Patents by Inventor Chia Wen Liu
Chia Wen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11963969Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.Type: GrantFiled: September 16, 2022Date of Patent: April 23, 2024Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATIONInventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
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Patent number: 11961770Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.Type: GrantFiled: November 4, 2021Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
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Patent number: 11955554Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. The plurality of the second type of epitaxial layers is oxidized in the source/drain region. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed in the opening.Type: GrantFiled: July 15, 2022Date of Patent: April 9, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Huan-Sheng Wei, Hung-Li Chiang, Chia-Wen Liu, Yi-Ming Sheu, Zhiqiang Wu, Chung-Cheng Wu, Ying-Keung Leung
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Publication number: 20240109063Abstract: An apparatus includes a flow cell, an imaging assembly, and a processor. The flow cell includes a channel and a plurality of reaction sites. The imaging assembly is operable to receive light emitted from the reaction sites in response to an excitation light. The processor is configured to drive relative movement between at least a portion of the imaging assembly and the flow cell along a continuous range of motion to thereby enable the imaging assembly to capture images along the length of the channel. The processor is also configured to activate the imaging assembly to capture one or more calibration images of one or more calibration regions of the channel, during a first portion of the continuous range of motion. The processor is also configured to activate the imaging assembly to capture images of the reaction sites during a second portion of the continuous range of motion.Type: ApplicationFiled: September 28, 2023Publication date: April 4, 2024Inventors: Dustin BLAIR, Patrick WEN, John EARNEY, Anmiv PRABHU, Rachel ABASKHARON, Gregory HOLST, Chia-Hsi LIU, Ravi THAKUR, Dakota WATSON, Kevin BARTIG, Daeyong SIM
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Publication number: 20240114243Abstract: Some implementations of the disclosure relate to an imaging system including one or more image sensors and a Z-stage. The imaging system is configured to perform operations including: capturing, using the one or more image sensors, a first image of a first pair of spots projected at a first sample location of a sample; determining whether or not the first image of the first pair of spots is valid; and when the first image is determined to be valid: obtaining, based on the first image, a current separation distance measurement of the first pair of spots; and controlling, based at least on the current separation distance measurement, the Z-stage to focus the imaging system at the first sample location.Type: ApplicationFiled: September 25, 2023Publication date: April 4, 2024Inventors: Yu Chen, Gregory Holst, John Earney, Patrick Wen, Chia-Hsi Liu, Daeyong Sim
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Publication number: 20220359754Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. The plurality of the second type of epitaxial layers is oxidized in the source/drain region. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed in the opening.Type: ApplicationFiled: July 15, 2022Publication date: November 10, 2022Inventors: Huan-Sheng WEI, Hung-Li CHIANG, Chia-Wen LIU, Yi-Ming SHEU, Zhiqiang WU, Chung-Cheng WU, Ying-Keung LEUNG
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Patent number: 11393926Abstract: A multi-gate semiconductor device having a fin element, a gate structure over the fin element, an epitaxial source/drain feature adjacent the fin element; a dielectric spacer interposing the gate structure and the epitaxial source/drain feature.Type: GrantFiled: November 26, 2019Date of Patent: July 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Huan-Sheng Wei, Hung-Li Chiang, Chia-Wen Liu, Yi-Ming Sheu, Zhiqiang Wu, Chung-Cheng Wu, Ying-Keung Leung
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Patent number: 11152338Abstract: A method includes forming a stacked structure of a plurality of first semiconductor layers and a plurality of second semiconductor layers alternately stacked in a first direction over a substrate, the first semiconductor layers being thicker than the second semiconductor layers. The method also includes patterning the stacked structure into a first fin structure and a second fin structure extending along a second direction substantially perpendicular to the first direction. The method further includes removing the first semiconductor layers of the first fin structure to form a plurality of nanowires. Each of the nanowires has a first height, there is a distance between two adjacent nanowires along the vertical direction, and the distance is greater than the first height. The method includes forming a first gate structure between the second semiconductor layers of the first fin structure.Type: GrantFiled: June 1, 2020Date of Patent: October 19, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Zhi-Qiang Wu, Chun-Fu Cheng, Chung-Cheng Wu, Yi-Han Wang, Chia-Wen Liu
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Patent number: 11145762Abstract: A multi-gate semiconductor device having a fin element, a gate structure over the fin element, an epitaxial source/drain feature adjacent the fin element; a dielectric spacer interposing the gate structure and the epitaxial source/drain feature.Type: GrantFiled: June 25, 2018Date of Patent: October 12, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Huan-Sheng Wei, Hung-Li Chiang, Chia-Wen Liu, Yi-Ming Sheu, Zhiqiang Wu, Chung-Cheng Wu, Ying-Keung Leung
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Publication number: 20200294973Abstract: A method includes forming a stacked structure of a plurality of first semiconductor layers and a plurality of second semiconductor layers alternately stacked in a first direction over a substrate, the first semiconductor layers being thicker than the second semiconductor layers. The method also includes patterning the stacked structure into a first fin structure and a second fin structure extending along a second direction substantially perpendicular to the first direction. The method further includes removing the first semiconductor layers of the first fin structure to form a plurality of nanowires. Each of the nanowires has a first height, there is a distance between two adjacent nanowires along the vertical direction, and the distance is greater than the first height. The method includes forming a first gate structure between the second semiconductor layers of the first fin structure.Type: ApplicationFiled: June 1, 2020Publication date: September 17, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Zhi-Qiang WU, Chun-Fu CHENG, Chung-Cheng WU, Yi-Han WANG, Chia-Wen LIU
