Patents by Inventor Chia-Han Lin
Chia-Han Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10821871Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.Type: GrantFiled: January 17, 2018Date of Patent: November 3, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Tang Huang, Yuan-Yu Feng, Chia-Han Lin, Chien-Fa Lee
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Publication number: 20200043812Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.Type: ApplicationFiled: October 14, 2019Publication date: February 6, 2020Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
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Patent number: 10490463Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.Type: GrantFiled: February 26, 2018Date of Patent: November 26, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
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Publication number: 20190135156Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.Type: ApplicationFiled: January 17, 2018Publication date: May 9, 2019Inventors: Yi-Tang HUANG, Yuan-Yu FENG, Chia-Han LIN, Chien-Fa LEE
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Publication number: 20190035696Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.Type: ApplicationFiled: February 26, 2018Publication date: January 31, 2019Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
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Patent number: 9077095Abstract: The present invention relates to an insertion device having recovering mechanism, which comprises: a support formed with an accommodation hole; a sliding rod capable of being elastically moved relative to the support; and a recovering mechanism. The recovering mechanism is installed with a spring accommodated in the accommodation hole, an actuation unit disposed above the spring, and the bottom of the actuation unit is formed with a stop plate, the spring enables the actuation unit to be moved upwardly/downwardly thereby enabling the stop plate to stop the sliding rod at a first position or release the sliding rod at a second position. Accordingly, the recovering mechanism is suitable to be installed in a smaller space.Type: GrantFiled: February 13, 2013Date of Patent: July 7, 2015Assignee: JARLLYTEC CO., LTD.Inventors: Chia-Han Lin, Meng-Jen Pan
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Patent number: 8679974Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.Type: GrantFiled: March 9, 2012Date of Patent: March 25, 2014Assignee: National Tsing Hua UniversityInventors: Wei-leun Fang, Chia Han Lin, Feng Yu Lee
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Publication number: 20130299955Abstract: Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where the IC dies and the bond wires are enclosed by the film-on-wire layer, and cutting the substrate or the leadframe into IC devices. Other embodiments are also described. The FOW based method for IC packaging can eliminate the need for molding in the IC packaging process and consequently, can reduce the cost of IC packaging and the dimensions of packaged IC devices.Type: ApplicationFiled: May 8, 2012Publication date: November 14, 2013Applicant: NXP B.V.Inventors: Ching Hui Chang, Li Ching Wang, Wen Hung Huang, Pao Tung Pan, Chih Li Huang, I Pin Chen, Chia Han Lin, Chung Hsiung Ho
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Publication number: 20130259564Abstract: The present invention relates to an insertion device having recovering mechanism, which comprises: a support formed with an accommodation hole; a sliding rod capable of being elastically moved relative to the support; and a recovering mechanism. The recovering mechanism is installed with a spring accommodated in the accommodation hole, an actuation unit disposed above the spring, and the bottom of the actuation unit is formed with a stop plate, the spring enables the actuation unit to be moved upwardly/downwardly thereby enabling the stop plate to stop the sliding rod at a first position or release the sliding rod at a second position. Accordingly, the recovering mechanism is suitable to be installed in a smaller space.Type: ApplicationFiled: February 13, 2013Publication date: October 3, 2013Applicant: JARLLYTEC CO., LTD.Inventors: Chia-Han LIN, Meng-Jen PAN
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Publication number: 20130157459Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.Type: ApplicationFiled: March 9, 2012Publication date: June 20, 2013Inventors: Wei-leun FANG, Chia Han Lin, Feng Yu Lee
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Patent number: 8060985Abstract: The present invention discloses a hinge structure with changeable frictional faces, comprising a spindle socketingly disposed with a first enclosing part and a second enclosing part with the openings of the first and second enclosing parts pointing to the same direction to change the frictional face for torsion from the second enclosing face to the first enclosing part and thus to extend the service life and further to form a frictional face with four steps of different torsions to meet the demands of customers.Type: GrantFiled: October 10, 2008Date of Patent: November 22, 2011Assignee: Jarllytec Co., Ltd.Inventor: Chia-Han Lin
