Abstract: An electronic device includes first and second bodies and two antenna modules. The first body includes a first metal housing. The second body is pivotally connected to the first body through two metal hinges and includes a second metal housing, a third metal housing, and a non-metal housing. The non-metal housing is connected to the second metal housing and close to the first body. The two antenna modules are disposed between the second metal housing, the third metal housing, and the non-metal housing, and close to the two metal hinges respectively. Each antenna module includes a radiating part located between the coupling ground part and the corresponding metal hinge and a coupling ground part close to the first metal housing. The 10 coupling ground part, the first metal housing, the metal hinge, the second metal housing, and the third metal housing together form a loop path.

Abstract: A video encoder or a video decoder may perform operations to determine an initial motion vector (MV) such as a control point motion vector (CPMV) candidate according to an affine mode or an additional prediction signal representing an additional hypothesis motion vector, for a current sub-block in a current frame of a video stream; determine a current template associated with the current sub-block in the current frame; retrieve a reference template within a search area in a reference frame; and compute a difference between the reference template and the current template based on an optimization measurement. Additional operations performed may include iterating the retrieving and the computing the difference for a different reference template within the search area until a refinement MV, such as a refined CPMV or refined additional hypothesis motion vector, is found to minimize the difference according to the optimization measurement.

Abstract: A system and method for automatically generating a workplan schedule for a team of employees in an organization includes receiving a request to create a workplan schedule for the team, the team including two or more team members who are employees of the organization and the workplan schedule identifying a work location for the team members. One or more collaborators for one or more of the team members is detected, where the collaborator is an employee of the organization who is not a member of the team and with whom at least one of the team members collaborate.

Abstract: A capacitive touchpad is provided, which includes a substrate module, a plurality of sensing electrodes, a plurality of driving electrodes and a plurality of light-emitting diode (LED) dies. The plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing region of the capacitive touchpad, and the touch sensing region is divided into a plurality of sensing units having same areas. Each of the LED dies is arranged in two adjacent ones of the plurality of sensing units, and a position of each of the LED dies corresponds to one of the plurality of driving electrodes, and the LED dies are electrically isolated from the plurality of sensing electrodes and the plurality of driving electrodes.

Abstract: A computer-assisted needle insertion system and a computer-assisted needle insertion method are provided. The computer-assisted needle insertion method includes: obtaining a first machine learning (ML) model and a second ML model; obtaining a computed tomography (CT) image and a needle insertion path, generating a suggested needle insertion path according to the first ML model, the CT image, and the needle insertion path, and instructing a needle to approach a needle insertion point on a skin of a target, wherein the needle insertion point is located on the suggested needle insertion path; obtaining a breath signal of the target, and estimating whether a future breath state of the target is normal according to the second ML model and the breath signal; and outputting a suggested needle insertion period according to the breath signal in response to determining that the future breath state is normal.

Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate, semiconductor dies over the package substrate, and an underfill element over the package substrate and surrounding the semiconductor dies. A portion of the underfill element is located between the semiconductor dies. The semiconductor die package also includes lid structures respectively attached to the top surfaces of the semiconductor dies. In plan view, each lid structure is located within the periphery of the top surface of the corresponding semiconductor die. Each lid structure is disconnected from other lid structures, and a gap is formed between adjacent lid structures and located over the portion of the underfill element.

Abstract: A video coding system that uses local illumination compensation to code pixel blocks is provided. A video encoder receives samples for an original block of pixels to be encoded as a current block of a current picture of a video. The video encoder applies a linear model to a reference block to generate a prediction block for the current block. The linear model includes a scale parameter and an offset parameter. The video encoder may use the samples of the original block and samples from a reconstructed reference frame to derive the scale parameter and the offset parameter. The video encoder signals the scale parameter and the offset parameter in a bitstream. The video encoder encodes the current block by using the prediction block to reconstruct the current block.

