Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A test method is configured to test a chip on a circuit under test, wherein the circuit under test further includes a DC-DC converter. The test method includes the operations of: generating a test pulse signal; filtering the test pulse signal to generate a first test DC voltage to the DC-DC converter, wherein the DC-DC converter transforms the first test DC voltage to a second test DC voltage and transmits the second test DC voltage to the chip; and extracting an output signal of the chip to determine a performance of the chip, wherein the chip generates the output signal according to the second test DC voltage.

Abstract: A method for transferring a container configured to hold at least one article used in semiconductor fabrication is provided. The method includes moving a transferring mechanism to a first position that is adjacent to the original space; producing an image of an edge of the container that is adjacent to the original space using an optical receiver before the container is moved to a destination space; and performing an image analysis of the image to determine whether to move the container to the destination space.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A method for transferring a container configured to hold at least one article used in semiconductor fabrication is provided. The method includes moving a transferring mechanism to a first position that is adjacent to the original space; producing an image of an edge of the container that is adjacent to the original space using an optical receiver before the container is moved to a destination space; and performing an image analysis of the image to determine whether to move the container to the destination space.

Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: The present invention relates to an insertion device having recovering mechanism, which comprises: a support formed with an accommodation hole; a sliding rod capable of being elastically moved relative to the support; and a recovering mechanism. The recovering mechanism is installed with a spring accommodated in the accommodation hole, an actuation unit disposed above the spring, and the bottom of the actuation unit is formed with a stop plate, the spring enables the actuation unit to be moved upwardly/downwardly thereby enabling the stop plate to stop the sliding rod at a first position or release the sliding rod at a second position. Accordingly, the recovering mechanism is suitable to be installed in a smaller space.

Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.

Abstract: Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where the IC dies and the bond wires are enclosed by the film-on-wire layer, and cutting the substrate or the leadframe into IC devices. Other embodiments are also described. The FOW based method for IC packaging can eliminate the need for molding in the IC packaging process and consequently, can reduce the cost of IC packaging and the dimensions of packaged IC devices.

Abstract: The present invention relates to an insertion device having recovering mechanism, which comprises: a support formed with an accommodation hole; a sliding rod capable of being elastically moved relative to the support; and a recovering mechanism. The recovering mechanism is installed with a spring accommodated in the accommodation hole, an actuation unit disposed above the spring, and the bottom of the actuation unit is formed with a stop plate, the spring enables the actuation unit to be moved upwardly/downwardly thereby enabling the stop plate to stop the sliding rod at a first position or release the sliding rod at a second position. Accordingly, the recovering mechanism is suitable to be installed in a smaller space.

Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.

Abstract: The present invention discloses a hinge structure with changeable frictional faces, comprising a spindle socketingly disposed with a first enclosing part and a second enclosing part with the openings of the first and second enclosing parts pointing to the same direction to change the frictional face for torsion from the second enclosing face to the first enclosing part and thus to extend the service life and further to form a frictional face with four steps of different torsions to meet the demands of customers.

Abstract: A vertically adjustable supporting structure that comprises a link member whose bottom and top portions disposed with a lower end and a top end; a lower hinge having at least one shaft pivoted on the lower end of the link member so as to render the link member rotatably pivoted between the two lower frames of the lower hinge; an upper hinge having at least one shaft pivotally connected on the upper end of the link member so as to render the link member rotatably pivoted between the two upper frames of the upper hinge; at least a coupling assembly having one lower axle wheel and one upper axle wheel disposed between the lower end and the upper end of one side of the link member and between the lower frame and upper frame, respectively, and pivoted on the lower hinge and upper hinge, respectively, with a flexible cord engagingly secured between the lower and upper axle wheels; and at least an idle wheel pivoted on one side of the link member and between the lower and upper axle wheels to be interlacing engaged

Abstract: An elevation-adjustable support structure includes a connecting member, a bottom hinge structure, which comprises two bottom brackets, and a shaft fastened to the bottom brackets and pivoted to the bottom end of the connecting member for allowing the connecting member to be turned about the shaft between the two bottom brackets, a top hinge structure, which comprises two top brackets and two shafts respectively fastened to the top brackets and pivoted to the top end of the connecting member for allowing the connecting member to be turned about the shafts between the two top brackets; and two linking mechanisms each having a top wheel and a bottom wheel respectively coupled between the top end of the connecting member and the top brackets and the bottom end of the connecting member and the bottom brackets and a flexible belt member coupled between the top wheel and the bottom wheel for maintaining the angle of inclination of the top brackets upon a rotary motion of the connecting member relative to the top hin

Abstract: The present invention discloses a hinge structure with changeable frictional faces, comprising a spindle socketingly disposed with a first enclosing part and a second enclosing part with the openings of the first and second enclosing parts pointing to the same direction to change the frictional face for torsion from the second enclosing face to the first enclosing part and thus to extend the service life and further to form a frictional face with four steps of different torsions to meet the demands of customers.