Abstract: A semiconductor light emitting device includes a multi-quantum-well structure, a first capping layer, a second capping layer, and an electron barrier layer stacked in order. The multi-quantum-well structure includes a plurality of alternately-stacked potential barrier layers and potential well layers. The first capping layer is a semiconductor layer, and the second capping layer is a p-doped semiconductor layer. Each of the first and second capping layers has an aluminum mole fraction larger than that of each of the potential barrier layers, and the aluminum mole fraction of the first capping layer is larger than that of at least a portion of the electron barrier layer. A method for preparing the semiconductor light emitting device is also provided.

Abstract: Disclosed is an input/output circuit for a physical unclonable function generator circuit. In one embodiment, a physical unclonable function (PUF) generator includes: a PUF cell array comprising a plurality of bit cells configured in a plurality of columns and at least one row, and at least one input/output (I/O) circuit each coupled to at least two neighboring columns of the PUF cell array, wherein the at least one I/O circuit each comprises a sense amplifier (SA) with no cross-coupled pair of transistors, wherein the SA comprises two cross-coupled inverters with no access transistor and a SA enable transistor, and wherein the at least one I/O circuit each is configured to access and determine logical states of at least two bit cells in the at least two neighboring columns; and based on the determined logical states of the plurality of bit cells, to generate a PUF signature.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A keyboard and a key structure capable of displaying instant image thereof are provided. The key structure includes a display unit, a circuit membrane, an elastic member, a key seat, a first supporting frame, a second supporting frame, and a translucent keycap. The first supporting frame has two first arms and two axle portions. The ends of the first arms are slidably disposed on an accommodation portion of the key seat. The second supporting frame has two second arms and two linking holes. The ends of the second arms are pivotally connected to the accommodation portion. The linking hole is elongated-shaped. When the translucent keycap is not pressed, the axle portion abuts against one hole-end of the linking hole. When the translucent keycap is pressed, the axle portion abuts against another one hole-end of the linking hole.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.

Abstract: A device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. The second semiconductor die is stacked over and electrically connected to the first semiconductor die. The anti-arcing layer is in contact with the second semiconductor die. The first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. Furthermore, methods for fabricating device dies are provided.

Abstract: The present invention relates to an organic thin film transistor (OTFT) comprising an organic semiconductor layer (2) arranged between a source terminal (3) and a drain terminal (4). The OTFT further includes a front gate (5) electrode arranged on one side of the organic semiconductor layer and a back gate electrode (6) arranged on the opposite side of the organic semiconductor layer. The front and back gate electrodes are arranged to control the current flow in the organic semiconductor layer upon application of a voltage and the back gate electrode is electrically connected to one of: the front gate electrode and the source terminal. OTFT's according to the present invention, with a connection between the back gate and the source or front gate, exhibit improved turn on voltage stability, lower power consumption and improved bias stress stability compared to single gate and back gate isolated OTFTs.

Abstract: A magnetic shield reduces external noise in a chamber including a target and at least one electromagnet for copper physical vapor deposition (PVD). The shield may have a thickness in a range from approximately 0.1 mm to approximately 10 mm to provide sufficient protection from radio frequency and other electromagnetic signals. As a result, copper atoms in the chamber undergo less re-direction from external noise. Additionally, even when hardware failure occurs during PVD (e.g., an electromagnet malfunctions, a wafer stage is not level, and/or a flow optimizer induces too much shift, among other examples), the copper atoms are less susceptible to small re-directions from external noise. As a result, back end of line (BEOL) and/or middle end of line (MEOL) conductive structures are formed in a more uniform manner, which increases conductivity and improves lifetime of an electronic device including the BEOL and/or MEOL conductive structures.

Abstract: A method of cleaning a nozzle of a gas supply system includes loading an apparatus including a carrier and an automated nozzle cleaning system in the carrier onto a load port containing a gas supply system. The automated nozzle cleaning system includes a first nozzle cleaning device, a second nozzle cleaning device and a monitoring device, and the carrier is positioned to enable a gas inlet of the carrier to be connected to a nozzle of the gas supply system. The method also includes vacuuming contaminant particles from the nozzle using the first nozzle cleaning device, mechanically removing the contaminant particles adhering to the nozzle off the nozzle using the second nozzle cleaning device, and measuring a level of the contaminant particles using the monitoring device.

Abstract: A magnetic shield reduces external noise in a chamber including a target and at least one electromagnet for copper physical vapor deposition (PVD). The shield may have a thickness in a range from approximately 0.1 mm to approximately 10 mm to provide sufficient protection from radio frequency and other electromagnetic signals. As a result, copper atoms in the chamber undergo less re-direction from external noise. Additionally, even when hardware failure occurs during PVD (e.g., an electromagnet malfunctions, a wafer stage is not level, and/or a flow optimizer induces too much shift, among other examples), the copper atoms are less susceptible to small re-directions from external noise. As a result, back end of line (BEOL) and/or middle end of line (MEOL) conductive structures are formed in a more uniform manner, which increases conductivity and improves lifetime of an electronic device including the BEOL and/or MEOL conductive structures.

