HEAT DISSIPATION ASSEMBLY

The heat dissipation assembly contains at least a base element having at least a slot; at least a heat dissipation element embedded into the slot; and at least a filler element for forcing the fixed embedment of the heat dissipation element into the slot. The gaps between the heat dissipation elements provide enhanced convection effect.

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Description
TECHNICAL FIELD OF THE INVENTION

The present invention is generally related to heat dissipation, and more particular to a heat dissipation assembly applicable to lamps.

DESCRIPTION OF THE PRIOR ART

Heat pipes are commonly applied to electronic appliances due to their superior thermal conductivity Conventionally, as disclosed by Taiwan Patent No. 449514, solder is coated on the interface between a heat pipe and the fins jointed to the heat pipe. The assembly is then placed and heated inside a vacuum oven. The solder is melted and permeate the interface due to the capillary effect. The solder is then solidified and the fins are welded to the heat pipe. The above process requires special apparatus (e.g., the vacuum oven), in addition to its long operating time and delicate control, thereby a high production cost. Furthermore, the process also produces waste that would be harmful to the environment.

Another way to couple the heat pipe and the fins is by tightening. As shown in FIG. 1, the heat dissipation assembly A contains a base A1, a tube A2, and multiple fins A3, each with a central through hole for the tube A2 to thread through. The central through hole has a circling flange A31 on which a concentric rib A32 is configured. To assemble the heat dissipation assembly, the tube A2 is held on a fixture and the fins A3 are mounted sequentially onto the tube A2. After each fin A2 is installed, it is stamped to the tube A2 so that the two are tightly jointed together. However, for the heat dissipation assembly A just described, the major drawback is that the tube A2 actually would block air flow and the convection would be limited to the rims of the fins A3.

SUMMARY OF THE INVENTION

A major objective of the present invention is to provide a heat dissipation assembly of reduced production cost.

Another major objective of the present invention is to provide a heat dissipation assembly with robust structure and enhanced all-directional convection capability.

To achieve the objectives, the heat dissipation assembly contains at least a base element having at least a slot; at least a heat dissipation element embedded into the slot; and at least a filler element for forcing the fixed embedment of the heat dissipation element into the slot. The gaps between the heat dissipation elements provide enhanced convection effect.

Alternatively, the heat dissipation assembly contains at least a base element having at least a slot; and at least a heat dissipation element embedded into the slot. The gaps between the heat dissipation elements provide enhanced convection effect.

The heat dissipation elements can be fixedly embedded in the slots by means such as welding, inserting a filler element, and adhesion.

Optionally, a lighting element is configured on a top side of one of the base elements.

The advantages of the present invention are as follows.

Firstly, the heat dissipation elements are jointed to the base elements simply by filler elements, thereby achieving reduced material and cost.

Secondly, the gaps between the heat dissipation elements allow air flow from various directions, thereby achieving enhanced convection effect.

Thirdly, the use of filter elements enhances the robust of the heat dissipation assembly.

Fourthly, the heat dissipation elements are regularly arranged or interleaved, thereby achieving enhanced visual appearance.

The foregoing objectives and summary provide only a brief introduction to the present invention. To fully appreciate these and other objects of the present invention as well as the invention itself, all of which will become apparent to those skilled in the art, the following detailed description of the invention and the claims should be read in conjunction with the accompanying drawings. Throughout the specification and drawings identical reference numerals refer to identical or similar parts.

Many other advantages and features of the present invention will become manifest to those versed in the art upon making reference to the detailed description and the accompanying sheets of drawings in which a preferred structural embodiment incorporating the principles of the present invention is shown by way of illustrative example.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective break-down diagram showing a conventional heat dissipation assembly.

FIG. 2 is a top-view diagram showing a heat dissipation assembly according to a first embodiment of the present invention.

FIG. 3 is a perspective diagram showing a heat dissipation assembly according to a first embodiment of the present invention.

FIG. 4 is a perspective break-down diagram showing the heat dissipation assembly of FIG. 3.

