Patents by Inventor Chia-Chi Chung

Chia-Chi Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220308428
    Abstract: A projection apparatus is provided, including a lens module, a movement element, a sensing element, and a lens control element. When the lens module moves to the origin position, the lens control element controls an image beam to focus on a first position on a reference plane in one of the tele mode and the wide mode, the lens control element controls the image beam to focus on a second position on the reference plane in the other mode, and the lens control element determines whether there is an offset between the first position and the second position. When the offset exists, the lens control element adjusts a movement parameter value of the movement element based on the offset value between the first position and the second position, so that the image beam is focused on the same position on the reference plane in the tele mode and wide mode.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 29, 2022
    Applicant: Coretronic Corporation
    Inventors: Chia-Cheng Wu, Chia-Chi Chung
  • Patent number: 10964653
    Abstract: A method for making a semiconductor device is disclosed. A substrate comprising semiconductor device elements is provided. A top conductive pad and an anti-reflective coating are patterned over the substrate. The anti-reflective coating is disposed on the top conductive pad. At least one passivation film is formed over the substrate and the anti-reflective coating. The at least one passivation film and the anti-reflective coating are etched to form a trench therein so as to expose a portion of the top conductive pad.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ya-Ping Su, Han-Wen Fung, Chia-Chi Chung, Chih-Hsien Hsu, Chun Yan Chen, Chien-Sheng Wu, Tien-Chih Huang, Wei-Da Chen, Chien-Hua Tseng
  • Patent number: 10739682
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: August 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu
  • Publication number: 20200089120
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu
  • Patent number: 10509323
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu
  • Publication number: 20190250513
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu
  • Patent number: 10295909
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: May 21, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu
  • Publication number: 20190094697
    Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.
    Type: Application
    Filed: February 23, 2018
    Publication date: March 28, 2019
    Inventors: Ying-Hao Wang, Chia-Chi Chung, Han-Chih Chung, Yu-Xiang Lin, Yu-Shine Lin, Yu-Hen Wu, Han Wen Hsu
  • Publication number: 20190096831
    Abstract: A method for making a semiconductor device is disclosed. A substrate comprising semiconductor device elements is provided. A top conductive pad and an anti-reflective coating are patterned over the substrate. The anti-reflective coating is disposed on the top conductive pad. At least one passivation film is formed over the substrate and the anti-reflective coating. The at least one passivation film and the anti-reflective coating are etched to form a trench therein so as to expose a portion of the top conductive pad.
    Type: Application
    Filed: June 8, 2018
    Publication date: March 28, 2019
    Inventors: Ya-Ping Su, Han-Wen Fung, Chia-Chi Chung, Chih-Hsien Hsu, Chun Yan Chen, Chien-Sheng Wu, Tien-Chih Huang, Wei-Da Chen, Chien-Hua Tseng
  • Patent number: 10155305
    Abstract: In some embodiments, a maintenance apparatus is provided for maintaining semiconductor processing equipment. The maintenance apparatus has an articulated member having a first member with a handle engagement portion and a second member with a first tool engagement portion. The first member is rotationally coupled to the first member about an articulation axis. A first tool member in selective engagement with the first tool engagement portion of the second member.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: December 18, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Huan-Lisng Tzeng, Chia-Chi Chung, Kuo-Yen Chang
  • Patent number: 10131539
    Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a second substrate over a first substrate, and a cavity is formed between the first substrate and the second substrate. The method includes forming a hole through the second substrate using an etching process, and the hole is connected to the cavity. The etching process includes a plurality of etching cycles, and each of the etching cycles includes an etching step, and the etching step has a first stage and a second stage. The etching time of each of the etching steps during the second stage is gradually increased as the number of etching cycles is increased.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: November 20, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chin-Han Meng, Chih-Hsien Hsu, Chia-Chi Chung, Yu-Pei Chiang, Wen-Chih Chen, Chen-Huang Huang, Zhi-Sheng Xu, Jr-Sheng Chen, Kuo-Chin Liu, Lin-Ching Huang
  • Publication number: 20180148324
    Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a second substrate over a first substrate, and a cavity is formed between the first substrate and the second substrate. The method includes forming a hole through the second substrate using an etching process, and the hole is connected to the cavity. The etching process includes a plurality of etching cycles, and each of the etching cycles includes an etching step, and the etching step has a first stage and a second stage. The etching time of each of the etching steps during the second stage is gradually increased as the number of etching cycles is increased.