Abstract: An apparatus for automatically cleaning a nozzle of a gas supply system is provided. The apparatus includes a carrier with a gas inlet that is adapted to sealingly mate with the nozzle of the gas supply system and an automated nozzle cleaning system in the carrier. The automated nozzle cleaning system includes a first nozzle cleaning device, a second nozzle cleaning device, and a function switching plate. The function switching plate comprises a plurality of through holes, a first through hole of the plurality of through holes is configured to engage the first nozzle cleaning device with the gas inlet when the function switching plate is positioned at a first position, and a second through hole of the plurality of through holes is configured to engage the second nozzle cleaning device with the gas inlet when the function switching plate is positioned at a second position.

Abstract: A key device for a keyboard includes a circuit board, a keycap located over the circuit board, a supporting plate disposed under the circuit board, a first stabilizing member, a second stabilizing member and two supporting members. The supporting plate includes two first mounting seats cooperatively defining a rotating axis extending in a first direction. Each of the first stabilizing member and the second stabilizing member is made of a plastic material, slidably engages the keycap, and is rotatably mounted to the first mounting seats. When the keycap is pressed toward the supporting plate, the first stabilizing member and the second stabilizing member rotate relative to the supporting plate about the rotating axis.

Abstract: Methods, systems, apparatuses, and computer-readable storage mediums are described for altering a power consumption of a battery-powered device. In an example system, a power monitor is configured to measure, for each of a plurality of components in the battery-powered device, a power consumption of the component during execution of an AI model that is stored on the device. A consumption analyzer is configured to predict whether a battery criterion would be satisfied during operation of the battery-powered device based on the measured power consumption of the components. In examples, operation of the device may include operation of the device in which the AI model is executed. A model retraining engine retrains the AI model if the battery criterion is not predicted to be satisfied during operation of the device, and a retrained AI model may be provided for execution on the battery-powered device.

Abstract: A key device for a keyboard includes a circuit board, a keycap located over the circuit board, a supporting plate disposed under the circuit board, a first stabilizing member, a second stabilizing member and two supporting members. The supporting plate includes two first mounting seats cooperatively defining a rotating axis extending in a first direction. Each of the first stabilizing member and the second stabilizing member is made of a plastic material, slidably engages the keycap, and is rotatably mounted to the first mounting seats. When the keycap is pressed toward the supporting plate, the first stabilizing member and the second stabilizing member rotate relative to the supporting plate about the rotating axis.

Abstract: A semiconductor component burn-in test module includes a burn-in board and an external power transmission component. The burn-in board includes a plurality of burn-in seats, wherein a plurality of chips are disposed on the burn-in seats. The external power transmission component is arranged at opposite two sides of the burn-in board, where the external power transmission component includes a plurality of conductive members and a plurality of terminal seats. The burn-in board is provided with a plurality of wirings corresponding to the external power transmission component. As such, electric power can be conveyed to the plural burn-in seats of the burn-in board, through the plural terminal seats and the plural conductive strips. This decreases the length and the number of copper foil wirings in the burn-in boards for power transmission, so as to lower the cost of the burn-in boards.

Abstract: Methods, systems, apparatuses, and computer-readable storage mediums are described for altering a power consumption of a battery-powered device. In an example system, a power monitor is configured to measure, for each of a plurality of components in the battery-powered device, a power consumption of the component during execution of an AI model that is stored on the device. A consumption analyzer is configured to predict whether a battery criterion would be satisfied during operation of the battery-powered device based on the measured power consumption of the components. In examples, operation of the device may include operation of the device in which the AI model is executed. A model retraining engine retrains the AI model if the battery criterion is not predicted to be satisfied during operation of the device, and a retrained AI model may be provided for execution on the battery-powered device.

Abstract: The present invention relates to novel antagonizing antibodies for CD73. The invention also relates to nucleic acids encoding such antibody molecules; to methods for preparing such antibody molecules; to host cells expressing or capable of expressing such antibody molecules; to compositions comprising such antibody molecules; and to uses of such antibody molecules or such compositions, in particular for therapeutic purposes in the field of cancer diseases.

Abstract: A semiconductor component burn-in test module includes a burn-in board and an external power transmission component. The burn-in board includes a plurality of burn-in seats, wherein a plurality of chips are disposed on the burn-in seats. The external power transmission component is arranged at opposite two sides of the burn-in board, where the external power transmission component includes a plurality of conductive members and a plurality of terminal seats. The burn-in board is provided with a plurality of wirings corresponding to the external power transmission component. As such, electric power can be conveyed to the plural burn-in seats of the burn-in board, through the plural terminal seats and the plural conductive strips. This decreases the length and the number of copper foil wirings in the burn-in boards for power transmission, so as to lower the cost of the burn-in boards.