Abstract: A method for treating Type II diabetes. The method involves administering to a subject a pharmaceutical composition comprising an effective amount of a 5-HT1A receptor antagonist. The pharmaceutical composition comprises an effective amount of a 5-HT1A receptor antagonist, and pharmaceutically acceptable carriers thereof.

Abstract: An electronic device is provided. The electronic device includes a housing, a driving circuit assembly, an adhesive layer, and a flexible circuit board. The driving circuit assembly is disposed on the housing. The adhesive layer is disposed between the housing and the driving circuit assembly. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the driving circuit assembly. The flexible circuit board overlaps the opening. The housing and the driving circuit assembly are connected to each other by the first adhesive segment and the second adhesive segment.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

Abstract: An electronic device is provided. The electronic device includes a housing, a driving circuit assembly, an adhesive layer, and a flexible circuit board. The driving circuit assembly is disposed on the housing. The adhesive layer is disposed between the housing and the driving circuit assembly. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the driving circuit assembly. The flexible circuit board overlaps the opening. The housing and the driving circuit assembly are connected to each other by the first adhesive segment and the second adhesive segment.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An electronic device and a method for manufacturing the same are provided. The method for manufacturing the electronic device comprises the following steps: forming a protective layer on a plurality of electronic units; disposing the plurality of electronic units with the protective layer and a plurality of driving units on a substrate, respectively; forming a color layer on the plurality of electronic units with the protective layer, the plurality of driving units and the substrate; and removing the color layer on the plurality of electronic units with the protective layer.

Abstract: An electronic device including a substrate, a circuit structure, two adjacent supporting elements and another two adjacent supporting elements is provided. The flexible substrate has a first surface and comprises a region connected with a circuit board. The circuit structure is disposed on the first surface. The two adjacent supporting elements are disposed on the first surface and separated by a first distance. The another two adjacent supporting elements are disposed on the first surface and separated by a second distance, wherein the two adjacent support elements are farther away from the region than the another two adjacent support elements, and the first distance is less than the second distance.

Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.

Abstract: An electronic device is provided. The electronic device includes a housing, a driving circuit assembly, an adhesive layer, and a flexible circuit board. The driving circuit assembly is disposed on the housing. The adhesive layer is disposed between the housing and the driving circuit assembly. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the driving circuit assembly. The flexible circuit board overlaps the opening. The housing and the driving circuit assembly are connected to each other by the first adhesive segment and the second adhesive segment.

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.

Abstract: An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.

Abstract: An electronic device is provided. The electronic device includes a supporting board, multiple circuit boards, a gap, and a molding material. The circuit boards are disposed on the supporting board. Each circuit board includes a substrate and multiple semiconductor elements. The semiconductor elements are disposed on the substrate. The gap is disposed between two adjacent circuit boards. The molding material is disposed on the supporting board and covers the circuit boards and the gap. The electronic device of the embodiment of the disclosure can improve uniformity of product appearance or uniformity of a display image.

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.