Abstract: A semiconductor device includes first nanostructures vertically separated from one another, a first gate structure wrapping around each of the first nanostructures, and second nanostructures vertically separated from one another. The semiconductor device also includes a second gate structure wrapping around the second nanostructures, a first drain/source structure coupled to a first end of the first nanostructures, a second drain/source structure coupled to both of a second end of the first nanostructures and a first end of the second nanostructures, and a third drain/source structure coupled to a second end of the second nanostructures. The first drain/source structure has a first doping type, the second and third drain/source structures have a second doping type, and the first doping type is opposite to the second doping type.

Abstract: A modified electrode, manufacturing method thereof and use thereof are provided. The manufacturing method includes steps of soaking a copper substrate in a solution to obtain a BiOI/copper(I) iodide, BiOI/copper(I) iodide/metallic bismuth, and copper(I) iodide/metallic bismuth composite modified electrodes by electroless plating method. The obtained electrodes, designated as bismuth-based modified electrode, can be used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.

Abstract: A monitoring method of a cooling system and a monitoring device thereof are provided. The monitoring method includes the steps: establishing an abnormality determination model according to predetermined abnormal data and predetermined abnormal types using deep learning by a monitoring module; generating groups of temperature data respectively by a plurality of temperature sensors; and determining one or more abnormal types and an abnormal prediction of the cooling system according to the groups of temperature data and the plurality of temperature sensors using the abnormality determination model by the monitoring module.

Abstract: A monitoring method of a cooling system and a monitoring device thereof are provided. The monitoring method includes the steps: establishing an abnormality determination model according to predetermined abnormal data and predetermined abnormal types using deep learning by a monitoring module; generating groups of temperature data respectively by a plurality of temperature sensors; and determining one or more abnormal types and an abnormal prediction of the cooling system according to the groups of temperature data and the plurality of temperature sensors using the abnormality determination model by the monitoring module.

Abstract: A playable volume generation method is provided. A playlist includes a plurality of playlist items, each targeting one of the playable items to be displayed according to the arrangement of the playlist items. A designated inter-item position on the playlist for inserting a new playlist item is received. A former playlist item and a later playlist item adjacent to the new playlist item are automatically retrieved. A second playable item targeted by the new playlist item is automatically generated to simulate a transition effect transitioning from the end of the playable item targeted by the former playlist item to the beginning of the playable item targeted by the later playlist item.

Abstract: A playable volume generation method. A playlist comprises a plurality of playlist items, each targeting one of the playable items to be displayed according to the arrangement of the playlist items. A designated inter-item position on the playlist for inserting a new playlist item is received. A former playlist item and a later playlist item adjacent to the new playlist item are automatically retrieved. A second playable item targeted by the new playlist item is automatically generated to simulate a transition effect transitioning from the end of the playable item targeted by the former playlist item to the beginning of the playable item targeted by the later playlist item.

Abstract: The present invention provides a connector and a conductive terminal. The terminal includes a contact portion, a solder portion and a connecting portion. The solder portion is bent to have a certain radian and has a cable-carrying surface for a cable being placed and soldered thereon. The cable-carrying surface is located above at least half height of the terminal and perpendicular to the contact portion. The contact portion is on the central line of the cable-carrying surface. The connector has an insulation body with a row of terminal holes being defined therein. A row of the terminals are alternatively inverted and vertically inserted into the terminal holes with the solder portions of the terminals extending out of the insulation body in double rows. Therefore, every adjacent two solder portions are staggered up and down to ensure enough space therebetween for facilitating soldering.

Abstract: A memory card connector with a push-push mechanism has a sliding member and a sliding pin. The sliding pin is bent into a specific shape and has a linkage portion and a clasping portion, wherein the clasping portion can be located at predetermined positions of a housing of the memory card connector alternately. The sliding member can be slid to the corresponding positions according to the insertion and the rejection of a memory card. A recess portion is formed on the front end of the sliding member with a retaining hole defined thereon for engaging with the linkage portion. The indented depth of the recess portion on the sliding member is substantially equal to the thickness of the sliding pin so that the top of the sliding pin is substantially at the same level as the surface of the sliding member. Thus, the memory card connector has the advantages of high durability and reliability and reduced thickness.

Abstract: A memory card connector with a push-push mechanism has a sliding member and a sliding pin. The sliding pin is bent into a specific shape and has a linkage portion and a clasping portion, wherein the clasping portion can be located at predetermined positions of a housing of the memory card connector alternately. The sliding member can be slid to the corresponding positions according to the insertion and the rejection of a memory card. A recess portion is formed on the front end of the sliding member with a retaining hole defined thereon for engaging with the linkage portion. The indented depth of the recess portion on the sliding member is substantially equal to the thickness of the sliding pin so that the top of the sliding pin is substantially at the same level as the surface of the sliding member. Thus, the memory card connector has the advantages of high durability and reliability and reduced thickness.