Abstract: A bicycle seat rail manufacturing method includes the steps of: pre-annealing, providing an aluminum alloy workpiece having undergone pre-annealing; first-stage heat treatment, performing heat treatment of full annealing on the aluminum alloy workpiece by a bending shaping, calendaring the aluminum alloy workpiece by a calendering shaping for a cooling time period, and bombarding the aluminum alloy workpiece by a cold forging shaping to increase its cross-sectional area; second-stage heat treatment, enhancing hardness of the aluminum alloy workpiece by a quenching shaping, and enhancing internal structure stability of the aluminum alloy workpiece by a tempering shaping; and cryogenic treatment, performing high-speed bombardments on the surface of the aluminum alloy workpiece by a shot blasting shaping to enhance its durability and service life. Therefore, a bicycle seat rail integrally formed of aluminum alloy is manufactured by the aforesaid steps.

Abstract: A semiconductor device includes a substrate, an electronic component, a stiffener ring and an adhesive ring. The substrate has a first surface and a second surface opposite to the first surface. The electronic component is over the first surface of the substrate. The stiffener ring is over the first surface of the substrate. The stiffener ring includes a plurality of side parts and a plurality of corner parts coupled to the side parts. Heights of the corner parts are less than heights of the side parts. The adhesive ring is interposed between the first surface of the substrate and the stiffener ring. The adhesive ring includes a plurality of side portions and a plurality of corner portions coupled to the side portions. Thicknesses of the side portions are less than thicknesses of the corner portions.

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

Abstract: A key unit and a keyboard using the same are provided. The key unit includes a circuit board, a supporting assembly, a keycap, and a floating conductive structure. The circuit board includes a capacitance sensing circuit embedded therein, and the capacitance sensing circuit includes a pair of sensor electrodes which are spaced apart from each other. The supporting assembly is disposed on the circuit board. The keycap is moveably disposed above and spaced apart from the circuit board. The supporting assembly disposed between the keycap and the circuit board allows the keycap to be moved between a non-depressed position and a depressed position with respect to the circuit board. The floating conductive structure is disposed on the supporting assembly, and an orthogonal projection of the floating conductive structure on the circuit board overlaps with the pair of sensor electrodes.

Abstract: A package structure and a method of forming the same are provided. The package structure includes an integrated circuit die and a redistribution structure bonded to the integrated circuit die. The redistribution structure includes a first insulating layer, a second insulating layer interposed between the first insulating layer and the integrated circuit die, and a first metallization pattern in the first insulating layer and the second insulating layer. The first metallization pattern includes a first conductive line and a first conductive via coupled to the first conductive line. The first conductive line is in the second insulating layer. The first conductive via is in the first insulating layer. The first conductive line includes a first conductive pad coupled to the first conductive via, a second conductive pad, and a curved portion connecting the first conductive pad to the second conductive pad.

Abstract: A package structure and a method of forming the same are provided. The package structure includes an integrated circuit die and a redistribution structure bonded to the integrated circuit die. The redistribution structure includes a first insulating layer, a second insulating layer interposed between the first insulating layer and the integrated circuit die, and a first metallization pattern in the first insulating layer and the second insulating layer. The first metallization pattern includes a first conductive line and a first conductive via coupled to the first conductive line. The first conductive line is in the second insulating layer. The first conductive via is in the first insulating layer. The first conductive line includes a first conductive pad coupled to the first conductive via, a second conductive pad, and a curved portion connecting the first conductive pad to the second conductive pad.

Abstract: Examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. In some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. The stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: A method for specifying layout of subpictures in video pictures is provided. A video decoder receives data from a bitstream to be decoded as a current picture of a video. For a current subpicture of a set of subpictures of the current picture, the video decoder determines a position of the current subpicture based on a width and a height of the current picture and a previously determined width and height of a particular subpicture in the set of subpictures. The video decoder reconstructs the current picture and the current subpicture based on the determined position.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A method includes forming a first dielectric layer, forming a first redistribution line including a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes depositing a conductive material into the via opening to form a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, and the second via is offset from a center line of the conductive bump.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.