    Type: Application
    Filed: October 5, 2017
    Publication date: May 31, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Han MENG, Chih-Hsien HSU, Chia-Chi CHUNG, Yu-Pei CHIANG, Wen-Chih CHEN, Chen-Huang HUANG, Zhi-Sheng XU, Jr-Sheng CHEN, Kuo-Chin LIU, Lin-Ching HUANG
  • Publication number: 20170282347
    Abstract: In some embodiments, a maintenance apparatus is provided for maintaining semiconductor processing equipment. The maintenance apparatus has an articulated member having a first member with a handle engagement portion and a second member with a first tool engagement portion. The first member is rotationally coupled to the first member about an articulation axis. A first tool member in selective engagement with the first tool engagement portion of the second member.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 5, 2017
    Inventors: Huan-Lisng Tzeng, Chia-Chi Chung, Kuo-Yen Chang
  • Patent number: 9720312
    Abstract: A projection screen includes a flexible substrate, a reflective layer and a transparent coating layer. The flexible substrate has a first surface and a second surface opposite to each other. The reflective layer is disposed on the first surface of the flexible substrate. The transparent coating layer is coated on the reflective layer, and the transparent coating layer has a pattern on a surface opposite to the reflective layer. Moreover, a manufacturing method of the projection screen is also provided.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: August 1, 2017
    Assignee: Coretronic Corporation
    Inventors: Fang-Hsuan Su, Chia-Chi Chung, Kai-Li Chen
  • Publication number: 20160004150
    Abstract: A projection screen includes a flexible substrate, a reflective layer and a transparent coating layer. The flexible substrate has a first surface and a second surface opposite to each other. The reflective layer is disposed on the first surface of the flexible substrate. The transparent coating layer is coated on the reflective layer, and the transparent coating layer has a pattern on a surface opposite to the reflective layer. Moreover, a manufacturing method of the projection screen is also provided.
    Type: Application
    Filed: December 17, 2014
    Publication date: January 7, 2016
    Applicant: Coretronic Corporation
    Inventors: Fang-Hsuan Su, Chia-Chi Chung, Kai-Li Chen
  • Patent number: 8673788
    Abstract: A method of fabricating a semiconductor device is illustrated. A substrate having a plurality of trenches is provided. The plurality of trenches include trenches having differing widths. A first layer is formed on the substrate including in the plurality of trenches. Forming the first layer creates an indentation in the first layer in a region overlying a trench (e.g., wide trench). A second layer is formed in the indentation. The first layer is etched while the second layer remains in the indentation. The second layer may protect the region of indentation from further reduction in thickness. In an embodiment, the first layer is polysilicon and the second layer is BARC of photoresist.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: March 18, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hsiu Cheng, Shih-Hao Wu, Chih-Hsien Hsu, Chia-Chi Chung, Wei-Yueh Tseng
  • Patent number: 8523396
    Abstract: A device housing includes first and second cases, a first magnetically sensitive positioning pin, and a first compressible member. The first case has a first protruding block having a first positioning hole. The second case has a first groove having a second positioning hole. When the first protruding block is disposed in the first groove, the first positioning hole is aligned with the second positioning hole. The first magnetically sensitive positioning pin runs through the first and second positioning holes to position the second case on the first case. The first compressible member is disposed in the first positioning hole and between an inner wall of the first positioning hole and the first magnetically sensitive positioning pin. When a first magnetic force acts on the first magnetically sensitive positioning pin, the first magnetically sensitive positioning pin compresses the first compressible member and moves away from the second positioning hole.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: September 3, 2013
    Assignee: Coretronic Corporation
    Inventor: Chia-Chi Chung
  • Publication number: 20120133252
    Abstract: A device housing includes first and second cases, a first magnetically sensitive positioning pin, and a first compressible member. The first case has a first protruding block having a first positioning hole. The second case has a first groove having a second positioning hole. When the first protruding block is disposed in the first groove, the first positioning hole is aligned with the second positioning hole. The first magnetically sensitive positioning pin runs through the first and second positioning holes to position the second case on the first case. The first compressible member is disposed in the first positioning hole and between an inner wall of the first positioning hole and the first magnetically sensitive positioning pin. When a first magnetic force acts on the first magnetically sensitive positioning pin, the first magnetically sensitive positioning pin compresses the first compressible member and moves away from the second positioning hole.
    Type: Application
    Filed: August 18, 2011
    Publication date: May 31, 2012
    Applicant: CORETRONIC CORPORATION
    Inventor: Chia-Chi Chung
  • Patent number: 8124537
    Abstract: A method is disclosed for etching an integrated circuit structure within a trench. A layer to be etched is applied over the structure and within the trench. A CF-based polymer is deposited over the layer to be etched followed by deposition of a capping layer of SiOCl-based polymer. The CF-based polymer reduces the width of the trench to such an extent that little or no SiOCl-based polymer is deposited at the bottom of the trench. An O2 plasma etch is performed to etch through the CF-based polymer at the bottom of the trench. The O2 plasma etch has little effect on the SiOCl-based polymer, the thus the upper surfaces of the structure remain covered with polymer. Thus, these upper surfaces remain fully protected during subsequent etching of the layer to be etched.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: February 28, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Hung Lee, Chia-Chi Chung, Hsin-Chih Chen, Jeff J. Xu, Neng-Kuo Chen
  • Publication number: 20120028468
    Abstract: A method of fabricating a semiconductor device is illustrated. A substrate having a plurality of trenches is provided. The plurality of trenches include trenches having differing widths. A first layer is formed on the substrate including in the plurality of trenches. Forming the first layer creates an indentation in the first layer in a region overlying a trench (e.g., wide trench). A second layer is formed in the indentation. The first layer is etched while the second layer remains in the indentation. The second layer may protect the region of indentation from further reduction in thickness. In an embodiment, the first layer is polysilicon and the second layer is BARC of photoresist.
    Type: Application
    Filed: July 28, 2010
    Publication date: February 2, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Hsiu Cheng, Shih-Hao Wu, Chih-Hsien Hsu, Chia-Chi Chung, Wei-Yueh Tseng