Patents by Inventor Chia-Hung Hsu

Chia-Hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122078
    Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
  • Publication number: 20240114688
    Abstract: A memory structure including a substrate, a first doped region, a second doped region, a first gate, a second gate, a first charge storage structure, and a second charge storage structure is provided. The first gate is located on the first doped region. The second gate is located on the second doped region. The first charge storage structure is located between the first gate and the first doped region. The first charge storage structure includes a first tunneling dielectric layer, a first dielectric layer, and a first charge storage layer. The second charge storage structure is located between the second gate and the second doped region. The second charge storage structure includes a second tunneling dielectric layer, a second dielectric layer, and a second charge storage layer. The thickness of the second tunneling dielectric layer is greater than the thickness of the first tunneling dielectric layer.
    Type: Application
    Filed: November 21, 2022
    Publication date: April 4, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Chien-Hung Chen, Chia-Hui Huang, Ling Hsiu Chou, Jen Yang Hsueh, Chih-Yang Hsu
  • Patent number: 11931456
    Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: March 19, 2024
    Assignee: MegaPro Biomedical Co. Ltd.
    Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
  • Patent number: 11925454
    Abstract: A respiratory function testing system includes an air transforming device, a sound reception device and an operation device. The air transforming device is configured to collect exhaled and/or inhaled air for a predetermined period and generate a wide frequency range sound signal according to the collected respired air. The wide frequency range sound signal at least contains an ultrasonic signal. The sound reception device is configured to receive and record the wide frequency range sound signal as an audio file. The operation device is in communication with the sound reception device and is configured to receive and compute the audio file to generate a respiratory function parameter. Besides, the recorded wide frequency range sound signal may be converted into a spectrogram for further applications, and the computation of the audio file can be replaced by analyzing the spectrogram. A respiratory function testing method corresponding to the respiratory function testing system is also provided.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: March 12, 2024
    Inventors: Chia-Chi Su, Hsiao-Pao Yen, Pei-Ling Hsu, Chia-Hung Chen
  • Patent number: 11913876
    Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: February 27, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Jung Chang, Jui-Hung Tsai, Ying-Hao Wang, Chih-Hao Hsu
  • Publication number: 20240031438
    Abstract: The present invention provides a chip including a plurality of application circuits and a UART interface. The plurality of application circuits, configured to generate a plurality of data, respectively, wherein the plurality of data respectively generated by the plurality of application circuits are transmitted to another chip via the same UART interface.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chia-Hung Hsu, Cheng-Hao Yao, Jyun-Ji Wang, Yu-Lin Tsai
  • Patent number: 11874806
    Abstract: A file versioning management method and a file system executing the method are provided. The method includes: writing a file into a first file path, wherein the first file path includes a first folder, generating a second file path according to the first file path, wherein the second file path includes a second folder at least one level under the first folder; and creating a link pointing from the file of the first file path to a next level of the second folder so as to generate a version information file at the next level of the second folder and make the link point to the version information file.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: January 16, 2024
    Assignee: QNAP SYSTEMS, INC.
    Inventor: Chia-Hung Hsu
  • Publication number: 20230406446
    Abstract: The present invention illustrates an electrical connector for detachable installation in a bicycle frame, which is detachably installed in a lower fork of a bicycle frame and includes a fixed seat and an inserted seat. The fixed seat is installed in the aforementioned lower fork. The fixed seat is hollow in shape. The inserted seat is inserted in the fixed seat movably back and forth. The inserted seat has a first end surface, a second end surface opposite to the first end surface, and a core shaft installation hole penetrating through the first and second end surfaces. The first end surface of the inserted seat is provided with a set of electrically conductive structure. As a result, when a wheel hub motor is installed on the bicycle frame, the electrical connector is able to be pushed to be electrically connected with the wheel hub motor as needed.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 21, 2023
    Inventors: PIN-CHIEH FENG, CHIA-HUNG HSU, SHIH-WEI NIEN
  • Patent number: 11746226
    Abstract: The present invention provides a polymer composition for manufacturing a foam, the polymer composition comprising a vinyl aromatic based copolymer and a processing aid, wherein the amount of the processing aid in the total weight of the polymer composition is equal to or more than 5 wt % and equal to or less than 75 wt %; and the polymer composition does not comprise ethylene-vinyl acetate copolymer, ethylene-butyl acrylate copolymer, ethylene-?-olefin copolymer, homopolymer and copolymer of polyethylene, homopolymer and copolymer of polypropylene, homopolymer and copolymer of polybutene and olefin-based ionic polymer. The present invention also provides the foam and the method for forming the same.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 5, 2023
    Assignee: TSRC CORPORATION
    Inventors: Hsi-Hsin Shih, Chia-Hung Hsu, Pang-Hsuan Lin, Yun-Shiuan Yeh
  • Publication number: 20230195699
    Abstract: A file versioning management method and a file system executing the method are provided. The method includes: writing a file into a first file path, wherein the first file path includes a first folder, generating a second file path according to the first file path, wherein the second file path includes a second folder at least one level under the first folder; and creating a link pointing from the file of the first file path to a next level of the second folder so as to generate a version information file at the next level of the second folder and make the link point to the version information file.
