Patents by Inventor Chia-Feng Yeh

Chia-Feng Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two stage radiation thermoelectric cooling apparatus
    Patent number: 6880346
    Abstract: The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: April 19, 2005
    Assignee: Giga-Byte Technology Co., Ltd.
    Inventors: Hsiang-Chieh Tseng, Yi-Song Liu, Chia-Min Chou, Chia-Feng Yeh