls an image beam to focus on a first position on a reference plane in one of the tele mode and the wide mode, the lens control element controls the image beam to focus on a second position on the reference plane in the other mode, and the lens control element determines whether there is an offset between the first position and the second position. When the offset exists, the lens control element adjusts a movement parameter value of the movement element based on the offset value between the first position and the second position, so that the image beam is focused on the same position on the reference plane in the tele mode and wide mode.

Abstract: A method for making a semiconductor device is disclosed. A substrate comprising semiconductor device elements is provided. A top conductive pad and an anti-reflective coating are patterned over the substrate. The anti-reflective coating is disposed on the top conductive pad. At least one passivation film is formed over the substrate and the anti-reflective coating. The at least one passivation film and the anti-reflective coating are etched to form a trench therein so as to expose a portion of the top conductive pad.

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

Abstract: A method for making a semiconductor device is disclosed. A substrate comprising semiconductor device elements is provided. A top conductive pad and an anti-reflective coating are patterned over the substrate. The anti-reflective coating is disposed on the top conductive pad. At least one passivation film is formed over the substrate and the anti-reflective coating. The at least one passivation film and the anti-reflective coating are etched to form a trench therein so as to expose a portion of the top conductive pad.

Abstract: In some embodiments, a maintenance apparatus is provided for maintaining semiconductor processing equipment. The maintenance apparatus has an articulated member having a first member with a handle engagement portion and a second member with a first tool engagement portion. The first member is rotationally coupled to the first member about an articulation axis. A first tool member in selective engagement with the first tool engagement portion of the second member.

Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a second substrate over a first substrate, and a cavity is formed between the first substrate and the second substrate. The method includes forming a hole through the second substrate using an etching process, and the hole is connected to the cavity. The etching process includes a plurality of etching cycles, and each of the etching cycles includes an etching step, and the etching step has a first stage and a second stage. The etching time of each of the etching steps during the second stage is gradually increased as the number of etching cycles is increased.

Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a second substrate over a first substrate, and a cavity is formed between the first substrate and the second substrate. The method includes forming a hole through the second substrate using an etching process, and the hole is connected to the cavity. The etching process includes a plurality of etching cycles, and each of the etching cycles includes an etching step, and the etching step has a first stage and a second stage. The etching time of each of the etching steps during the second stage is gradually increased as the number of etching cycles is increased.

Abstract: In some embodiments, a maintenance apparatus is provided for maintaining semiconductor processing equipment. The maintenance apparatus has an articulated member having a first member with a handle engagement portion and a second member with a first tool engagement portion. The first member is rotationally coupled to the first member about an articulation axis. A first tool member in selective engagement with the first tool engagement portion of the second member.

Abstract: A projection screen includes a flexible substrate, a reflective layer and a transparent coating layer. The flexible substrate has a first surface and a second surface opposite to each other. The reflective layer is disposed on the first surface of the flexible substrate. The transparent coating layer is coated on the reflective layer, and the transparent coating layer has a pattern on a surface opposite to the reflective layer. Moreover, a manufacturing method of the projection screen is also provided.

Abstract: A projection screen includes a flexible substrate, a reflective layer and a transparent coating layer. The flexible substrate has a first surface and a second surface opposite to each other. The reflective layer is disposed on the first surface of the flexible substrate. The transparent coating layer is coated on the reflective layer, and the transparent coating layer has a pattern on a surface opposite to the reflective layer. Moreover, a manufacturing method of the projection screen is also provided.

Abstract: A method of fabricating a semiconductor device is illustrated. A substrate having a plurality of trenches is provided. The plurality of trenches include trenches having differing widths. A first layer is formed on the substrate including in the plurality of trenches. Forming the first layer creates an indentation in the first layer in a region overlying a trench (e.g., wide trench). A second layer is formed in the indentation. The first layer is etched while the second layer remains in the indentation. The second layer may protect the region of indentation from further reduction in thickness. In an embodiment, the first layer is polysilicon and the second layer is BARC of photoresist.

Abstract: A device housing includes first and second cases, a first magnetically sensitive positioning pin, and a first compressible member. The first case has a first protruding block having a first positioning hole. The second case has a first groove having a second positioning hole. When the first protruding block is disposed in the first groove, the first positioning hole is aligned with the second positioning hole. The first magnetically sensitive positioning pin runs through the first and second positioning holes to position the second case on the first case. The first compressible member is disposed in the first positioning hole and between an inner wall of the first positioning hole and the first magnetically sensitive positioning pin. When a first magnetic force acts on the first magnetically sensitive positioning pin, the first magnetically sensitive positioning pin compresses the first compressible member and moves away from the second positioning hole.

Abstract: A device housing includes first and second cases, a first magnetically sensitive positioning pin, and a first compressible member. The first case has a first protruding block having a first positioning hole. The second case has a first groove having a second positioning hole. When the first protruding block is disposed in the first groove, the first positioning hole is aligned with the second positioning hole. The first magnetically sensitive positioning pin runs through the first and second positioning holes to position the second case on the first case. The first compressible member is disposed in the first positioning hole and between an inner wall of the first positioning hole and the first magnetically sensitive positioning pin. When a first magnetic force acts on the first magnetically sensitive positioning pin, the first magnetically sensitive positioning pin compresses the first compressible member and moves away from the second positioning hole.