Abstract: A chip package includes an application chip, a micro-electromechanical systems (MEMS) chip, a conductive element, a bonding wire, and a molding compound. The application chip has a conductive pad. The MEMS chip is located on the application chip, and includes a main body and a cap. The main body is located between the cap and the application chip. The main body has a conductive pad. The conductive element is located on the conductive pad of the main body of the MEMS chip. The bonding wire extends from the conductive element to the conductive pad of the application chip. The molding compound is located on the application chip and surrounds the MEMS chip. The conductive element and the bonding wire are located in the molding compound.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A method, comprising: detecting an outage of at least one functionality in a live streaming; performing an first operation toward a second user terminal; storing data of the first operation in a database of the first user terminal; and displaying an effect corresponding to the first operation during the outage. The present disclosure may store the data of operation performed by the user terminal during outage and process the operation after the outage is recovered. Therefore, the streamers and viewers may feel interested and satisfied, instead of feeling anxious, and the user experience may be enhanced.

Abstract: The present disclosure provides a method of manufacturing a semiconductor device. The method includes: forming a transistor region in a substrate; forming a gate dielectric layer over the transistor region; forming a diffusion-blocking layer over the gate dielectric layer; forming a first portion of a work function layer over the diffusion-blocking layer; forming a second portion of the work function layer over the first portion of the work function layer; forming a plurality of barrier elements on or under a top surface of the second portion of the work function layer; and forming a gate electrode over the work function layer, wherein the plurality of barrier elements block oxygen from diffusing into the work function layer during the formation of the gate electrode.

Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: A reducer module with real-time torque sensing includes two harmonic reducers that are installed in opposite directions in a casing and located in front of and behind a ring, respectively; and a plurality of torque sensors mounted on ribs of the ring for measuring a torque value. The ring's inner circle, the front harmonic reducer, and the rear harmonic reducer are centrally bored to form a channel, through which wires of the torque sensors go out the reducer module and are prevented from torsion and stretch during operation of the reducer module.

Abstract: A reducer module with real-time torque sensing includes two harmonic reducers that are installed in opposite directions in a casing and located in front of and behind a ring, respectively; and a plurality of torque sensors mounted on ribs of the ring for measuring a torque value. The ring's inner circle, the front harmonic reducer, and the rear harmonic reducer are centrally bored to form a channel, through which wires of the torque sensors go out the reducer module and are prevented from torsion and stretch during operation of the reducer module.

Abstract: A SCARA arm includes a base, a first arm, a second arm, a third linear shaft motor, and a fourth shaft motor. On the base is disposed a first shaft motor. The first arm is connected to and driven by the first shaft motor rotate in a horizontal direction. The second arm is fixed to a second shaft motor which is connected to the first arm to rotate the second arm in the horizontal direction. The third linear shaft motor includes a linear motor stator which extends in a vertical direction and is fixed to the second arm, and a linear motor mover which is sleeved onto the linear motor stator and movable along the vertical direction. The fourth shaft motor is drivingly connected to the linear motor mover and a rotary shaft, respectively, and another end of the rotary shaft is inserted out of the second arm.

Abstract: A dental positioning stent for drilling an implant hole and a manufacturing method, a using method and components for the same are provided. The manufacturing method includes: slicing a tooth mold and a false tooth model along a preset slice plane; fixing two markers in the preset slice plane on two sides of the false tooth model respectively; covering the markers and the false tooth model with a shaping agent to form a positioning stent; putting the positioning stent on the teeth in a mouth to perform tomography imaging to acquire a slice image of the preset slice plane; mounting a positioning aid having a positioning hole in the positioning stent according to the slice image pasted up on the tooth mold to guide an initial drill. A dental positioning stent for tomography imaging, and a manufacturing method, a using method, and components thereof are provided.

Abstract: A dental positioning stent for drilling an implant hole and a manufacturing method, a using method and components for the same are provided. The manufacturing method includes: slicing a tooth mold and a false tooth model along a preset slice plane; fixing two markers in the preset slice plane on two sides of the false tooth model respectively; covering the markers and the false tooth model with a shaping agent to form a positioning stent; putting the positioning stent on the teeth in a mouth to perform tomography imaging to acquire a slice image of the preset slice plane; mounting a positioning aid having a positioning hole in the positioning stent according to the slice image pasted up on the tooth mold to guide an initial drill. A dental positioning stent for tomography imaging, and a manufacturing method, a using method, and components thereof are provided.

