Patents by Inventor Chia-Chun Hung

Chia-Chun Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230040518
    Abstract: An audio processing device includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Application
    Filed: March 10, 2022
    Publication date: February 9, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Wei LIU, Chi WU, Chia Chun HUNG
  • Publication number: 20230041455
    Abstract: An audio dose monitoring circuit includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Application
    Filed: March 10, 2022
    Publication date: February 9, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Wei LIU, Chi WU, Chia Chun HUNG
  • Publication number: 20230040671
    Abstract: An audio processing device includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.
    Type: Application
    Filed: March 10, 2022
    Publication date: February 9, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Wei LIU, Chi WU, Chia Chun HUNG
  • Patent number: 11570606
    Abstract: A Bluetooth controller circuit includes: a clock counter arranged to operably generate a first count value corresponding to a reference clock signal; a count value adjusting circuit arranged to operably generate a second count value according to the first count value; a time slot determining circuit arranged to operably determine timing of respective transmission slots according to the second count value; a transceiver circuit arranged to operably transmit Bluetooth signal in transmission slots determined by the time slot determining circuit; and a control circuit, coupled with the count value adjusting circuit, the time slot determining circuit, and the transceiver circuit, and arranged to operably control operations of the count value adjusting circuit, the time slot determining circuit, and the transceiver circuit.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: January 31, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Hou-Tse Hung, Liang-Hui Li, Chia Chun Hung
  • Patent number: 11570081
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a sniffing mode, the auxiliary Bluetooth circuit sniffs packets transmitted from the remote Bluetooth device while the main Bluetooth circuit receives packets issued from the remote Bluetooth device, and the auxiliary Bluetooth circuit switches from the sniffing mode to a relay mode if the throughput of packets sniffed by the auxiliary Bluetooth circuit is lower than a predetermined threshold. In the period during which the auxiliary Bluetooth circuit operates at the relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit, and the auxiliary Bluetooth circuit does not sniff packets issued from the remote Bluetooth device.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: January 31, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chia Chun Hung, Hou Wei Lin
  • Publication number: 20220382069
    Abstract: Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 1, 2022
    Inventors: Hsin-Yu CHEN, Yen-Chiang Liu, Jiun-Jie Chiou, Jia-Syuan Li, You-Cheng Jhang, Shin-Hua Chen, Lavanya Sanagavarapu, Han-Zong Pan, Chun-Peng Li, Chia-Chun Hung, Ching-Hsiang Hu, Wei-Ding Wu, Jui-Chun Weng, Ji-Hong Chiang, Hsi-Cheng Hsu
  • Publication number: 20220373815
    Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.
    Type: Application
    Filed: August 4, 2022
    Publication date: November 24, 2022
    Inventors: Hsin-Yu CHEN, Chun-Peng LI, Chia-Chun HUNG, Ching-Hsiang HU, Wei-Ding WU, Jui-Chun WENG, Ji-Hong CHIANG, Yen-Chiang LIU, Jiun-Jie CHIOU, Li-Yang TU, Jia-Syuan LI, You-Cheng JHANG, Shin-Hua CHEN, Lavanya SANAGAVARAPU, Han-Zong PAN, Hsi-Cheng HSU
  • Publication number: 20220361287
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit; the auxiliary Bluetooth circuit does not sniff packets issued from the remote Bluetooth device, but will switch to a sniffing mode if a signal reception quality indicator of the auxiliary Bluetooth circuit is superior to a predetermined indicator value. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device and the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.
    Type: Application
    Filed: July 21, 2022
    Publication date: November 10, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Kuan-Chung HUANG, Chia Chun HUNG, Hou Wei LIN
  • Publication number: 20220356571
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Peng-Cheng HONG, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20220321442
    Abstract: A latency adjustment method includes the following operations: in response to a predetermined event of a data stream occurred during a first interval, performing a transmission status determining operation to determine whether a transmission status of the data stream is stable; in response the transmission status being stable, determining whether a total number of times of packet loss compensation events of the data stream occurred during a previous interval is higher than a first predetermined value; and in response to the transmission status being unstable or the total number of times being higher than the first predetermined value, increasing a latency of the data stream.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 6, 2022
    Inventors: CHENG-ZHUO ZHU, CHIA CHUN HUNG
  • Publication number: 20220322209
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; and a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data. When the first or second Bluetooth member device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the first or second Bluetooth member device, the audio broadcasting device utilizes a target control command to instruct the first and second Bluetooth member devices to synchronously reduce their volume to be lower than a predetermined threshold.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Bi WEI, Yu Hsuan LIU, Chia Chun HUNG
  • Patent number: 11454820
    Abstract: Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: September 27, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Yu Chen, Yen-Chiang Liu, Jiun-Jie Chiou, Jia-Syuan Li, You-Cheng Jhang, Shin-Hua Chen, Lavanya Sanagavarapu, Han-Zong Pan, Chun-Peng Li, Chia-Chun Hung, Ching-Hsiang Hu, Wei-Ding Wu, Jui-Chun Weng, Ji-Hong Chiang, Hsi-Cheng Hsu
  • Patent number: 11448891
    Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: September 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Yu Chen, Chun-Peng Li, Chia-Chun Hung, Ching-Hsiang Hu, Wei-Ding Wu, Jui-Chun Weng, Ji-Hong Chiang, Yen-Chiang Liu, Jiun-Jie Chiou, Li-Yang Tu, Jia-Syuan Li, You-Cheng Jhang, Shin-Hua Chen, Lavanya Sanagavarapu, Han-Zong Pan, Hsi-Cheng Hsu
  • Publication number: 20220293557
    Abstract: Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.
