Abstract: A semiconductor structure includes a substrate having a first well of a first conductivity type and a second well of a second conductivity type. From a top view, the first well includes first and seconds edges extending along a first direction. The second edge has multiple turns, resulting in the first well having a protruding section and a recessed section. The semiconductor structure further includes a first source/drain feature over the protruding section and a second source/drain feature over a main body of the first well. The first source/drain feature is of the first conductivity type. The second source/drain feature is of the second conductivity type. The first and the second source/drain features are generally aligned along a second direction perpendicular to the first direction from the top view.

Abstract: A circuit carrier includes a substrate, a capacitive electrode layer, a plurality of metal pads and a plurality of bridges, and a plurality of conductive pillars. The capacitive electrode layer formed on a surface of the substrate and includes a plurality of first electrodes and a plurality of second electrodes. At least two of the first electrodes are connected to each other and be arranged across a die-bonding region of the substrate for separating at least two of the second electrodes that partially protrude from the die-bonding region to respectively form extensions. The metal pads and the bridges are formed on another surface of the substrate and are located outside of the die-bonding region. Each of the bridges connects two of the metal pads, and each of the conductive pillars is embedded in the substrate and connects one of the extensions and a corresponding one of metal pads.

Abstract: A light source module is provided, including: a light board, including a substrate, and a plurality of light-emitting elements arranged at intervals on the substrate; and a separator, located above the substrate, and including a plurality of first ribs, where the plurality of first ribs is cross-connected to form a plurality of interval spaces, to accommodate the light-emitting elements, the first rib forming the interval space has an inner wall, a part of the inner wall in a direction closer to the substrate tapers in a direction far away from the interval space, the inner wall has a first distance farther away from the substrate in a Z-axis direction and has a second distance closer to the substrate, and a projection relationship between the second distance and the first distance onto an XY plane is that the second distance is greater than the first distance.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, an insulating layer, and a diaphragm. The substrate has an opening portion. The backplate is disposed on a side of the substrate, with protrusions protruding toward the substrate. The diaphragm is movably disposed between the substrate and the backplate and spaced apart from the backplate by a spacing distance. The protrusions are configured to limit the deformation of the diaphragm when air flows through the opening portion.

Abstract: An image signal amplifying circuit comprising an amplifier and a gain control circuit. The amplifier respectively amplifies a first image signal and a second image signal, which are generated by a pixel array of an image sensor, by a first analog gain and a second analog gain, wherein each one of pixel circuits of the pixel array comprises a first capacitor for generating the first image signal and a second capacitor for generating the second image signal, wherein a charge storage capacity of the first capacitor is smaller than a charge storage capacity of the second capacitor. The gain control circuit selectively adjusts the first analog gain or the second analog gain. Each one of the pixel circuits has a first conversion gain corresponding to the first capacitor and a second conversion gain corresponding to the second capacitor.

Abstract: Electrostatic discharge (ESD) structures are provided. An ESD structure includes a semiconductor substrate, a first epitaxy region with a first type of conductivity over the semiconductor substrate, a second epitaxy region with a second type of conductivity over the semiconductor substrate, and a plurality of semiconductor layers. The semiconductor layers are stacked over the semiconductor substrate and between the first and second epitaxy regions. A first conductive feature is formed over the first epitaxy region and outside an oxide diffusion region. A second conductive feature is formed over the second epitaxy region and outside the oxide diffusion region. A third conductive feature is formed over the first epitaxy region and within the oxide diffusion region. A fourth conductive feature is formed over the second epitaxy region and within the oxide diffusion region. The oxide diffusion region is disposed between the first and second conductive features.

Abstract: A capacitive touchpad is provided, which includes a substrate module, a plurality of sensing electrodes, a plurality of driving electrodes and a plurality of light-emitting diode (LED) dies. The plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing region of the capacitive touchpad, and the touch sensing region is divided into a plurality of sensing units having same areas. Each of the LED dies is arranged in two adjacent ones of the plurality of sensing units, and a position of each of the LED dies corresponds to one of the plurality of driving electrodes, and the LED dies are electrically isolated from the plurality of sensing electrodes and the plurality of driving electrodes.

Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: A semiconductor device includes a substrate, a stiffener ring over the substrate, and an adhesive ring between the substrate and the stiffener ring. The adhesive ring includes a first part, a second part and a third part disposed between the first part and the second part. The first part and the second part have a first thickness, and the third part has a second thickness greater than the first thickness. The third part of the adhesive ring is covered by the stiffener ring.

