Patents by Inventor Chia-Lin Liu

Chia-Lin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220310449
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Application
    Filed: June 16, 2022
    Publication date: September 29, 2022
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 11424273
    Abstract: An electrical connection structure includes a substrate, a mating layer on the substrate, a connecting pad on the mating layer, an insulating layer on the mating layer and covering the connecting pad, a connecting line on the insulating layer, and a covering layer on the insulating layer and covering the connecting line. The connecting line extends through the insulating layer to electrically couple to the connecting pad. Both the connecting pad and the connecting line are made of metal or alloy. The mating layer includes yttrium oxide films and silicon oxide films alternating with each other.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: August 23, 2022
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chin-Yueh Liao, Chia-Lin Liu, Yan-Tang Dai, Hung-Che Lu
  • Publication number: 20220255328
    Abstract: An electronic system includes a first device and a second device is provided. The first device includes a power connector, a first connector, a first battery, and a charging controller. The second device includes a second connector and a second battery. The power connector is configured to receive an external voltage. The first battery is electrically connected to the power connector and the first connector. The charging controller is electrically connected to the power connector and the first battery. The second connector is utilized for connecting the first connector. The second battery is electrically connected to the second connector. When the first connector is connected to the second connector, the charging controller selectively connects the first battery and the second battery in a series via the first connector and the second connector according to the level of the first battery and the second battery.
    Type: Application
    Filed: January 21, 2022
    Publication date: August 11, 2022
    Inventors: Chia Jui SHIH, Kai-Chun LIANG, Chia Yu LIU, Kian-Ming CHEE, Yii-Lin WU
  • Patent number: 11387113
    Abstract: A method includes forming a material layer over a substrate, forming a first hard mask (HM) layer over the material layer, forming a first trench, along a first direction, in the first HM layer. The method also includes forming first spacers along sidewalls of the first trench, forming a second trench in the first HM layer parallel to the first trench, by using the first spacers to guard the first trench. The method also includes etching the material layer through the first trench and the second trench, removing the first HM layer and the first spacers, forming a second HM layer over the material layer, forming a third trench in the second HM layer. The third trench extends along a second direction that is perpendicular to the first direction and overlaps with the first trench. The method also includes etching the material layer through the third trench.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: July 12, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu, Kuei-Shun Chen, Ru-Gun Liu, Shau-Lin Shue, Tsai-Sheng Gau, Yung-Hsu Wu
  • Publication number: 20220208607
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Application
    Filed: March 17, 2022
    Publication date: June 30, 2022
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Publication number: 20220024182
    Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.
    Type: Application
    Filed: May 10, 2021
    Publication date: January 27, 2022
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, HUNG-YI CHANG, CHIH-KAI CHANG, CHIA-LIN LIU
  • Publication number: 20220030709
    Abstract: A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 phr, the resin composition for the high frequency substrate includes: 20 phr to 70 phr of a polyphenylene ether resin, 5 phr to 40 phr of a polybutadiene resin, 5 phr to 30 phr of a bismaleimide resin, and 20 phr to 45 phr of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230° C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate.
    Type: Application
    Filed: June 3, 2021
    Publication date: January 27, 2022
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, HUNG-YI CHANG, CHIA-LIN LIU, CHIH-KAI CHANG
  • Publication number: 20210374254
    Abstract: A software protection method includes decrypting an encrypted executable file by a processor, and the steps of decrypting include the following steps. A linking instruction is executed in a first execution environment; based on the linking instruction, a signature corresponding to the encrypted executable file is generated in the first execution environment; based on the signature and a hash table, a decryption algorithm is performed and a key is generated in the first execution environment; and the key is transmitted from the first execution environment to a second execution environment that is different from the first execution environment. The encrypted executable file is in the second execution environment. A software protection system is also disclosed herein.
    Type: Application
    Filed: September 15, 2020
    Publication date: December 2, 2021
    Inventors: Hao-Chieh CHANG, Chia-Lin LIU, Wan-Sheng NI
  • Patent number: 11008451
    Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 18, 2021
    Assignee: Nan Ya Plastics Corporation
    Inventors: Te-Chao Liao, Ying-Te Huang, Chih-Kai Chang, Hung-Yi Chang, Hao-Sheng Chen, Chia-Lin Liu
  • Patent number: 11009980
    Abstract: A fingerprint-sensing array on a substrate includes the substrate, scan lines, data lines, readout lines, sub-pixels, and multiple fingerprint recognition units. Areas between adjacent scan lines and adjacent data lines define one sub-pixel with pixel electrode and a first transistor. Of the first transistor, drain electrode connects to the pixel electrode, source electrode connects to one data line and gate electrode connects to one scan line. Thus some of the sub-pixels contain fingerprint recognition units, these being a photodiode electrically connected to one readout line. The readout line passes signals generated by the photodiode to achieve fingerprint recognition function. A display panel using the array on the substrate and a display device using the display panel are also provided.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: May 18, 2021
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chien-Wen Lin, Yu-Fu Weng, Chia-Lin Liu
  • Publication number: 20210043503
    Abstract: An electrical connection structure includes a substrate, a mating layer on the substrate, a connecting pad on the mating layer, an insulating layer on the mating layer and covering the connecting pad, a connecting line on the insulating layer, and a covering layer on the insulating layer and covering the connecting line. The connecting line extends through the insulating layer to electrically couple to the connecting pad. Both the connecting pad and the connecting line are made of metal or alloy. The mating layer includes yttrium oxide films and silicon oxide films alternating with each other.