    Type: Application
    Filed: March 11, 2021
    Publication date: September 15, 2022
    Inventors: Hsi-Cheng HSU, Jui-Chun WENG, Ching-Hsiang HU, Ji-Hong CHIANG, Kuo-Hao LEE, Chia-Yu LIN, Chia-Chun HUNG, Yen-Chieh TU, Chien-Tai SU, Hsin-Yu CHEN
  • Publication number: 20220271759
    Abstract: A Bluetooth controller circuit includes: a clock counter arranged to operably generate a first count value corresponding to a reference clock signal; a count value adjusting circuit arranged to operably generate a second count value according to the first count value; a time slot determining circuit arranged to operably determine timing of respective transmission slots according to the second count value; a transceiver circuit arranged to operably transmit Bluetooth signal in transmission slots determined by the time slot determining circuit; and a control circuit, coupled with the count value adjusting circuit, the time slot determining circuit, and the transceiver circuit, and arranged to operably control operations of the count value adjusting circuit, the time slot determining circuit, and the transceiver circuit.
    Type: Application
    Filed: February 22, 2022
    Publication date: August 25, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Hou-Tse HUNG, Liang-Hui LI, Chia Chun HUNG
  • Patent number: 11412576
    Abstract: An auxiliary Bluetooth circuit for use in a multi-member Bluetooth device is disclosed including: a second Bluetooth communication circuit, a second packet parsing circuit, and a second control circuit. In a period during which the auxiliary Bluetooth circuit operates at a sniffing mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, while the second control circuit utilizes the second Bluetooth communication circuit to sniff packets issued from the remote Bluetooth device. In a situation of that a throughput of packets sniffed by the auxiliary Bluetooth circuit is lower than a predetermined threshold, the auxiliary Bluetooth circuit switches from the sniffing mode to a relay mode. In a period during which the auxiliary Bluetooth circuit operates at the relay mode, the second control circuit utilizes the second Bluetooth communication circuit to receive packets forwarded from the main Bluetooth circuit.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: August 9, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chia Chun Hung, Hou Wei Lin
  • Publication number: 20220223528
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 14, 2022
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Patent number: 11375579
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a sniffing mode, the auxiliary Bluetooth circuit sniffs packets transmitted from the remote Bluetooth device and the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the sniffing mode to a relay mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: June 28, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chia Chun Hung, Hou Wei Lin
  • Publication number: 20220167137
    Abstract: A Bluetooth communication system includes: an inquirer-side Bluetooth device arranged to operably generate and transmit a Bluetooth inquiry request; and a requester-side Bluetooth device arranged to operably receive and parse the Bluetooth inquiry request, and to operably generate and transmit a Frequency Hop Synchronization (FHS) packet containing a requester-side Bluetooth address and an Extended Inquiry Response (EIR) packet containing an auto-pairing request to the inquirer-side Bluetooth device. The inquirer-side Bluetooth device conducts an auto-pairing procedure with the requester-side Bluetooth device according to the contents of FHS packet and the EIR packet, but the inquirer-side Bluetooth device and the requester-side Bluetooth device does not switch to operating modes for transmitting or receiving Bluetooth advertising packets before conducting the auto-pairing procedure.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 26, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventor: Chia Chun HUNG
  • Publication number: 20220167136
    Abstract: A Bluetooth communication system includes: an inquirer-side Bluetooth device arranged to operably generate and transmit a Bluetooth inquiry request; and a requester-side Bluetooth device arranged to operably receive and parse the Bluetooth inquiry request, and to operably generate and transmit a Frequency Hop Synchronization (FHS) packet containing a requester-side Bluetooth address and an Extended Inquiry Response (EIR) packet containing an auto-pairing request to the inquirer-side Bluetooth device. The inquirer-side Bluetooth device conducts an auto-pairing procedure with the requester-side Bluetooth device according to the contents of FHS packet and the EIR packet, but at least one of the inquirer-side Bluetooth device and the requester-side Bluetooth device does not support Bluetooth Low Energy (BLE) technology.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 26, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventor: Chia Chun HUNG