Abstract: A circuit carrier includes a substrate, a capacitive electrode layer, a plurality of metal pads and a plurality of bridges, and a plurality of conductive pillars. The capacitive electrode layer formed on a surface of the substrate and includes a plurality of first electrodes and a plurality of second electrodes. At least two of the first electrodes are connected to each other and be arranged across a die-bonding region of the substrate for separating at least two of the second electrodes that partially protrude from the die-bonding region to respectively form extensions. The metal pads and the bridges are formed on another surface of the substrate and are located outside of the die-bonding region. Each of the bridges connects two of the metal pads, and each of the conductive pillars is embedded in the substrate and connects one of the extensions and a corresponding one of metal pads.

Abstract: A mechanical key component and a mechanical keyboard are provided. The mechanical key component includes a circuit board, an elastic element and a key cap. The circuit board is provided with a first sensing electrode. The elastic element is disposed on the circuit board, and a movable portion of the elastic element is connected to a second sensing electrode. The key cap is movably disposed on the elastic element. The elastic element enables the key cap to move between an unpressed position and a pressed position, and the movable portion drives the second sensing electrode to move relative to the first sensing electrode. In response to the key cap being moved between the unpressed position and the pressed position, a coupling capacitance between the first sensing electrode and the second sensing electrode changes to indicate whether the key cap is in the unpressed position or the pressed position.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.

Abstract: A semiconductor device includes a plurality of first nanosheets of a first conductive type, a plurality of second nanosheets of a second conductive type and a gate structure. The gate structure wraps the first nanosheets and the second nanosheets, wherein a first thickness of at least one of the first nanosheets is smaller than a second thickness of at least one of the second nanosheets.

Abstract: A circuit structure includes a light-transmissive insulation layer, a patterned conductive layer and an electronic component. The patterned conductive layer is disposed on the light-transmissive insulation layer. The electronic component is disposed on the patterned conductive layer and electrically connected to the patterned conductive layer.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.

Abstract: An array of poly lines on an active device area of an integrated chip is extended to form a dummy device structure on an adjacent isolation region. The resulting dummy device structure is an array of poly lines having the same line width, line spacing, and pitch as the array of poly lines on the active device area. The poly lines of the dummy device structure are on grid with the poly lines on the active device area. Because the dummy device structure is formed of poly lines that are on grid with the poly lines on the active device area, the dummy device structure may be much closer to the active device area than would otherwise be possible. The resulting proximity of the dummy device structure to the active device area improves anti-dishing performance and reduces empty space on the integrated chip.

Abstract: A system and method for automatically generating a workplan schedule for a team of employees in an organization includes receiving a request to create a workplan schedule for the team, the team including two or more team members who are employees of the organization and the workplan schedule identifying a work location for the team members. One or more collaborators for one or more of the team members is detected, where the collaborator is an employee of the organization who is not a member of the team and with whom at least one of the team members collaborate.

Abstract: A capacitive touchpad is provided, which includes a substrate module, a plurality of sensing electrodes, a plurality of driving electrodes and a plurality of light-emitting diode (LED) dies. The plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing region of the capacitive touchpad, and the touch sensing region is divided into a plurality of sensing units having same areas. Each of the LED dies is arranged in two adjacent ones of the plurality of sensing units, and a position of each of the LED dies corresponds to one of the plurality of driving electrodes, and the LED dies are electrically isolated from the plurality of sensing electrodes and the plurality of driving electrodes.

Abstract: A bicycle seat rail manufacturing method includes the steps of: pre-annealing, providing an aluminum alloy workpiece having undergone pre-annealing; first-stage heat treatment, performing heat treatment of full annealing on the aluminum alloy workpiece by a bending shaping, calendaring the aluminum alloy workpiece by a calendering shaping for a cooling time period, and bombarding the aluminum alloy workpiece by a cold forging shaping to increase its cross-sectional area; second-stage heat treatment, enhancing hardness of the aluminum alloy workpiece by a quenching shaping, and enhancing internal structure stability of the aluminum alloy workpiece by a tempering shaping; and cryogenic treatment, performing high-speed bombardments on the surface of the aluminum alloy workpiece by a shot blasting shaping to enhance its durability and service life. Therefore, a bicycle seat rail integrally formed of aluminum alloy is manufactured by the aforesaid steps.