Abstract: A dental positioning stent for drilling an implant hole and a manufacturing method, a using method and components for the same are provided. The manufacturing method includes: slicing a tooth mold and a false tooth model along a preset slice plane; fixing two markers in the preset slice plane on two sides of the false tooth model respectively; covering the markers and the false tooth model with a shaping agent to form a positioning stent; putting the positioning stent on the teeth in a mouth to perform tomography imaging to acquire a slice image of the preset slice plane; mounting a positioning aid having a positioning hole in the positioning stent according to the slice image pasted up on the tooth mold to guide an initial drill. A dental positioning stent for tomography imaging, and a manufacturing method, a using method, and components thereof are provided.

Abstract: A method with television (TV) tuning function applied on a digital photo frame (DPF) is provided. The method includes: fetching a prompt time of at least one particular TV program; determining whether a prompt time of a particular TV program is about to arrive or has already arrived at the current time; fetching a prompt signal of the particular TV program whose prompt time is about to arrive or has already arrived, and outputting the prompt signal to prompt a particular TV program is being aired or about to air; switching the DPF from the DPF mode to a TV mode and providing the channel parameter of the particular TV program upon receiving a mode switching signal during the outputting of the prompt signal; and; and receiving and playing the particular TV program according to the channel parameter. A related DPF is also provided.

Abstract: A dental positioning stent for drilling an implant hole and a manufacturing method, a using method and components for the same are provided. The manufacturing method includes: slicing a tooth mold and a false tooth model along a preset slice plane; fixing two markers in the preset slice plane on two sides of the false tooth model respectively; covering the markers and the false tooth model with a shaping agent to form a positioning stent; putting the positioning stent on the teeth in a mouth to perform tomography imaging to acquire a slice image of the preset slice plane; mounting a positioning aid having a positioning hole in the positioning stent according to the slice image pasted up on the tooth mold to guide an initial drill. A dental positioning stent for tomography imaging, and a manufacturing method, a using method, and components thereof are provided.

Abstract: A method for outputting multimedia files and broadcast contents of a selected television (TV) channels on the DPF in a picture-in-picture (PIP) output mode is provided. The method includes: starting the PIP output mode when the DPF plays multimedia files under a DPF mode; defining a PIP region on the DPF; receiving broadcasts of a selected TV channel; and outputting the multimedia files and the broadcast contents of the selected TV channel in the PIP output mode. A related DPF is also provided.

Abstract: A method used in a digital photo frame (DPF) with television (TV) tuning function is provided. The method includes: receiving search parameters input by users during a DPF mode of the DPF; searching in a pre-stored TV program schedule to find TV programs matched the search parameters; determining whether any of the TV programs matched the search parameters is on or about to start at the current time; displaying a program list showing information at least on the “currently on” or “about to start” TV programs among the matched TV programs; switching the DPF from the DPF mode to a TV mode if a “currently on” or “about to start” TV program is selected to play; and receiving and playing the selected TV program. A related DPF is provided.

Abstract: A method for outputting multimedia files and broadcast contents of a selected television (TV) channels on the DPF in a picture-in-picture (PIP) output mode is provided. The method includes: starting the PIP output mode when the DPF plays multimedia files under a DPF mode; defining a PIP region on the DPF; receiving broadcasts of a selected TV channel; and outputting the multimedia files and the broadcast contents of the selected TV channel in the PIP output mode. A related DPF is also provided.

Abstract: A method of a digital photo frame (DPF) with television (TV) tuning function is provided. The method includes: creating one or more preview windows on the DPF under the DPF mode; receiving broadcasts of particular channels; displaying the broadcast contents of the particular channels in each of the preview windows; switching the DPF to a TV mode if a mode switching signal is received within the display of the broadcast contents of the particular channels; determining which of favorite channels currently previewed in the preview windows is selected; and receiving and playing broadcasts of the selected particular channel. A related DPF is also provided.

Abstract: A method of a digital photo frame (DPF) with mode switching function is provided. The method includes: determining whether the DPF is in a DPF mode or a TV mode upon receiving a power off signal; detecting whether any multimedia file exists in the DPF if the DPF is in the TV mode; and switching the DPF from the TV mode to the DPF mode if any multimedia file exists in the storage. A related DPF is also provided.