Abstract: Systems and methods herein are directed towards semiconductor devices and methods of manufacture thereof, including the formation of a plurality of passive trenches that act as a single passive trench and may be connected to gate electrodes and/or emitters in various embodiments.

Abstract: A drill structure comprises a shank part and a bit part. A web is formed on the front end of the bit part. Two sides of the web are tilted backward to form two cutting faces. At least one flute (chip-discharge groove) is formed on the surface of the bit part. Each cutting face includes a primary cutting face and a secondary cutting face. The thickness of the prismatic web edge of at least one primary cutting face is smaller than the outer-side width of the primary cutting face. An auxiliary cutting face is extended to the wall of the flute from the cutting edge of the primary cutting face and a portion of a blade back of the secondary cutting face of another cutting face. The present invention decreases the drilling resistance during drilling a hole and increases the service life of the drill bit.

Abstract: A paper size detection module includes a position sensing assembly and a sliding block assembly. The position sensing assembly is installed on a bottom side of a paper supporting plate. The position sensing assembly includes a carrier plate, a sensing circuit board and plural elastomers. The first ends of the elastomers are connected with the sensing circuit board. The second ends of the elastomers are protruded out of the carrier plate and have corresponding pressed surfaces. The sliding block assembly includes a paper positioning block and at least one roller. The paper positioning block is installed on the paper supporting plate. The roller is connected with the paper positioning block and rolled along the carrier plate. When a position of the pressed surface rolled and pressed by the roller is detected, the sensing circuit board generates a paper size signal.

Abstract: A paper size detection module includes a position sensing assembly and a sliding block assembly. The position sensing assembly is installed on a bottom side of a paper supporting plate. The position sensing assembly includes a carrier plate, a sensing circuit board and plural elastomers. The first ends of the elastomers are connected with the sensing circuit board. The second ends of the elastomers are protruded out of the carrier plate and have corresponding pressed surfaces. The sliding block assembly includes a paper positioning block and at least one roller. The paper positioning block is installed on the paper supporting plate. The roller is connected with the paper positioning block and rolled along the carrier plate. When a position of the pressed surface rolled and pressed by the roller is detected, the sensing circuit board generates a paper size signal.

Abstract: The present disclosure provides a magnetic resonance (MR) image analysis method for a patient who underwent radiotherapy. The method includes the steps: receiving an MR image set of a patient and a dose map of a radiotherapy plan; converting the dose intensity distribution of the dose map into the relative spatial positions in the MR image set; selecting a radiation dose and a radiation exposure region, wherein the radiation exposure region has radiation intensity being equal to or higher than the radiation dose; using the radiation exposure region to determine a region of interest (ROI) in the MR image set; classifying the voxels inside the ROI of the MR image set into different clusters according to the grayscale values of the voxels inside the ROI; and calculating the volume or ratios of the different clusters inside the ROI. The present disclosure also provides a method for evaluating risks of radiotherapy.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: A composition for cleaning integrated circuit substrates, the composition comprising: water; an oxidizer comprising an ammonium salt of an oxidizing species; a corrosion inhibitor comprising a primary alkylamine having the general formula: R?NH2, wherein R? is an alkyl group containing up to about 150 carbon atoms and will more often be an aliphatic alkyl group containing from about 4 to about 30 carbon atoms; optionally, a water-miscible organic solvent; optionally, an organic acid; optionally, a buffer species; optionally, a fluoride ion source; and optionally, a metal chelating agent.

Abstract: A drill structure comprises a shank part and a flute part disposed on one end of the shank part. The front region of the flute part has a web. Two sides of the web are tilted backward to form a first cutting face and a second cutting face. At least one flute is formed on the outer surface of the flute part. The flute part has a bit core in the center thereof. The radius of the cross section of the bit core is defined as the web thickness. The first cutting face includes a first primary cutting face and a first secondary cutting face. The second cutting face includes a second primary cutting face and a second secondary cutting face. The first cutting edge of the first primary cutting face is not parallel with the first connection edge. The width of the primary cutting face width is larger than the web thickness. The drill structure has high cutting ability and long service life.

Abstract: Systems and methods herein are directed towards semiconductor devices and methods of manufacture thereof, including the formation of a plurality of passive trenches that act as a single passive trench and may be connected to gate electrodes and/or emitters in various embodiments.

Abstract: Described herein is an aqueous composition for treating a substrate including patterns having line-space dimensions of 50 nm or below to prevent collapse of the patters, the composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and an optional pH adjusting agent.

