Abstract: A dual view-field display and a fabricating method and a driving method thereof are provided. The dual view-field display includes a color filter substrate and an array substrate which are oppositely disposed. A slit grating is disposed on a side of the color filter substrate or the array substrate, and the color filter substrate includes a plurality of pixel units and a first black matrix surrounding each pixel unit. The slit grating includes light-shielding regions and light-transmitting regions, which are arranged at intervals in a matrix. The dual view-field display further comprises a light blocking portion configured for preventing light rays from leaking out of an upper-edge region and/or a lower-edge region of the light-transmitting region, which solves a problem that a viewing angle of a user of the dual view-field display is limited.

Abstract: Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer; a passivation layer disposed on the TFT; a first metal layer disposed on the passivation layer; an insulating layer disposed on the first metal layer; a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and a detection unit being disposed on the insulating layer and including a second metal layer, wherein the second metal layer makes direct contact with the source electrode via the through hole structure.

Abstract: A wireless sensing network communication method is disclosed in which, describes a gateway device and backup gateway devices in a wireless sensing network communicate in a subscribe-publish-based scheme. The gateway device subscribes to a device capability event. The gateway device subscribes to a network disconnection event. When network disconnection occurs, the gateway device publishes a network disconnection event. The backup gateway devices receive notification of the network disconnection event and publish device capability events in response. The gateway device selects a backup gateway device as a primary gateway in the wireless sensing network fulfill failover purpose.

Abstract: A sensor, a manufacturing method thereof and an electronic device. The sensor includes: a base substrate; a thin-film transistor (TFT) disposed on the base substrate and including a source electrode; a first insulation layer disposed on the TFT and provided with a first through hole running through the first insulation layer; a conductive layer disposed in the first through hole and on part of the first insulation layer and electrically connected with the source electrode via the first through hole; a bias electrode disposed on the first insulation layer and separate from the conductive layer; a sensing active layer respectively connected with the conductive layer and the bias electrode; and an auxiliary conductive layer disposed on the conductive layer. The sensor and the manufacturing method thereof improve the conductivity and ensure normal transmission of signals by arranging the auxiliary conductive layer on the conductive layer without addition of processes.

Abstract: Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer; a passivation layer disposed on the TFT; a first metal layer disposed on the passivation layer; an insulating layer disposed on the first metal layer; a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and a detection unit being disposed on the insulating layer and including a second metal layer, wherein the second metal layer makes direct contact with the source electrode via the through hole structure.

Abstract: Embodiments of the disclosure relate to a pixel structure for naked-eye stereoscopic display, which comprises: a main display region; and at least one crosstalk region. The main display region and the crosstalk region are configured such that brightness of the main display region and brightness of the crosstalk region are controlled separately. Embodiments of the disclosure also relate to an array substrate for use with an inclined optical grating, and a method for controlling the pixel structure of the array substrate.

Abstract: A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.

Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.

Abstract: A spatial light modulator and a method for displaying a computer generated hologram are disclosed. The spatial light modulator includes a plurality of MEMS units arranged in an array, each of the MEMS units corresponds to a pixel of a computer generated hologram and includes a sensing device, a light shielding portion and a driving device. The sensing device is configured for receiving position information that is obtained through Roman encoding a pixel corresponding to an MEMS unit including the sensing device and the position information is transmitted to the driving device by the sensing device. The driving device is configured for controlling the light shielding portion to move to a position corresponding to the position information in response to the received position information of the light shielding portion when the present frame is displayed.

Abstract: A video compression method includes: dividing a frame into a plurality of first blocks, where a first maximum block size of the plurality of first blocks is NxN and N is a positive integer; performing a merge mode operation on the plurality of first blocks to generate a plurality of first prediction results; dividing the frame into a plurality of second blocks, wherein a second maximum block size of the plurality of second blocks is MxM and M is a positive integer smaller than N; performing motion estimation on the plurality of second blocks to generate a plurality of second prediction results; and performing video compression coding on the frame according to the plurality of first prediction results and the plurality of second prediction results.

