Abstract: The present disclosure relates to a storage device. The storage device comprises a frame having a hole and a printed circuit board embedded in the frame, wherein the printed circuit board has an extended part for forming a connector. The connector may pass through the hole and is exposed out the frame for interfacing the storage device with a host device. At least one memory device is mounted to the printed circuit board and electrically connected to the printed circuit board.

Abstract: The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.

Abstract: The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.

Abstract: The present invention relates to a nozzle and adjust module of chemicals when wafers are processed during the IC manufacturing process. After wafers are loaded on a chuck of a reaction chamber, five chemicals required for the manufacturing process are transported into the passages, and are sprayed on the surfaces of rotating wafers via different nozzles. The centrifugal effect due to the rotation of a main motor is exploited to coat the chemicals on the whole wafer quickly and uniformly. The present invention can apply to both closed and open reaction chambers. The spray head of the present invention has a specially designed angle, and has level adjusting and height adjusting functions so that high flexibility in the manufacturing process can be obtained.

Abstract: The present invention relates to a nozzle and adjust module of chemicals when wafers are processed during the IC manufacturing process. After wafers are loaded on a chuck of a reaction chamber, five chemicals required for the manufacturing process are transported into the passages, and are sprayed on the surfaces of rotating wafers via different nozzles. The centrifugal effect due to the rotation of a main motor is exploited to coat the chemicals on the whole wafer quickly and uniformly. The present invention can apply to both closed and open reaction chambers. The spray head of the present invention has a specially designed angle, and has level adjusting and height adjusting functions so that high flexibility in the manufacturing process can be obtained.

Abstract: A wafer backside protection apparatus includes a motor, a vacuum chuck, an annular seat and a top cover. The motor has an output shaft upon which the chuck is mounted. The chuck has a front surface to suck and hold a wafer from its backside. The chuck has a backside in which a water guard ring and a plurality of slant bores are formed. The slant bores run from the water guard ring through the wafer front surface. The annular seat is located below the chuck and has two symmetrical slant nozzles projecting toward motor rotating direction for ejecting protection liquid to the water guard ring. Protection liquid may be spun and splashed out through the slant bores to form a protection liquid film between the chuck and the wafer backside due to centrifugal force resulting from chuck and wafer rotation driven by the motor. The protection liquid film may protect wafer backside from chemical erosion and contamination resulting from wafer production process.

Abstract: Tree foliage extracts, their extraction processes, and the use of such extracts in formulating resins suitable for use in plywood adhesives and as wood bonding agents.

Abstract: A phenol-aldehyde resin composition consisting essentially of the polymerization product of an alkali organic extract of peanut hulls and pecan piths polymerized with an aldehyde. The peanut hull and pecan pith alkali organic extracts are polymerized with an aldehyde and used to formulate resins suitable for use in plywood adhesives, in wood bonding agents and in cellulosic material impregnating agents.

Abstract: A phenol-aldehyde resin composition consisting essentially of the polymerization product of an alkali organic extract of peanut hulls and pecan piths polymerized with an aldehyde. The peanut hull and pecan pith alkali organic extract are polymerized with an aldehyde and used to formulate resins suitable for use in polywood adhesives, in molding compounds, in wood bonding agents and in cellulosic material impregnating agents.

Abstract: Organic phenol compounds and protein extract compositions consisting essentially of alkali organic extracts of peanut hull and pecan pith agricultural residues and a method of carrying out the extraction are described. The peanut hull and pecan pith alkali organic extracts can be polymerized with an aldehyde and used to formulate resins suitable for use in plywood adhesives, in wood bonding agents and in cellulosic material impregnating agents.

Abstract: Organic phenol compounds extract compositions consisting essentially of alkali organic extracts of peanut hull and pecan pith agricultural residues and a method of carrying out the extraction are described. The peanut hull and pecan pith alkali organic extracts can be polymerized with an aldehyde and used to formulate resins suitable for use in plywood adhesives, in wood bonding agents and in cellulosic material impregnating agents.