    Type: Application
    Filed: January 28, 2022
    Publication date: June 22, 2023
    Inventor: Chia-Hung HSU
  • Publication number: 20230012045
    Abstract: A method for Co-Reception (Co-Rx) operation of multiple transceiver radios sharing the same antenna and Low Noise Amplifier (LNA) is provided. A first receiver radio of a wireless communication device determines the first gain mode of an LNA based on the first signal indicator. A second receiver radio of the wireless communication device determines the second gain mode of the LNA based on the second signal indicator. The LNA is shared by the first receiver radio and the second receiver radio and is coupled to an antenna. A Packet Traffic Arbitration (PTA) circuitry of the wireless communication device configures the LNA to operate in the first gain mode or the second gain mode based on the priority levels of the first receiver radio and the second receiver radio.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 12, 2023
    Inventors: Li-Wei CHEN, Tsai-Yuan HSU, Chen-Feng LIU, Wen-Ying CHIEN, Chia-Hung HSU, Yu-Lin TSAI
  • Publication number: 20210087347
    Abstract: The present invention provides a thermoplastic elastomer composition for foaming. The thermoplastic elastomer composition comprises: (A) an ethylene-based copolymer; (B) an olefin block copolymer; (C) an unsaturated aliphatic rubber; and (D) a crosslinking agent. The olefin block copolymer is different from the ethylene-based copolymer. The weight ratio of the unsaturated aliphatic rubber (C) to the olefin block copolymer (B) is 1:1.5 to 1:5.
    Type: Application
    Filed: September 18, 2020
    Publication date: March 25, 2021
    Inventors: Wen Wei Cheng, Hsi-Hsin Shih, Chia-Hung Hsu, Yu Tsan Tseng
  • Publication number: 20200224023
    Abstract: The present invention provides a polymer composition for manufacturing a foam, the polymer composition comprising a vinyl aromatic based copolymer and a processing aid, wherein the amount of the processing aid in the total weight of the polymer composition is equal to or more than 5 wt % and equal to or less than 75 wt %; and the polymer composition does not comprise ethylene-vinyl acetate copolymer, ethylene-butyl acrylate copolymer, ethylene-?-olefin copolymer, homopolymer and copolymer of polyethylene, homopolymer and copolymer of polypropylene, homopolymer and copolymer of polybutene and olefin-based ionic polymer. The present invention also provides the foam and the method for forming the same.
    Type: Application
    Filed: December 5, 2019
    Publication date: July 16, 2020
    Inventors: Hsi-Hsin Shih, Chia-Hung Hsu, Pang-Hsuan Lin, Yun-Shiuan Yeh
  • Publication number: 20170271933
    Abstract: An axial flux motor includes a rotor and a plurality of stators. The stators are disposed around the rotor. Each stator includes a magnetic modular body, and a winding. The magnetic modular body includes a magnetic base and a top magnetic member. The magnetic base has an armature core surrounded by the winding, and a first connecting portion disposed on the armature core. The top magnetic member has a second magnetic face, and a second connecting portion that is disposed on the second magnetic face and that engages complementarily to the first connecting portion. The top magnetic member is connected to the armature core through an inter-engagement of the first and second connecting portions.
    Type: Application
    Filed: February 23, 2017
    Publication date: September 21, 2017
    Applicant: BIGBEST SOLUTIONS, INC.
    Inventors: Chia-Hung Hsu, Ray-Min Chen
  • Publication number: 20170222495
    Abstract: An electric motor includes an inner rotor unit including a rotary body having an outer ring portion and multiple magnetic members mounted to the outer ring portion, and a stator unit including multiple alternately arranged first and second stators. Each first stator includes a first magnetic conductive member and a first coil. Each second stator includes a second magnetic conductive member disposed between two adjacent first stators, and a second coil . An imaginary circle is defined to be centered at a central point of the rotary body and to pass through central points of the first coils. The second coil of each of the second stators has a central point that does not lie on the imaginary circle.
    Type: Application
    Filed: January 24, 2017
    Publication date: August 3, 2017
    Inventors: Chia-Hung Hsu, Ray-Min Chen
  • Patent number: 9178390
    Abstract: A motor comprises a coil structure and a plurality of magnetic materials. The coil structure includes three winding groups, each of which has a plurality of winding portions. The winding portions have an interval therebetween, and are electrically connected by a wire. The magnetic materials are disposed adjacent to the coil structure and corresponding to the winding groups. Accordingly, the motor has more magnetic materials within the same bending angle of the enameled wire, so that the motor can output larger torsion and power to enhance the motor efficiency.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: November 3, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Sheng-En Mai, Chia-Hung Hsu, Yen-Chun Huang
  • Publication number: 20140138809
    Abstract: A package structure and a manufacturing method thereof are disclosed. The package structure includes an outer lead, a driver chip, a soft material, and a solidified material. There is a distance between the driver chip and the outer lead. The soft material is used to fill the space in the package structure except the driver chip and the outer lead. The solidified material is formed in at least one region on the soft material between the driver chip and the outer lead. The hardness of the solidified material is higher than the hardness of the soft material.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 22, 2014
    Inventors: Chia-Hung Hsu, Ching-Yung Chen
  • Patent number: 8518743
    Abstract: A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: August 27, 2013
    Assignee: Raydium Semiconductor Corporation
    Inventors: Chia-Hung Hsu, Ching-San Lin, Chin-Yung Chen
  • Patent number: D1000194
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: October 3, 2023
    Assignee: Takeya USA Corporation
    Inventor: Chia Hung Hsu
  • Patent number: D1017325
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 12, 2024
    Assignee: Takeya USA Corporation
    Inventor: Chia-Hung Hsu