Abstract: The present disclosure provides an LED tube lamp including a base, a circuit board and at least one light emitting diode arranged on the circuit board. The base includes a connecting surface for mounting the circuit board and two side walls extending from the connecting surface. The two side walls are deformable and rigidly engage the circuit board on the connecting surface.

Abstract: The heat dissipation assembly contains at least a base element having at least a slot; at least a heat dissipation element embedded into the slot; and at least a filler element for forcing the fixed embedment of the heat dissipation element into the slot. The gaps between the heat dissipation elements provide enhanced convection effect.

Abstract: A wide-range reflective structure comprises a reflective case, a heat-sink metal frame, a heat conductive plate, and one control member for directing light beams. The heat conductive plate defines a recess for holding the heat-sink metal frame. The reflective case has a first inner curved reflective surface, a second inner curved reflective surface, a third inner curved reflective surface, and a fourth inner curved reflective surface. The reflective case is attached to the heat conductive plate, enclosing the heat-sink metal frame. The control member has two concave reflective surfaces. The first inner curved reflective surface has an inclination angle greater than the second inner curved reflective surface. The third inner curved surface has an inclination angle approximately equal to the fourth inner curved surface. As such, the inner curved reflective surfaces can cooperate with the control member to direct light beams from LEDs to a target more extensively and uniformly.

Abstract: An annual packaging structure includes a heat sink having an installation surface; and a plurality of annular isolation walls being formed on the installation surface. Each of two opposite sides of each annular isolation wall has a light reflecting surface. Each installation hole is installed with an insulator material of which is selected from glass or other heat insulation material. Each section is installed with a plurality of LED dies; each LED die being electrically connected to a pin. A heat conduction base has an embedding groove for installing the heat sink. A lower bottom of the embedding groove is formed with a plurality of through holes positioned with respect to the installation holes. The pins are extended through the through holes and are limited by the insulators so that the pin are at a center portion for preventing short-circuit.

Abstract: A high efficiency refraction body includes a light source chamber and a main refraction surface opposite to the light source chamber. A first refraction surface and a second refraction surface for refracting the lights are formed to a peripheral of the high efficiency refraction body. A light source is received to the light source chamber. Lights from the light source will be total reflected because the incident angles of the lights exceed a critical angle of the main refraction surface. The reflected lights will be refracted through the first refraction surface and the second refraction surface so as to pass a lateral of the refraction body. A uniform lateral illumination of the refraction body will correct the poor lateral illumination of LED light devices.

Abstract: A high power wide coverage light reflection lamp seat, comprises a reflecting cup opened at a lower side and an upper side thereof, inner lateral sides of the reflecting element being formed with high reflectivity surfaces; the upper side of the reflecting cup being formed with inclined light guiding edge surfaces; two deflection bodies being cross the upper side the light guiding edge surfaces; each deflection body being formed with a plurality of different inclined surfaces; the deflection bodies serving to deflect light passing therethrough; and a reflecting element installed within the reflecting cup; an outer side of the reflecting cup being formed with curved surfaces.

Abstract: A high efficiency refraction body includes a light source chamber and a main refraction surface opposite to the light source chamber. A first refraction surface and a second refraction surface for refracting the lights are formed to a peripheral of the high efficiency refraction body. A light source is received to the light source chamber. Lights from the light source will be total reflected because the incident angles of the lights exceed a critical angle of the main refraction surface. The reflected lights will be refracted through the first refraction surface and the second refraction surface so as to pass a lateral of the refraction body. A uniform lateral illumination of the refraction body will correct the poor lateral illumination of LED light devices.

Abstract: An LED lamp structure includes a reflection cup, a metal heat sink for receiving a plurality of LEDs, and a heat conducting base. The heat conducting base has a slot for receiving the metal heat sink. The metal heat sink includes guiding planes for redirecting the output of an LED so as to change the angle of projected light. The metal heat sink is made of a good heat conductor with high thermal capacity so that heat produced by the LED is absorbed quickly and conducted to the heat conducting base. The reflection cup is flexed to an outer edge of the metal heat sink to provide a flat lighting characteristic.

Abstract: A light source including a refraction body, a metal cup, a metal reflecting lampshade, an LED lamp body. Light emitted from the LED lamp body is reflected by the metal cup to be vertically incident into the refraction body so that the light is refracted by the refraction body; the refraction body is installed at a focus of the cambered tapered surface of the metal reflecting lampshade so that the light is reflected to have a predetermined reflected shape.

Abstract: A wide-span reflection structure has a reflection cup, a metal heat sink and a heat conductive base. The heat conductive base has an embedded trough to provide the metal heat sink to be embedded firmly. The outer ring of the metal heat sink is embedded firmly with the reflection cup suitable to a plane-shining character of a LED light. At least a reflection light element is installed in the reflection cup. The reflection light element has a curved surface. Considering a LED character of facade shining, the over-strong light in the middle of a LED light can be reflected towards another side by through the curved surface of the reflection light element so as to increase a wide-span of shining area. The wide-span reflection structure is capable of spreading evenly out light so as to reach goals of higher light efficiency and saving energy.

