Abstract: A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block.

Abstract: A motor comprises a coil structure and a plurality of magnetic materials. The coil structure includes three winding groups, each of which has a plurality of winding portions. The winding portions have an interval therebetween, and are electrically connected by a wire. The magnetic materials are disposed adjacent to the coil structure and corresponding to the winding groups. Accordingly, the motor has more magnetic materials within the same bending angle of the enameled wire, so that the motor can output larger torsion and power to enhance the motor efficiency.

Abstract: An autonomous robot and a positioning method thereof are disclosed. The autonomous robot includes an environment information detection device, a map construction module, a setting module, a path planning module, and a driving module. The environment information detection device is for detecting environment information about an environment where the autonomous robot is situated. An environment map is constructed based on the environment information detected by the environment information detection device. The setting module is used for setting a working boundary on the environment map. The path planning module is for planning a moving path in a working zone and is electrically connected to the setting module. The driving module for driving the autonomous robot to move along the moving path is electrically connected to the path planning module.

Abstract: An autonomous electronic device and a method of controlling the motion of the autonomous electronic device thereof are disclosed. The autonomous electronic device includes a motor, a wheel, a processing module, a motor controlling module, and a motion sensor module. The motor is used for driving the wheel. The motor controlling module is used for controlling the motor. The motion sensor module is used for generating a sensing signal according to surrounding conditions encountered by the autonomous electronic device and transferring the signal to the processing module, wherein when the sensing signal is an abnormal movement signal, the processing module controls the motor to adapt to the surrounding conditions via the motor controlling module according to the abnormal movement signal.

Abstract: The invention discloses a touch sensing device, which includes a containing space, a first substrate layer, a second substrate layer, a driver, and a sensor. The first substrate layer and the second substrate layer define the containing space for containing a fluid. The driver can provide charges to a first conducting layer of the first substrate layer, a second conducting layer of the second substrate layer, and the fluid. The sensor can sense the electric characteristics of the fluid. When a point unit approaches the touch sensing device and influences the charges, the appearance of the fluid could be changed and then the electric characteristics could also be changed.

Abstract: The disclosed simplified test framework comprises a first module substituting the mobile network module of the computer to communicate with a mobile phone network, configured with signal pins of VCC connected to a voltage of +3V, RST, VPP, CLK, and DATA while enabling the VCC to power source; and a second module substituting the subscriber identity module of the computer to identify a subscriber's identity on the computer, configured with signal pins of VCC, GND, RST, VPP, CLK, and DATA; wherein the VCC, RST, CLK, and DATA of the first module is connected to those of the second module, respectively, a light emitting diode connects the VCC and RST of the second module, the RST and CLK of the first module are connected to each other, an impedance connects the CLK and DATA of the second module, and the DATA is connected to an electric ground.

Abstract: A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block.

Abstract: A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface.

Abstract: An LED light source device with color temperature adjustment capability includes at least one light-emitting diode and a color temperature conversion element. A front end of the light-emitting diode has a light-emitting end. The color temperature conversion element is disposed in front of the light-emitting end of the light-emitting diode. The color temperature conversion element includes a light-transmitting substrate and color temperature conversion materials. The color temperature conversion materials are provided on/in the light-transmitting substrate. The color temperature conversion materials include high refractive index materials and low refractive index materials. The high refractive index materials that are selected from the group consisting of TiO2, Ti3O5 or Ta2O5. The low refractive index materials that are selected from the group consisting of SiO2 or MgF2. The light beam emitted by the light-emitting diode passes through the color temperature conversion element to change its color temperature.

Abstract: The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

Abstract: The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

Abstract: A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface.

Abstract: The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

Abstract: To control chroma and brightness in a backlight module, a plurality of reference values of a plurality of monochromatic light beams are provided, and a brightness reference value is provided for the light formed of the monochromatic light beams. Then, a plurality of first light signals of the monochromatic light beams, and a second light signal of the light formed of the monochromatic light beams are sensed and compared with the reference values and the brightness reference value, respectively. Finally, the monochromatic light beams outputted by the plurality of LEDs is calibrated according to a comparison result of the plurality of first light signals with the plurality of reference values and a comparison result of the second light signal with the brightness reference value.

Abstract: The invention discloses a touch sensing device, which includes a containing space, a first substrate layer, a second substrate layer, a driver, and a sensor. The first substrate layer and the second substrate layer define the containing space for containing a fluid. The driver can provide charges to a first conducting layer of the first substrate layer, a second conducting layer of the second substrate layer, and the fluid. The sensor can sense the electric characteristics of the fluid. When a point unit approaches the touch sensing device and influences the charges, the appearance of the fluid could be changed and then the electric characteristics could also be changed.

Abstract: A method for producing an anti-microbial fabric includes: (a) depositing anti-microbial metal-based clusters on an outer surface of a fabric substrate by sputtering a metal-based target material which possesses anti-microbial activity and which is prone to oxidation upon air exposure; and (b) depositing oxidation-resistant metal-based clusters on the outer surface of the fabric substrate by sputtering an oxidation-resistant metal-based target material in such an amount as to enable the oxidation-resistant metal-based clusters to partially cover the anti-microbial metal-based clusters so as to permit exposure of at least a part of one of the anti-microbial metal-based clusters. An anti-microbial fabric produced thereby is also disclosed.

Abstract: The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

Abstract: The invention provides a semiconductor device package. The package includes a chip disposed on a supported board and a conductive path formed between the chip and the supported board, on the backside of the supported board, or on the chip, so that the conductive path does not have to go around a region where the chip is located. Accordingly, the dimensions of the semiconductor device package are reduced.

Abstract: An apparatus for film deposition on a continuous flexible web includes: a deposition chamber; a web-supporting drum disposed rotatably in the deposition chamber and having an outer surface for supporting the flexible web thereon; a web-conveying unit including a web-supplying roller and a web-take-up roller for conveying the continuous flexible web from the web-supplying roller onto the outer surface of the web-supporting drum and then to the web-take-up roller; and a plurality of sputtering guns disposed around the outer surface of the web-supporting drum for depositing a film on the first surface of the flexible web on the outer surface of the web-supporting drum.

Abstract: The present invention discloses a package structure for light-emitting elements, wherein a horizontally-extending thermal conductive plate contacts a thermal conductive substrate having a larger heat-dissipating area. Via such a horizontal heat-dissipation mechanism, the heat generated by light-emitting elements is dissipated at a higher rate; thereby, the light-emitting elements have a higher working efficiency and a longer service life.