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Patent number: 10734503Abstract: A semiconductor device includes a first type region including a first conductivity type and a second type region including a second conductivity type. The semiconductor device includes a channel region extending between the first type region and the second type region. The semiconductor device includes a gate electrode surrounding at least some of the channel region. A first gate edge of the gate electrode is separated a first distance from a first type region edge of the first type region and a second gate edge of the gate electrode is separated a second distance from a second type region edge of the second type region. The first distance is less than the second distance.Type: GrantFiled: June 29, 2018Date of Patent: August 4, 2020Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Jean-Pierre Colinge, Carlos H. Diaz, Yeh Hsu, Tsung-Hsing Yu, Chia-Wen Liu
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Patent number: 10672742Abstract: A device includes a substrate, a stacked structure and a first gate stack. The stacked structure includes a plurality of first semiconductor layers and a plurality of second semiconductor layers alternately stacked over the substrate. One of the first semiconductor layers has a height greater than a height of one the second semiconductor layers. The first gate stack wraps around the stacked structure.Type: GrantFiled: October 26, 2017Date of Patent: June 2, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Zhi-Qiang Wu, Chun-Fu Cheng, Chung-Cheng Wu, Yi-Han Wang, Chia-Wen Liu
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Publication number: 20200098923Abstract: A multi-gate semiconductor device having a fin element, a gate structure over the fin element, an epitaxial source/drain feature adjacent the fin element; a dielectric spacer interposing the gate structure and the epitaxial source/drain feature.Type: ApplicationFiled: November 26, 2019Publication date: March 26, 2020Inventors: Huan-Sheng WEI, Hung-Li CHIANG, Chia-Wen LIU, Yi-Ming SHEU, Zhiqiang WU, Chung-Cheng WU, Ying-Keung LEUNG
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Publication number: 20190131274Abstract: A device includes a substrate, a stacked structure and a first gate stack. The stacked structure includes a plurality of first semiconductor layers and a plurality of second semiconductor layers alternately stacked over the substrate. One of the first semiconductor layers has a height greater than a height of one the second semiconductor layers. The first gate stack wraps around the stacked structure.Type: ApplicationFiled: October 26, 2017Publication date: May 2, 2019Inventors: Zhi-Qiang WU, Chun-Fu CHENG, Chung-Cheng WU, Yi-Han WANG, Chia-Wen LIU
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Patent number: 10276664Abstract: A semiconductor device having a channel formed from a nanowire with a multi-dimensional diameter is provided. The semiconductor device comprises a drain region formed on a semiconductor substrate. The semiconductor device further comprises a nanowire structure formed between a source region and the drain region. The nanowire structure has a first diameter section joined with a second diameter section. The first diameter section is coupled to the drain region and has a diameter greater than the diameter of the second diameter section. The second diameter section is coupled to the source region. The semiconductor device further comprises a gate region formed around the junction at which the first diameter section and the second diameter section are joined.Type: GrantFiled: February 10, 2014Date of Patent: April 30, 2019Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Tsung-Hsing Yu, Chia-Wen Liu, Yeh Hsu, Jean-Pierre Colinge
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Publication number: 20180323284Abstract: A semiconductor device includes a first type region including a first conductivity type and a second type region including a second conductivity type. The semiconductor device includes a channel region extending between the first type region and the second type region. The semiconductor device includes a gate electrode surrounding at least some of the channel region. A first gate edge of the gate electrode is separated a first distance from a first type region edge of the first type region and a second gate edge of the gate electrode is separated a second distance from a second type region edge of the second type region. The first distance is less than the second distance.Type: ApplicationFiled: June 29, 2018Publication date: November 8, 2018Inventors: Jean-Pierre COLINGE, Carlos H. DIAZ, Yeh HSU, Tsung-Hsing YU, Chia-Wen LIU
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Publication number: 20180301560Abstract: A multi-gate semiconductor device having a fin element, a gate structure over the fin element, an epitaxial source/drain feature adjacent the fin element; a dielectric spacer interposing the gate structure and the epitaxial source/drain feature.Type: ApplicationFiled: June 25, 2018Publication date: October 18, 2018Inventors: Huan-Sheng WEI, Hung-Li CHIANG, Chia-Wen LIU, Yi-Ming SHEU, Zhiqiang WU, Chung-Cheng WU, Ying-Keung LEUNG
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Patent number: 10026826Abstract: A semiconductor device includes a first type region including a first conductivity type and a second type region including a second conductivity type. The semiconductor device includes a channel region extending between the first type region and the second type region. The semiconductor device includes a gate electrode surrounding at least some of the channel region. A first gate edge of the gate electrode is separated a first distance from a first type region edge of the first type region and a second gate edge of the gate electrode is separated a second distance from a second type region edge of the second type region. The first distance is less than the second distance.Type: GrantFiled: October 31, 2016Date of Patent: July 17, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Jean-Pierre Colinge, Carlos H. Diaz, Yeh Hsu, Tsung-Hsing Yu, Chia-Wen Liu
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Patent number: 10008603Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed having a gate dielectric and a gate electrode in the opening. A dielectric material is formed abutting the portion of the gate structure.Type: GrantFiled: November 18, 2016Date of Patent: June 26, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Huan-Sheng Wei, Hung-Li Chiang, Chia-Wen Liu, Yi-Ming Sheu, Zhiqiang Wu, Chung-Cheng Wu, Ying-Keung Leung
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Publication number: 20180145176Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed having a gate dielectric and a gate electrode in the opening. A dielectric material is formed abutting the portion of the gate structure.Type: ApplicationFiled: November 18, 2016Publication date: May 24, 2018Inventors: Huan-Sheng WEI, Hung-Li CHIANG, Chia-Wen LIU, Yi-Ming SHEU, Zhiqiang WU, Chung-Cheng WU, Ying-Keung LEUNG