Abstract: This invention discloses a data processing circuit and a data processing method. The data processing method controls data transmission between a USB control unit and a USB interface, and includes the steps of: detecting a voltage of a configuration channel pin of the USB interface to generate a detection signal; determining whether the USB control unit and the USB interface are connected according to the detection signal; and performing an audio signal processing procedure when the USB control unit and the USB interface are not connected.

Abstract: A grating, a manufacturing method thereof and a display device are disclosed. The grating comprises: a substrate including a plurality of first view field regions (A1) and a plurality of second view field regions (A2) which are alternately distributed; a plurality of ridge structures formed on the substrate in each first view field region (A1) and each second view field region (A2); and a patterned light shield layer being formed on the ridge structures and including a plurality of light-blocking regions and a plurality of light-transmitting regions, wherein in each first view field region (A1), each light-transmitting region is formed on a sloping surface of a first side of each ridge structure; in each second view field region (A2), each light-transmitting region is formed on a sloping surface of a second side of each ridge structure; and the first side and the second side are two opposite sides.

Abstract: A method for video decoding includes: dividing a plurality of luma component data of a reference frame into a plurality of primary data and a plurality of secondary data, respectively stored in a first memory region and a second memory region; accessing the first memory region to perform a motion estimation; and accessing the second region to perform a luma motion compensation.

Abstract: An image processing system includes an image processing module, a frame buffer encoding module and a frame buffer. Each image block includes multiple first-type coding blocks and at least one second-type coding block. The image processing module generates a first image processed result according to multiple first-type coding blocks of a target image block. The frame buffer encoding module generates a first frame buffer encoded result according to the first image processed result. The frame buffer, for the target image block, provides a buffer region including at least one first random access point and a second buffer region including at least one second random access point. The first frame buffer encoded result is stored to the first buffer region. At least one second-type coding block of the target image block is stored to the second buffer region.

Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

Abstract: A sensor, a manufacturing method thereof and an electronic device. The sensor includes: a base substrate; a thin-film transistor (TFT) disposed on the base substrate and including a source electrode; a first insulation layer disposed on the TFT and provided with a first through hole running through the first insulation layer; a conductive layer disposed in the first through hole and on part of the first insulation layer and electrically connected with the source electrode via the first through hole; a bias electrode disposed on the first insulation layer and separate from the conductive layer; a sensing active layer respectively connected with the conductive layer and the bias electrode; and an auxiliary conductive layer disposed on the conductive layer. The sensor and the manufacturing method thereof improve the conductivity and ensure normal transmission of signals by arranging the auxiliary conductive layer on the conductive layer without addition of processes.

Abstract: Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer; a passivation layer disposed on the TFT; a first metal layer disposed on the passivation layer; an insulating layer disposed on the first metal layer; a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and a detection unit being disposed on the insulating layer and including a second metal layer, wherein the second metal layer makes direct contact with the source electrode via the through hole structure.

Abstract: A hole structure and a fabrication method thereof, an array substrate and a fabrication method thereof, a detection device and a display device are provided. The fabrication method of the hole structure includes: performing a first photolithography process on a first initial thin film with a pattern region of a mask to form a first thin film and a first hole located therein, and performing a second photolithography process on a second initial thin film covering the first thin film with the pattern region of the mask to form a second thin film and a second hole running through the second thin film and communicating with the first hole; a dimension of a second opening of the second hole away from a base substrate is larger than a dimension of a first opening of the second hole close to the base substrate.

Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

Abstract: A double-vision-device alignment device and a double-vision-device alignment method are provided. The double-vision-device alignment device is configured to accurately align a display panel with a double-vision device, and comprising: a first chromaticity detecting unit, configured to detect a color in a first viewing region; a second chromaticity detecting unit, configured to detect a color in a second viewing region, wherein the first viewing region and the second viewing region are formed by light splitting of the double-vision device, and the first viewing region and the second viewing region correspond to different display regions of the display panel, respectively. It is judged whether an alignment is accurate by detection of a chromaticity detecting unit, which can prevent an alignment result from being affected by human factors, improve accuracy and efficiency, and reduce labor intensity, and the device can be operated by non-professionals.