Patents by Inventor Chia-Chi Ho
Chia-Chi Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11901618Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.Type: GrantFiled: September 6, 2022Date of Patent: February 13, 2024Assignee: INNOLUX CORPORATIONInventors: Chia-Ping Tseng, Ker-Yih Kao, Chia-Chi Ho, Ming-Yen Weng, Hung-I Tseng, Shu-Ling Wu, Huei-Ying Chen
-
Patent number: 11817388Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.Type: GrantFiled: June 28, 2022Date of Patent: November 14, 2023Assignee: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Publication number: 20230282969Abstract: An electronic device is provided. The electronic device includes a substrate, a conductive layer, an insulating layer, and a modulating material. The conductive layer is disposed on the substrate and has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. The modulating material is disposed on the insulating layer.Type: ApplicationFiled: May 11, 2023Publication date: September 7, 2023Inventors: Yi-Hung LIN, Tang-Chin HUNG, Chia-Chi HO, I-Yin LI
-
Publication number: 20230246037Abstract: An electronic device including a substrate, a conductive layer, a first driving component, and an electronic component is provided. The conductive layer is disposed on the substrate. A thickness of the conductive layer is between 0.5 ?m and 12 ?m. The first driving component is disposed on the conductive layer. The electronic component is disposed on the substrate and electrically connected to the first driving component.Type: ApplicationFiled: January 11, 2023Publication date: August 3, 2023Applicant: Innolux CorporationInventors: Chia-Ping Tseng, Chia-Chi Ho
-
Patent number: 11688934Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.Type: GrantFiled: August 31, 2021Date of Patent: June 27, 2023Assignee: INNOLUX CORPORATIONInventors: Yi-Hung Lin, Tang-Chin Hung, Chia-Chi Ho, I-Yin Li
-
Publication number: 20230187594Abstract: The disclosure provides an electronic device including a substrate, at least one conductive composite structure, and an electronic element. The at least one conductive composite structure is disposed on the substrate. The at least one conductive composite structure includes a first metal layer, a second metal layer, and a third metal layer. The second metal layer is located between the first metal layer and the third metal layer, and the thickness of the second metal layer ranges from 0.5 ?m to 12 ?m. The electronic element is disposed on the at least one conductive composite structure and bonded to the at least one conductive composite structure.Type: ApplicationFiled: November 21, 2022Publication date: June 15, 2023Applicant: Innolux CorporationInventors: Chia-Ping Tseng, Chia-Chi Ho
-
Publication number: 20230170603Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.Type: ApplicationFiled: October 27, 2022Publication date: June 1, 2023Applicant: Innolux CorporationInventors: Chung-Chun Cheng, Chia-Chi Ho, Chia-Ping Tseng, Yan-Zheng Wu, Yao-Wen Hsu
-
Publication number: 20230131442Abstract: An electronic device includes a substrate, a driving element, a conductive layer, and an electronic element is provided. The driving element is disposed on the substrate. The conductive layer is disposed on the substrate, wherein there is a first distance (B) between the driving element and an edge of the conductive layer. The electronic element is disposed on the conductive layer and is electrically connected to the driving element, wherein there is a second distance (A) between the electronic element and the edge of the conductive layer, and the first distance (B) is greater than the second distance (A).Type: ApplicationFiled: September 30, 2022Publication date: April 27, 2023Applicant: Innolux CorporationInventors: Yi-Hung Lin, Hsiu-Yi Tsai, Chia-Ping Tseng, Chia-Chi Ho
-
Publication number: 20230084360Abstract: An electronic device includes a substrate, a bump, a chip, and an adhesive layer. The substrate includes a first connection pad. The bump is disposed on the first connection pad. The chip includes a second connection pad. The bump is disposed between the first connection pad and the second connection pad. The adhesive layer is disposed between the substrate and the chip. A dissipation factor of the adhesive layer is less than or equal to 0.01 at a frequency of 10 GHz. A manufacturing method of an electronic device includes the following: providing a substrate, where the substrate includes a first connection pad; applying an adhesive layer on the substrate; patterning the adhesive layer, such that the adhesive layer produces an opening exposing the first connection pad; forming a bump on the first connection pad; and bonding the chip onto the bump through the second connection pad.Type: ApplicationFiled: August 16, 2022Publication date: March 16, 2023Applicant: Innolux CorporationInventors: Jen-Hai Chi, Chia-Chi Ho
-
Patent number: 11592912Abstract: Clickpad structures may be attached to surfaces of an information handling system using material stacks comprising an elastic material, such as a sponge, which can preload a force on the clickpad surface. The preloaded force reduces a gap between the clickpad switch and contact point, which reduces instability, rattling, and other negative experiences with the clickpad surface experienced by a user. According to an embodiment, an input device for an information handling system includes a clickpad surface having a first side configured to receive user input and a second side opposite the first side; a first coupling stack comprising a first elastic material with a first thickness; and a second coupling stack comprising a second elastic material with a second thickness, wherein each of the coupling stacks is attached to the clickpad surface and a surface of the information handling system by adhesives.Type: GrantFiled: December 1, 2021Date of Patent: February 28, 2023Assignee: Dell Products L.P.Inventors: Jing-Tang Wu, Shih-Wei Yang, Chia-Chi Ho, Ya-Chen Tsai