Abstract: A high efficiency heat dissipating device for lamps is disclosed. The lamp comprises a light-emitting element, a heat conduction body and a lamp housing characterized in that the heat conduction body is mounted at the lamp housing and the light-emitting element is mounted at the heat conduction body, heat from the light-emitting element is transferred by contacting with the heat conduction body such that the housing provides a large area for the function of heat dissipation, and the interior and exterior of the housing are increased with a plurality of lamp hoods depending on the power of the light-emitting element, and the multi-layer lamp hoods are combined with lamps of different specification, the housing is adapted for solid illumination such that heat energy is dissipated via the surface area of the multi-layer lamp hoods and by means of convection current, a great amount of energy is dissipated and therefore the heat dissipation rate is increased.

Abstract: An LED lamp with reflecting casings comprises a bulb seat having an international standard joint at an outer side thereof; an interior of the bulb seat having a power supply; an insulating layer for isolating the power supply and an auxiliary heat dissipating casing; a main heat dissipating casing being a hollow tapered shape and being opened at two ends; the tapered size of the main heat dissipating casing being smaller than that of the auxiliary heat dissipating casing; an LED lamp body having a conductive metal heat sink with good conductivity at an upper side thereof; an inner supporting surface of the LED lamp body serving to install with at least one LED chip; the metal heat sink having a round shape and a rear end thereof protrudes with chip pins; and a heat conducting base for receive the LED lamp body.

Abstract: An LED lamp with reflecting casings comprises a bulb seat having an international standard joint at an outer side thereof; an interior of the bulb seat having a power supply; an insulating layer for isolating the power supply and an auxiliary heat dissipating casing; a main heat dissipating casing being a hollow tapered shape and being opened at two ends; the tapered size of the main heat dissipating casing being smaller than that of the auxiliary heat dissipating casing; an LED lamp body having a conductive metal heat sink with good conductivity at an upper side thereof; an inner supporting surface of the LED lamp body serving to install with at least one LED chip; the metal heat sink having a round shape and a rear end thereof protrudes with chip pins; and a heat conducting base for receive the LED lamp body.

Abstract: A flashless light source with effects of light refraction and reflection, comprises a refraction body, a metal cup, a metal reflecting lampshade, an LED lamp body. Light emitted from the LED lamp body is reflected by the metal cup to be vertically incident into the refraction body so that the light is refracted by the refraction body; the refraction body is installed at a focus of the cambered tapered surface of the metal reflecting lampshade so that the light is reflected to have a predetermined reflected shape so as to remove the flashing effect due to the small light emitted area of the LED.

Abstract: An ultra high efficient encapsulation structure includes a reflection cup, a metal heat sink, and a heat conducting base. The heat conducting base has a slot for being inserted by the metal heat sink. The metal heat sink is formed as guiding planes which are suitable for a flat lighting characteristic of a LED so as to change the angle of lights and raise the optical efficiency. The metal heat sink is a good heat conductor with high thermal capacity so that heat on a LED chip is absorbed quickly and being conducted to the heat conducting base through a larger surface thereof. Heat on the LED chips of the metal heat sink is dissipated quickly so that temperatures of the LED chips are substantially lowered. The reflection cup suitable for the flat lighting characteristic of the LED is fixed to an outer edge of the metal heat sink.

Abstract: The present invention discloses a solid state lighting package structure that breaks through the present small power packaging method to achieve the required power for lighting and overcome the heat and light issues, and uses a good heat sink and thermal conducting structure to quickly dissipate the heat produced by a chip to the outside. Special symmetric chip pattern and optical structure can evenly and efficiently guide the light out and select different color chips to meet the requirements for different color lights. The structure can be combined with a lamp easily, such that the solid state lighting can be applied for illumination easily and quickly.

Abstract: A high-power LED package structure applied to spot lights, torch lights, structures that provide ultraviolet or infrared or white lights. The high-power LED package structure comprises at least one light emitting diode chip attached to an outer surface of a metallic heat sink of high heat conductivity. The structure further comprises a heat-conducting base on which the metallic heat sink is embedded. There is an insulating layer between the metallic heat sink and the heat-conducting base. The tri-structure significantly increases the mechanical toughness and the heat-conducting area of the present invention, whereby the heat produced in the metallic heat sink will be diffused quickly to the heat-conducting base and then dissipated away. Therefore, the effect of heat dissipation will be enhanced.

Abstract: The present invention discloses a solid state lighting package structure that breaks through the present small power packaging method to achieve the required power for lighting and overcome the heat and light issues, and uses a good heat sink and thermal conducting structure to quickly dissipate the heat produced by a chip to the outside. Special symmetric chip pattern and optical structure can evenly and efficiently guide the light out and select different color chips to meet the requirements for different color lights. The structure can be combined with a lamp easily, such that the solid state lighting can be applied for illumination easily and quickly.

Abstract: An LED light source applied to surveillance cameras as an infrared source or a visible-light source has a light emitting diode (LED) as the light emitting mechanism. The LED chip is mounted on a surface of a metallic body of high thermal conductivity, the surface being planar for scattering light or convex for collimating light. The heat produced in the LED chip is quickly guided to a heat-sink structure much massive than the chip and having large contact area with a heat radiating structure, thereby effectively dissipating the heat and increasing the power capacity of the chip. The heat-sink structure has a plurality of elongated heat conducting members confined by an insulating bracket at one end and mounted on a metallic base on the other end. The metallic base can be coupled with a heat radiator to enhance heat radiation.