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Patent number: 7731137Abstract: A vertically adjustable supporting structure that comprises a link member whose bottom and top portions disposed with a lower end and a top end; a lower hinge having at least one shaft pivoted on the lower end of the link member so as to render the link member rotatably pivoted between the two lower frames of the lower hinge; an upper hinge having at least one shaft pivotally connected on the upper end of the link member so as to render the link member rotatably pivoted between the two upper frames of the upper hinge; at least a coupling assembly having one lower axle wheel and one upper axle wheel disposed between the lower end and the upper end of one side of the link member and between the lower frame and upper frame, respectively, and pivoted on the lower hinge and upper hinge, respectively, with a flexible cord engagingly secured between the lower and upper axle wheels; and at least an idle wheel pivoted on one side of the link member and between the lower and upper axle wheels to be interlacing engagedType: GrantFiled: September 6, 2007Date of Patent: June 8, 2010Assignee: Jarllytec Co., Ltd.Inventors: Yung-Ta Lee, Chia-Han Lin
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Patent number: 7597302Abstract: An elevation-adjustable support structure includes a connecting member, a bottom hinge structure, which comprises two bottom brackets, and a shaft fastened to the bottom brackets and pivoted to the bottom end of the connecting member for allowing the connecting member to be turned about the shaft between the two bottom brackets, a top hinge structure, which comprises two top brackets and two shafts respectively fastened to the top brackets and pivoted to the top end of the connecting member for allowing the connecting member to be turned about the shafts between the two top brackets; and two linking mechanisms each having a top wheel and a bottom wheel respectively coupled between the top end of the connecting member and the top brackets and the bottom end of the connecting member and the bottom brackets and a flexible belt member coupled between the top wheel and the bottom wheel for maintaining the angle of inclination of the top brackets upon a rotary motion of the connecting member relative to the top hinType: GrantFiled: September 6, 2007Date of Patent: October 6, 2009Assignee: Jarllytec Co., Ltd.Inventors: Yung-Ta Lee, Chia-Han Lin
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Publication number: 20090151116Abstract: The present invention discloses a hinge structure with changeable frictional faces, comprising a spindle socketingly disposed with a first enclosing part and a second enclosing part with the openings of the first and second enclosing parts pointing to the same direction to change the frictional face for torsion from the second enclosing face to the first enclosing part and thus to extend the service life and further to form a frictional face with four steps of different torsions to meet the demands of customers.Type: ApplicationFiled: October 10, 2008Publication date: June 18, 2009Inventor: Chia-Han LIN
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Publication number: 20080277539Abstract: An elevation-adjustable support structure includes a connecting member, a bottom hinge structure, which comprises two bottom brackets, and a shaft fastened to the bottom brackets and pivoted to the bottom end of the connecting member for allowing the connecting member to be turned about the shaft between the two bottom brackets, a top hinge structure, which comprises two top brackets and two shafts respectively fastened to the top brackets and pivoted to the top end of the connecting member for allowing the connecting member to be turned about the shafts between the two top brackets; and two linking mechanisms each having a top wheel and a bottom wheel respectively coupled between the top end of the connecting member and the top brackets and the bottom end of the connecting member and the bottom brackets and a flexible belt member coupled between the top wheel and the bottom wheel for maintaining the angle of inclination of the top brackets upon a rotary motion of the connecting member relative to the top hinType: ApplicationFiled: September 6, 2007Publication date: November 13, 2008Inventors: Yung-Ta Lee, Chia-Han Lin
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Publication number: 20080277555Abstract: A vertically adjustable supporting structure that comprises a link member whose bottom and top portions disposed with a lower end and a top end; a lower hinge having at least one shaft pivoted on the lower end of the link member so as to render the link member rotatably pivoted between the two lower frames of the lower hinge; an upper hinge having at least one shaft pivotally connected on the upper end of the link member so as to render the link member rotatably pivoted between the two upper frames of the upper hinge; at least a coupling assembly having one lower axle wheel and one upper axle wheel disposed between the lower end and the upper end of one side of the link member and between the lower frame and upper frame, respectively, and pivoted on the lower hinge and upper hinge, respectively, with a flexible cord engagingly secured between the lower and upper axle wheels; and at least an idle wheel pivoted on one side of the link member and between the lower and upper axle wheels to be interlacing engagedType: ApplicationFiled: September 6, 2007Publication date: November 13, 2008Inventors: Yung-Ta Lee, Chia-Han Lin