    Type: Application
    Filed: October 23, 2020
    Publication date: February 11, 2021
    Inventors: CHIN-YUEH LIAO, CHIA-LIN LIU, YAN-TANG DAI, HUNG-CHE LU
  • Patent number: 10854509
    Abstract: A method for making an electrical connection structure includes: providing a substrate; forming a mating layer on the substrate; forming a connecting pad on the mating layer; forming a connecting line on the connecting pad and electrically coupling to the connecting pad; forming a covering layer covering the connecting line; and light irradiating the covering layer. Both the connecting pad and the connecting line are made of a metal or an alloy. The mating layer includes alternating yttrium oxide films and silicon oxide films.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: December 1, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chin-Yueh Liao, Chia-Lin Liu, Yan-Tang Dai, Hung-Che Lu
  • Patent number: 10854133
    Abstract: A micro LED display panel includes a first metal layer, a micro LED layer on the first metal layer, and a transparent conductive layer on a side of the micro LED layer opposite from the first metal layer. The micro LED layer includes a plurality of micro LEDs spaced apart from each other. The first metal layer includes a plurality of first metal units spaced apart from each other. The plurality of first metal units serve as anodes or cathodes of the plurality of micro LEDs. The transparent conductive layer includes a plurality of transparent conductive units spaced apart from each other. The plurality of transparent conductive units serve as anodes or cathodes of the plurality of micro LEDs and are multiplexed as touch electrodes. The micro LED display panel of the present disclosure has both a display function and a touch function.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 1, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chia-Lin Liu, Yu-Fu Weng, Chien-Wen Lin, Tzu-Yu Cheng
  • Publication number: 20200325304
    Abstract: A thermosetting resin composition and a printed circuit board including the same are provided. The composition adopts a thermosetting polyphenylene ether resin whose terminal functional group is a styrene and an acrylic. The thermosetting polyphenylene ether resin has an appropriate hydroxyl value to be easily cured, and the ratio of two different functional groups is between 0.5 and 1.5, for adjusting heat resistance, fluidity, and filling property. A particle diameter of 1 ?m to 40 ?m is added to control a dielectric constant, and after curing characteristics of high dielectric constant, low dielectric loss, high Tg, high rigidity, high flame resistance and low moisture absorption rate can be achieved.
    Type: Application
    Filed: November 11, 2019
    Publication date: October 15, 2020
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, HUNG-YI CHANG, CHIA-LIN LIU, CHIH-KAI CHANG
  • Patent number: 10781297
    Abstract: A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent curability.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 22, 2020
    Assignee: Nan Ya Plastics Corporation
    Inventors: Te-Chao Liao, Ying-Te Huang, Hao-Sheng Chen, Hung-Yi Chang, Chia-Lin Liu
  • Patent number: 10761653
    Abstract: A display panel able to receive full fingerprint impressions in a display area together with command touches, in addition to showing images, includes a substrate, scan lines, data lines, touch scan lines, touch lines, sub-pixels, and fingerprint sensing units. A method for driving such multifunctional touch display panel is also provided.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 1, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Fu Weng, Chien-Wen Lin, Chia-Lin Liu
  • Patent number: 10748940
    Abstract: A TFT substrate for a touch display panel of reduced thickness defines a display area and a surrounding non-display area. The TFT substrate includes a first conductive layer on the substrate and a second conductive layer on the first conductive layer. In the display area, the first conductive layer includes data lines and the second conductive layer includes common electrodes. Each common electrode extends as a strip along a first direction. Each data line extends along a second direction. The first direction intersects the second direction. Each data line crosses the common electrodes. Each data line functions as a touch driving electrode and each common electrode functions as a touch sensing electrode.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: August 18, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chia-Lin Liu, Yu-Fu Weng, Chien-Wen Lin, Tzu-Yu Cheng
  • Patent number: 10732757
    Abstract: A self-luminescence display apparatus capable of detecting pressure of touches applied by a user, the apparatus includes a display panel having a plurality of conductive layers and a supporting frame. One of the conductive layers cooperates with the supporting frame to form a plurality of force sensing capacitors. When a touch is applied, the display panel deforms according to pressure applied, which cause the capacitances of the force sensing capacitors to alter. The change in capacitance value, corresponding to a position where the touch operation is applied, can be calculated.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: August 4, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chien-Wen Lin, Yu-Fu Weng, Chia-Lin Liu
  • Patent number: 10690950
    Abstract: A touch display device includes a touch display module. The touch display module includes a TFT substrate, a color filtering substrate, and a liquid crystal layer encapsulated between the TFT substrate and the color filtering substrate. A first electrode layer is formed on a surface of the color filtering substrate facing the TFT substrate. A second electrode layer is formed on a surface of the TFT substrate facing the color filtering substrate. The touch display device further includes at least one supporting element on a side of the touch display module. The supporting element is elastic and configured for elastically resisting against the touch display module.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: June 23, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Fu Weng, Chien-Wen Lin, Chia-Lin Liu, Tzu-Yu Cheng
  • Publication number: 20200183563
    Abstract: A display panel able to receive full fingerprint impressions in a display area together with command touches, in addition to showing images, includes a substrate, scan lines, data lines, touch scan lines, touch lines, sub-pixels, and fingerprint sensing units. A method for driving such multifunctional touch display panel is also provided.
    Type: Application
    Filed: September 12, 2019
    Publication date: June 11, 2020
    Inventors: YU-FU WENG, CHIEN-WEN LIN, CHIA-LIN LIU