Abstract: A chip-scale linear light-emitting device includes a submount substrate, light-emitting diode (LED) semiconductor chips, a chip-scale packaging structure and a reflective structure. The LED semiconductor chips, the packaging structure and the reflective structure are disposed on the submount substrate, wherein the packaging structure partially covers the chip-upper surface and/or the chip-edge surfaces of the LED semiconductor chips, and the reflective structure partially covers the package-top surface and/or the package-side surfaces of the packaging structure. If one of the chip-edge surfaces and the package-side surface of the packaging structure are exposed from the reflective structure as a primary light-emitting side surface, a side-view type linear light-emitting device is formed. If the package-top surface of the packaging structure is exposed from the reflective structure as a primary light-emitting top surface, a top-view type linear light-emitting device is formed.

Abstract: An asymmetrically shaped chip-scale packaging (CSP) light-emitting device (LED) includes an LED chip, a photoluminescent structure (or a light-transmitting structure), and a reflective structure. The photoluminescent structure covers the upper surface and/or the edge surface of the LED chip; and the reflective structure at least partially covers the edge surface of the photoluminescent structure. The reflective structure partially reflects the primary light emitted from the edge surface of the LED chip or the converted secondary light radiated from the edge surface of the photoluminescent structure, therefore shaping the radiation pattern asymmetrically.

Abstract: A fabric weaved at least by a first yarn and a second yarn is provided. A first quantum dot material is distributed in the first yarn, and a second quantum dot material is distributed in the second yarn. An average particle size of the first quantum dot material is different from the average particle size of the second quantum dot material.

Abstract: An electronic device includes a chassis, a cooler, and a fan assembly. The chassis includes a bottom plate and defines an air inlet and an air outlet. The cooler is secured to the bottom plate. The fan assembly is secured to the bottom plate and defines a case and a roller received in the case. The roller includes a shaft and a number of blades secured to the shaft. An area of the air inlet is greater than an area of the air outlet. The fan assembly is capable of drawing in air into the roller. The air flows into the air inlet along a first direction. The air flows out of the air outlet along a second direction. The first direction is substantially parallel to the second direction. The first direction is substantially perpendicular to the shaft.

Abstract: A side view light emitting diode (LED) package structure includes a package housing, a side view LED chip and a thermal conductive member. The side view LED chip is enclosed by the package housing and an emitting direction of the side view LED chip is perpendicular to a thickness direction of a substrate. The thermal conductive member connected with the side view LED chip is disposed inside the package housing and a portion of which extends out of a dissipation opening of the package housing to be exposed so that heat of the side view LED chip is dissipated.

Abstract: A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.

Abstract: A scan signal transmission system and a method thereof are provided, which are applicable to a display device. The system includes a display area circuit and a gate circuit, the display area circuit has a plurality of pixel scan lines, and the gate circuit is connected to each of the pixel scan lines. The gate circuit is used for obtaining a scan signal from a clock generator, so as to transmit the scan signal to each of the pixel scan lines sequentially. During each frame scan operation, the gate circuit transmits the scan signal to the pixel scan lines in a reverse signal transmission direction.

Abstract: A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.

Abstract: A light-emitting diode (LED) package structure includes a LED chip, an interconnecting substrate, a first conductive lead and a second conductive lead. The LED chip is provided with first and second electrical contacts formed on the same side thereof. The upper surface of the interconnecting substrate is provided with two conductive traces and first, second, third and fourth conductive pads. The first and second conductive pads are electrically connected to the third and fourth conductive pads by the two conductive traces, respectively. The first and second conductive leads are directly soldered to the third and fourth conductive pads, respectively. The LED chip is mounted onto the upper surface of the interconnecting substrate in a flip-chip configuration so that the first and second conductive pads thereof are mechanically and electrically connected to the first and second electrical contacts, respectively.

Abstract: A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.

Abstract: A light emitting diode device is disclosed, and the light emitting diode device includes a base, a substrate, a lead frame, a chip, a first mixed layer and a second mixed layer. The first mixed layer and the second mixed layer respectively contain a glue and a thermal conductance insulating material, such as diamond carbon, diamond-like carbon or ceramic. The substrate and the lead frame are set on the base. The first mixed layer is formed between the chip and the substrate to fix the chip and strengthen heat dissipation. The second mixed layer is covered on the substrate and the chip to reduce the difference of the refraction index such that the total internal reflection angle is wider and the emitting efficiency is enhanced.

Abstract: A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.

Abstract: A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes.

Abstract: A light emitting diode device is disclosed, and the light emitting diode device includes a base, a substrate, a lead frame, a chip, a first mixed layer and a second mixed layer. The first mixed layer and the second mixed layer respectively contain a glue and a thermal conductance insulating material, such as diamond carbon, diamond-like carbon or ceramic. The substrate and the lead frame are set on the base. The first mixed layer is formed between the chip and the substrate to fix the chip and strengthen heat dissipation. The second mixed layer is covered on the substrate and the chip to reduce the difference of the refraction index such that the total internal reflection angle is wider and the emitting efficiency is enhanced.

Abstract: The present invention is an improved Light-Emitting Diode (LED) package structure comprising a light-emitting diode chip, a package board of heat conductive semiconductor material, a lead frame, and a circuit. Whereon the package board installs plural thermal vias to conduct the electricity circuit and transmit the heat out of the package due to the LED luminescing as well.

Abstract: A semiconductor light emitting apparatus is provided. The semiconductor light emitting apparatus includes a light-emitting device, a transparent material and at least one transparent film. The light-emitting device is located in a package substrate. The transparent material covers the light-emitting device. The transparent film is located between the light-emitting device and the transparent material. The refractive index of the transparent film is between the refractive index of the light-emitting device and the transparent material. A method for manufacturing the semiconductor light emitting apparatus is also disclosed.

Abstract: A voltage regulator. A first analog to digital converter generates first data according to a first output voltage. A second analog to digital converter generates second data according to a second output voltage. A voltage adjustment device generates a voltage control signal according to the first data and the second data. A switching module respectively provides the first output voltage and the second output voltage to a first load and a second load according to the voltage control signal.

Abstract: A side view light emitting diode (LED) package structure includes a package housing, a side view LED chip and a thermal conductive member. The side view LED chip is enclosed by the package housing and an emitting direction of the side view LED chip is perpendicular to a thickness direction of a substrate. The thermal conductive member connected with the side view LED chip is disposed inside the package housing and a portion of which extends out of a dissipation opening of the package housing to be exposed so that heat of the side view LED chip is dissipated.

Abstract: A voltage regulator. A first analog to digital converter generates first data according to a first output voltage. A second analog to digital converter generates second data according to a second output voltage. A voltage adjustment device generates a voltage control signal according to the first data and the second data. A switching module respectively provides the first output voltage and the second output voltage to a first load and a second load according to the voltage control signal.

Abstract: A blade member adapted to be connected to a shaft of a hockey stick or the like includes an elongated hollow blade body, a flexible damping portion, and an interface portion. The elongated hollow blade body defines a receiving cavity, and is made of a fiber reinforced resin composite. The flexible damping portion is disposed within the elongated hollow blade body, and is made of cork. The interface portion is disposed between the elongated hollow blade body and the flexible damping portion.