Patents by Inventor Chia-Chieh FAN
Chia-Chieh FAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240103308Abstract: An electronic device including a substrate, a circuit structure, two adjacent supporting elements and another two adjacent supporting elements is provided. The flexible substrate has a first surface and comprises a region connected with a circuit board. The circuit structure is disposed on the first surface. The two adjacent supporting elements are disposed on the first surface and separated by a first distance. The another two adjacent supporting elements are disposed on the first surface and separated by a second distance, wherein the two adjacent support elements are farther away from the region than the another two adjacent support elements, and the first distance is less than the second distance.Type: ApplicationFiled: December 4, 2023Publication date: March 28, 2024Applicant: Innolux CorporationInventors: Ming-Tsang Wu, Jia-Sin Li, Chia-Chieh Fan
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 11880100Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.Type: GrantFiled: March 23, 2022Date of Patent: January 23, 2024Assignee: Innolux CorporationInventors: Ming-Tsang Wu, Jia-Sin Li, Chia-Chieh Fan
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Publication number: 20230418103Abstract: An electronic device is provided. The electronic device includes a housing, a driving circuit assembly, an adhesive layer, and a flexible circuit board. The driving circuit assembly is disposed on the housing. The adhesive layer is disposed between the housing and the driving circuit assembly. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the driving circuit assembly. The flexible circuit board overlaps the opening. The housing and the driving circuit assembly are connected to each other by the first adhesive segment and the second adhesive segment.Type: ApplicationFiled: September 5, 2023Publication date: December 28, 2023Inventors: Shan-Shan HSU, Ming-Tsang WU, Chia-Chieh FAN
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Patent number: 11782308Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.Type: GrantFiled: March 17, 2022Date of Patent: October 10, 2023Assignee: INNOLUX CORPORATIONInventors: Shan-Shan Hsu, Ming-Tsang Wu, Chia-Chieh Fan
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Patent number: 11721560Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.Type: GrantFiled: August 15, 2021Date of Patent: August 8, 2023Assignee: InnoLux CorporationInventors: Chia-Chieh Fan, Chin-Lung Ting, Cheng-Chi Wang, Ming-Tsang Wu
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Publication number: 20230083007Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.Type: ApplicationFiled: November 17, 2022Publication date: March 16, 2023Applicant: Innolux CorporationInventors: Jia Sin Li, Tong-Jung Wang, Chia-Chieh Fan, Shan Shan Hsu, Chih Han Ma
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Publication number: 20230025999Abstract: An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.Type: ApplicationFiled: June 27, 2022Publication date: January 26, 2023Applicant: Innolux CorporationInventors: Hao-Jung Huang, Chi-Liang Chang, I-Ho Shen, Ker-Yih Kao, Yun-Sheng Chen, Chiao-Chu Tsui, Chih-Han Ma, Shan-Shan Hsu, Chia-Chieh Fan
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Publication number: 20230027220Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.Type: ApplicationFiled: October 5, 2022Publication date: January 26, 2023Applicant: InnoLux CorporationInventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
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Patent number: 11488899Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.Type: GrantFiled: July 28, 2020Date of Patent: November 1, 2022Assignee: InnoLux CorporationInventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
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Publication number: 20220344281Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.Type: ApplicationFiled: March 23, 2022Publication date: October 27, 2022Applicant: Innolux CorporationInventors: Ming-Tsang Wu, Jia-Sin Li, Chia-Chieh Fan
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Publication number: 20220328460Abstract: An electronic device is provided. The electronic device includes a supporting board, multiple circuit boards, a gap, and a molding material. The circuit boards are disposed on the supporting board. Each circuit board includes a substrate and multiple semiconductor elements. The semiconductor elements are disposed on the substrate. The gap is disposed between two adjacent circuit boards. The molding material is disposed on the supporting board and covers the circuit boards and the gap. The electronic device of the embodiment of the disclosure can improve uniformity of product appearance or uniformity of a display image.Type: ApplicationFiled: March 14, 2022Publication date: October 13, 2022Applicant: Innolux CorporationInventors: Chia-Chieh Fan, Ming-Tsang Wu
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Publication number: 20220206336Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.Type: ApplicationFiled: March 17, 2022Publication date: June 30, 2022Inventors: Shan-Shan HSU, Ming-Tsang WU, Chia-Chieh FAN
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Patent number: 11307454Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.Type: GrantFiled: September 2, 2020Date of Patent: April 19, 2022Assignee: INNOLUX CORPORATIONInventors: Shan-Shan Hsu, Ming-Tsang Wu, Chia-Chieh Fan
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Publication number: 20210375643Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.Type: ApplicationFiled: August 15, 2021Publication date: December 2, 2021Applicant: InnoLux CorporationInventors: Chia-Chieh Fan, Chin-Lung Ting, Cheng-Chi Wang, Ming-Tsang Wu
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Patent number: 11127604Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.Type: GrantFiled: December 5, 2018Date of Patent: September 21, 2021Assignee: InnoLux CorporationInventors: Chia-Chieh Fan, Chin-Lung Ting, Cheng-Chi Wang, Ming-Tsang Wu
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Patent number: 11112636Abstract: A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.Type: GrantFiled: September 23, 2020Date of Patent: September 7, 2021Assignee: Innolux CorporationInventors: Chia-Chieh Fan, Tong-Jung Wang
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Publication number: 20210259103Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.Type: ApplicationFiled: January 22, 2021Publication date: August 19, 2021Applicant: Innolux CorporationInventors: Jia Sin Li, Tong-Jung Wang, Chia-Chieh Fan, Shan Shan Hsu, Chih Han Ma
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Patent number: 11075155Abstract: A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.Type: GrantFiled: October 16, 2019Date of Patent: July 27, 2021Assignee: InnoLux CorporationInventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Cheng-Chi Wang, Kuan-Jen Wang
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Publication number: 20210109389Abstract: A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.Type: ApplicationFiled: September 23, 2020Publication date: April 15, 2021Applicant: Innolux CorporationInventors: Chia-Chieh Fan, Tong-Jung Wang