Abstract: A control module is installed in a multi-antenna device having a wireless chip, and comprises a multi-antenna system, an antenna control unit, an application unit and a microprocessor. The multi-antenna system comprises antenna units. Each antenna unit comprises a main antenna and a reflecting unit, with the main antenna generating a radiation pattern in a single polarization direction, and the reflecting unit parallel to the single polarization direction and partially surrounding the main antenna. When a diode is conducted, the reflecting unit forms a rectangular closed slot structure as a reflector of the main antenna; conversely, the reflecting unit does not serve as the reflector. According to the signal strength or data receiving rates of the antenna units, the application unit controls the microprocessor to associate with an algorithm processing procedure to determine whether to conduct the diode for changing a radiation pattern of the multi-antenna system.

Abstract: A power consumption management method for a backlight module includes receiving an object detection signal from an object detector, controlling an image capturing unit to capture an image according to the object detection signal, receiving the image from the image capturing unit, and controlling a power consumption of the backlight module according to the image.

Abstract: Described herein is an etching solution suitable for the simultaneous removal of silicon and silicon-germanium from a microelectronic device, which comprises: water; an oxidizer; a buffer composition comprising an amine compound (or ammonium compound) and a polyfunctional organic acid; a water-miscible solvent; and a fluoride ion source.

Abstract: Stripping solutions that may replace an etching resist ashing process are provided. The stripping solutions are useful for fabricating circuits and/or forming electrodes and/or packaging/bumping applications on semiconductor devices for semiconductor integrated circuits with good photoresist removal efficiency and with low silicon oxide etch rate and low metal etch rates. Methods for their use are similarly provided. The preferred stripping agents contain polar aprotic solvent, water, hydroxylamine, corrosion inhibitor, quaternary ammonium hydroxide and optional surfactant. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: Described herein is an etching solution comprising water; oxidizer; water-miscible organic solvent; fluoride ion source; and optionally, surfactant. Such compositions are useful for the selective removal of silicon-germanium over poly silicon from a microelectronic device having such material(s) thereon during its manufacture.

Abstract: Etching compositions suitable for the selective removal of silicon over silicon-germanium from a microelectronic device comprising: water; at least one of a quaternary ammonium hydroxide compound and an amine compound; water-miscible solvent; optionally surfactant and optionally corrosion inhibitor; and the method of using the etching composition for the selective removal.

Abstract: Described herein is an etching solution comprising water; phosphoric acid solution (aqueous); a fluoride ion source; and a water-miscible organic solvent. Such compositions are useful for the selective removal of tantalum nitride over titanium nitride from a microelectronic device having such material(s) thereon during its manufacture.

Abstract: A control module is installed in a multi-antenna device having a wireless chip, and comprises a multi-antenna system, an antenna control unit, an application unit and a microprocessor. The multi-antenna system comprises antenna units. Each antenna unit comprises a main antenna and a reflecting unit, with the main antenna generating a radiation pattern in a single polarization direction, and the reflecting unit parallel to the single polarization direction and partially surrounding the main antenna. When a diode is conducted, the reflecting unit forms a rectangular closed slot structure as a reflector of the main antenna; conversely, the reflecting unit does not serve as the reflector. According to the signal strength or data receiving rates of the antenna units, the application unit controls the microprocessor to associate with an algorithm processing procedure to determine whether to conduct the diode for changing a radiation pattern of the multi-antenna system.

Abstract: The present disclosure provides a magnetic resonance (MR) image analysis method for a patient who underwent radiotherapy. The method includes the steps: receiving an MR image set of a patient and a dose map of a radiotherapy plan; converting the dose intensity distribution of the dose map into the relative spatial positions in the MR image set; selecting a radiation dose and a radiation exposure region, wherein the radiation exposure region has radiation intensity being equal to or higher than the radiation dose; using the radiation exposure region to determine a region of interest (ROI) in the MR image set; classifying the voxels inside the ROI of the MR image set into different clusters according to the grayscale values of the voxels inside the ROI; and calculating the volume or ratios of the different clusters inside the ROI. The present disclosure also provides a method for evaluating risks of radiotherapy.

Abstract: Disclosed is a hub for charging and other applications when camping or away from power infrastructure. The hub mounts on an elevated surface such as a structure wall or roof to remain out of the way but still accessible. The hub has a body and an attachment ring. The body has a cylindrical column of a first diameter and a base of a greater second diameter. The cylindrical column has an input port along top and exterior threading below the input port. The elongated base has an output port along a bottom. The input port connects to a power source, such as a solar panel, and feeds current to the output port. The cylindrical column passes through an opening of a structure and the attachment ring screws onto the threading exposed on the other side of the structure, thereby attached the hub to the structure.