Abstract: The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.

Abstract: The present invention provides a circuit board including a substrate, at least one lead, at least one bump, and a solder layer. The lead is disposed on the substrate, and the bump is disposed on the lead. The solder layer covers the lead and the bump.

Abstract: An electronic device includes an upper cover and a main body. A sliding assembly is disposed between the upper cover and the main body and includes a sliding portion, a spring, and a track with a first positioning portion disposed at the center of a side of the track and two second positionings portion disposed on two ends of the side of the track. The spring including an engaging portion and two ends, and the sliding portion are fixed on the cover. The engaging portion and the ends form an included angle. The sliding portion is movably connected to the track and slides thereon. When the sliding portion slides on the track, the engaging portion is engaged with one of the first positioning portion and the second positioning portions.

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover plate and plural parallel folder rings piercing through an edge of the cover plate. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and a movable arm. The movable arm has two opposite ends, in which one end thereof is fixed on one of the opposite ends of the column-shaped battery portion, and the other end thereof is movably disposed on one side of the main body.

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover and plural parallel folder rings piercing through an edge of the cover. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and two shafts. Each shaft respectively pivots the column-shaped battery portion and the main body at two opposite end of the shaft.

Abstract: A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted with the conductive layer via interconnectors.

Abstract: An electronic device includes an upper cover and a main body. A sliding assembly is disposed between the upper cover and the main body and includes a sliding portion, a spring, and a track with a first positioning portion disposed at the center of a side of the track and two second positionings portion disposed on two ends of the side of the track. The spring including an engaging portion and two ends, and the sliding portion are fixed on the cover. The engaging portion and the ends form an included angle. The sliding portion is movably connected to the track and slides thereon. When the sliding portion slides on the track, the engaging portion is engaged with one of the first positioning portion and the second positioning portions.

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover and plural parallel folder rings piercing through an edge of the cover. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and two shafts. Each shaft respectively pivots the column-shaped battery portion and the main body at two opposite end of the shaft.

Abstract: A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover plate and plural parallel folder rings piercing through an edge of the cover plate. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and a movable arm. The movable arm has two opposite ends, in which one end thereof is fixed on one of the opposite ends of the column-shaped battery portion, and the other end thereof is movably disposed on one side of the main body.

Abstract: A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted with the conductive layer via interconnectors.

Abstract: A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.

Abstract: A semiconductor device including a semiconductor substrate, a contact pad, a passivation layer, a bump, and a seeding layer is provided. The semiconductor substrate has an active surface. The contact pad is disposed on the active surface. The passivation layer is disposed on the active surface and exposes a central part of the contact pad. The seeding layer is disposed on the exposed central part of the contact pad. The bump has a top surface, a bottom surface opposite to the top surface, and a side surface connecting the top surface and the bottom surface. The bump is disposed on the seeding layer. The bump is placed in contact with the seeding layer by the bottom surface and by part of the side surface.

Abstract: A method of manufacturing a chip on film (COF) is provided, including: providing a flexible circuit board; and forming a plurality of leads on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um and a cross-section shape is substantially rectangular. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board, is provided. Each lead has a thickness of 8 um˜15 um, and lead widths of the leads are based on pitch widths of a plurality of bumps corresponding to the leads. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um, and a lead width of each of the leads is greater than a bump width minus 4 um.

Abstract: A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.

Abstract: A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.

Abstract: A chip structure and a bonding pad are provided. The chip structure comprises a chip and at least a bonding pad. The chip has an active surface. The bonding pad is disposed on the active surface of the chip. The bonding pad comprises a polygonal body and a plurality of first protruding portions. The polygonal body has a first planar surface and a corresponding second planar surface. The second planar surface of the polygonal body is in contact with the chip. The first protruding portions are disposed on the first planar surface at the corner regions of the polygonal body. By modifying the geometric shape of the bonding pad, the yield of bonding the chip structure and another device together through the bonding pad is increased.

Abstract: A chip structure and a bonding pad are provided. The chip structure comprises a chip and at least a bonding pad. The chip has an active surface. The bonding pad is disposed on the active surface of the chip. The bonding pad comprises a polygonal body and a plurality of first protruding portions. The polygonal body has a first planar surface and a corresponding second planar surface. The second planar surface of the polygonal body is in contact with the chip. The first protruding portions are disposed on the first planar surface at the corner regions of the polygonal body. By modifying the geometric shape of the bonding pad, the yield of bonding the chip structure and another device together through the bonding pad is increased.

Abstract: An electrical connection structure for electrically connecting with a chip and a bearing element is provided. The chip has a first surface. The bearing element has a second surface corresponding to the first surface. The electrical connection structure includes two outer contact points on the first surface, M inner contact points on the first surface and correspond to the inner side of the first surface, two outer conducting wires on the second surface, and M inner conducting wires on the second surface and corresponding to the M inner contact points. The chip and the bearing element are electrically connected via the electrical contact between the two outer contact points and the two outer conducting wires, and the electrical connection between the M inner contact points and the M inner conducting wires. M is a positive integer greater than or equal to 2.

Abstract: A semiconductor device comprises a substrate having contact pads each covered by under bump metallurgy and a plurality of bump electrodes respectively provided on the under bump metallurgy covering the contact pads. According to one embodiment of the present invention, the semiconductor device is characterized by having at least one contact pad (e.g., a test contact pad) which is not provided with any bump electrode but still has under bump metallurgy provided thereon. According to another embodiment of the present invention, the semiconductor device is characterized by having at least a conductive line formed of the same material as the under bump metallurgy for interconnecting at least two of the contact pads. The present invention further provides methods of manufacturing the semiconductor devices.

Abstract: A casing for an electronic device and a method producing the same. The method comprises the following steps. First, a first member is formed of a first metallic material, and a second member is formed of a second metallic material. In the second member, at least one step portion is formed. Then, the casing is produced by combining the first member and the second member in a manner such that the step portion corresponds to the unit and the second member is nearer to the unit than the first member.