FIG. 5 is a perspective diagram showing a heat dissipation assembly according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following descriptions are exemplary embodiments only, and are not intended to limit the scope, applicability or configuration of the invention in any way. Rather, the following description provides a convenient illustration for implementing exemplary embodiments of the invention. Various changes to the described embodiments may be made in the function and arrangement of the elements described without departing from the scope of the invention as set forth in the appended claims.

As shown in FIGS. 2 and 3, a heat dissipation assembly 1 according to a first embodiment of the present invention contains at least a base element 11, at least a heat dissipation element 12, and at least a filler element 13. In the present embodiment, there are two base elements 11 and, as the two are identical, only one is described as follows. The base element 11 is radially configured a number of slots 111 along its circumference. Each slot 111 is embedded with a heat dissipation element 12 and therefore the number of slots 12 determines the number of the heat dissipation elements 12. Each heat dissipation element 12 contains two identically shaped pieces arranged in parallel. The two pieces are bended along their inner edge to form perpendicular sections 121, respectively. The filler elements 13 have the same width as that of each slot 111. The number of the filler elements 13 is the same as or a multiple of the number of the number of slots 111. In the present embodiment, there are 15 slots. The number of filler elements 13 therefore can be 15 or 30. The length of each filler element 13 is determined by the distance between the two base elements 11. In the present embodiment, there are 15 filler elements 13.

Each heat dissipation element 12 with its two pieces and their perpendicular sections 121 form a U shape with a storage space in between. The two base elements 11 are vertically arranged with an appropriate distance and with their respective slots 111 aligned. Then, each heat dissipation element 12 is fitted in a pair of aligned slots 111. A filler element 13 is subsequently inserted into the storage space in each heat dissipation element 12. As such, there are gaps between the heat dissipation elements 12, thereby achieving enhanced convection.

As shown in FIGS. 3 and 4, the base elements 11 are further configured with bolt holes through which flower-shaped covers 15 are bolted. Additionally, a lighting element 17 (with, for example, a LED chip inside) is positioned on a top side of the upper base element 11. The lower base element 11 has a central through hole allowing a support rod 16 with electrical cords inside to thread through and a top end of the support rod 16 is jointed to a bottom side of the upper base element 11. The heat produced by the lighting element 17 is therefore conducted to the heat dissipation elements 12 locked to the base elements 11 by the filter elements 13 and then dissipated through the gaps between the heat dissipation elements 12.

A second embodiment of the present invention as shown in FIG. 5 has rather similar structure as that of the previous embodiment. The difference lies in that there are 30 filler elements 13, each for plugging into a slot 111. Additionally, there is a lamp base 18 jointed to the lower base element 11. The lighting element 17 is electrically connected to the lamp base 18 through electrical cords extended from the bottom side of the upper base element 11, and through the center of the lower base element 11.

In addition to using the filler elements 13, the heat dissipation elements can be fixedly embedded in the slots 111 by means such as welding and adhesion.

While certain novel features of this invention have been shown and described and are pointed out in the annexed claim, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.

Claims

1. A heat dissipation assembly, comprising:

at least a base element having at least a slot;
at least a heat dissipation element embedded into said slot; and
at least a filler element for forcing the fixed embedment of said heat dissipation element into said slot;
wherein the gaps between said heat dissipation elements provide enhanced convection effect.

2. A heat dissipation assembly, comprising at least a base element having at least a slot; and

at least a heat dissipation element embedded into said slot;
wherein the gaps between said heat dissipation elements provide enhanced convection effect.

3. The heat dissipation assembly according to claim 2, wherein said heat dissipation element is fixedly embedded in said slot by one of the following means: welding, insertion of a filler element, and adhesion.

4. The heat dissipation assembly according to claim 1, further comprising a light element positioned on a top side of one of said base elements.

5. The heat dissipation assembly according to claim 2, further comprising a light element positioned on a top side of one of said base elements.

Patent History
Publication number: 20130105133
Type: Application
Filed: Oct 27, 2011
Publication Date: May 2, 2013
Inventor: CHIA-MAO LI (Taipei City)
Application Number: 13/282,488
Classifications
Current U.S. Class: Heat Transmitter (165/185)
International Classification: F28F 7/00 (20060101);