-
Patent number: 11592890Abstract: Embodiments of a system, method, and memory storage device for managing performance optimization of applications executed by an Information Handling System (IHS) are described. In an illustrative, non-limiting embodiment, an IHS may include computer-executable instructions to receive telemetry data associated with an operating behavior of the IHS. Using the telemetry data, the IHS generates a profile recommendation from the received telemetry data using a machine learning (ML) service, and adjusts a core stall management mechanism of a second processor to optimize a performance of the IHS. The second processor performs at least a portion of the operating behavior of the IHS.Type: GrantFiled: March 1, 2021Date of Patent: February 28, 2023Assignee: Dell Products, L.P.Inventors: Chia-Chi Ho, Thomas Alexander Shows, Ya-Chen Tsai, Chung-Wei Wang, Yi-Chung Cheng
-
Publication number: 20230052081Abstract: Disclosed are an electronic device and a manufacturing method of an electronic device. The manufacturing method includes the following. A first substrate is provided. The first substrate includes a plurality of chips. A second substrate is provided. A transfer process is performed to sequentially transfer a first chip and a second chip among the chips to the second substrate. The second chip is adjacent to the first chip. A first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate. A second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate. The first angle is different from the second angle.Type: ApplicationFiled: July 28, 2022Publication date: February 16, 2023Applicant: Innolux CorporationInventors: Shun-Yuan Hu, Chia-Chi Ho
-
Publication number: 20230026864Abstract: Provided is an electronic device including a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer. The first metal layer is formed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first metal layer. The adhesive layer is adhered to the substrate and the cover layer.Type: ApplicationFiled: June 21, 2022Publication date: January 26, 2023Applicant: Innolux CorporationInventors: Chia-Chi Ho, Jen-Hai Chi, Chin-Lung Ting
-
Publication number: 20230009719Abstract: An electronic apparatus including a substrate, a plurality of first bonding pads, an electronic device, and a first spacer is provided. The first bonding pads are disposed on the substrate. The electronic device is disposed on the substrate and electrically connected to the first bonding pads. The first spacer is disposed between the electronic device and the substrate. The electronic device is capable of effectively controlling a height and uniformity of a gap between the electronic device and the substrate, so as to prevent the electronic device from being tilted and ensure the electronic device to have a favorable structural reliability.Type: ApplicationFiled: June 15, 2022Publication date: January 12, 2023Applicant: Innolux CorporationInventors: Jen-Hai Chi, Chih-Yung Hsieh, Chia-Chi Ho
-
Publication number: 20230006342Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.Type: ApplicationFiled: September 6, 2022Publication date: January 5, 2023Inventors: Chia-Ping TSENG, Ker-Yih KAO, Chia-Chi HO, Ming-Yen WENG, Hung-I TSENG, Shu-Ling WU, Huei-Ying CHEN
-
Patent number: 11529435Abstract: The present disclosure provides a method for manufacturing a porous film, including: preparing a polymer mixture solution, wherein the polymer mixture solution includes polycaprolactone and at least one hydrophobic polymer; adding solid particles as a dispersing agent to the polymer mixture solution and mixing the solid particles with the polymer mixture solution, wherein the amount of solid particles added is enough to convert the polymer mixture solution into a solid mixture; drying the solid mixture to form a film; and washing the film with a washing fluid to remove the solid particles from the film to form the porous film, wherein the weight ratio of the polycaprolactone to the at least one hydrophobic polymer is about 1:0.1-10, and wherein the weight ratio of the polycaprolactone and the at least one hydrophobic polymer to the solid particles is about 1:0.01-250.Type: GrantFiled: May 5, 2021Date of Patent: December 20, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin Shen, Ming-Chia Yang, Chia-Chi Ho, Fang-Jie Jang, Che-Yu Ou, Chi-Hsiang Liao, Brian Hsu, Tai-Horng Young
-
Publication number: 20220367370Abstract: The disclosure provides an electronic device which includes a substrate structure, a driving component, and a conductive pattern. The driving component and the conductive pattern are formed on the substrate structure, and the thickness of the conductive pattern is greater than or equal to 0.5 ?m and less than or equal to 15 ?m.Type: ApplicationFiled: April 18, 2022Publication date: November 17, 2022Applicant: Innolux CorporationInventors: Jen-Hai Chi, Yun-Sheng Chen, Chia-Chi Ho
-
Publication number: 20220328405Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.Type: ApplicationFiled: June 28, 2022Publication date: October 13, 2022Applicant: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Publication number: 20220328406Abstract: The disclosure provides an electromagnetic wave adjustment apparatus includes a control circuit, a transistor circuit die and an electronic assembly. The transistor circuit die receives a control signal from the control circuit and drives the electronic assembly.Type: ApplicationFiled: June 28, 2022Publication date: October 13, 2022Applicant: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Patent number: 11469491Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.Type: GrantFiled: January 2, 2020Date of Patent: October 11, 2022Assignee: INNOLUX CORPORATIONInventors: Chia-Ping Tseng, Ker-Yih Kao, Chia-Chi Ho, Ming-Yen Weng, Hung-I Tseng, Shu-Ling Wu, Huei-Ying Chen