Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: The present invention relates to a supporting element of a foldable bottomless rainproof shoe cover assembly. The shoe cover assembly includes a front sheet, a rear sheet, a supporting element, and combining pieces. The supporting element is continuously provided on a peripheral edge of the front sheet to substantially form an L-shaped loop. The rear sheet is provided with a notch to be combined with the front sheet. The combining pieces are provided on front and rear edges of the rear sheet respectively. Four bending points of the supporting element are provided with a wrapping portion respectively. By this arrangement, the supporting element helps the shoe cover assembly to cover the shoe of a user and makes the shoe cover assembly to be folded easily for better storage.

Abstract: A foldable bottomless rainproof shoe cover includes a front piece, a rear piece, a supporting element and connecting elements. The supporting element is continuously provided on the periphery of the front piece. The rear piece is formed with a notch for allowing the front piece to be connected thereto. The connecting elements are provided on front and rear sides of the rear piece. The shoe cover of the present invention includes two pieces and the supporting element is provided on one of the two pieces, so that the shoe cover of the present invention can be put on or taken off conveniently and foldable for easy storage.

Abstract: An assembly of nanoelements forms a three-dimensional nanoscale circuit interconnect for use in microelectronic devices. A process for producing the circuit interconnect includes using dielectrophoresis by applying an electrical field across a gap between vertically displaced non-coplanar microelectrodes in the presence of a liquid suspension of nanoelements such as nanoparticles or single-walled carbon nanotubes to form a nanoelement bridge connecting the microelectrodes. The assembly process can be carried out at room temperature, is compatible with conventional semiconductor fabrication, and has a high yield. The current-voltage curves obtained from the nanoelement bridge demonstrate that the assembly is functional with a resistance of ?40 ohms for gold nanoparticles. The method is suitable for making high density three-dimensional circuit interconnects, vertically integrated nanosensors, and for in-line testing of manufactured conductive nanoelements.

Abstract: An assembly of nanoelements forms a three-dimensional nanoscale circuit interconnect for use in microelectronic devices. A process for producing the circuit interconnect includes using dielectrophoresis by applying an electrical field across a gap between vertically displaced non-coplanar microelectrodes in the presence of a liquid suspension of nanoelements such as nanoparticles or single-walled carbon nanotubes to form a nanoelement bridge connecting the microelectrodes. The assembly process can be carried out at room temperature, is compatible with conventional semiconductor fabrication, and has a high yield. The current-voltage curves obtained from the nanoelement bridge demonstrate that the assembly is functional with a resistance of ?40 ohms for gold nanoparticles. The method is suitable for making high density three-dimensional circuit interconnects, vertically integrated nanosensors, and for in-line testing of manufactured conductive nanoelements.