Patents by Inventor Chia-Yu Liu

Chia-Yu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11182918
    Abstract: A distance measurement device including a pixel array and a cover layer is provided. The cover layer is covered on the pixel array. The cover layer includes a first cover pattern covering on a first area of a plurality of first pixels and a second cover pattern covering on a second area of a plurality of second pixels. The first area and the second area are rectangles of mirror symmetry along a first direction.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 23, 2021
    Assignee: SK hynix Inc.
    Inventors: En-Feng Hsu, Chia-Yu Liu
  • Publication number: 20210359123
    Abstract: A semiconductor power device includes a substrate; a buffer structure formed on the substrate; a barrier structure formed on the buffer structure; a channel layer formed on the barrier structure; and a barrier layer formed on the channel layer; wherein the barrier structure includes a first functional layer on the buffer structure, a second functional layer formed between the first functional layer and the buffer structure, a first back-barrier layer on the first functional layer, and an interlayer between the first back-barrier layer and the first functional layer; wherein a material of the first back-barrier layer includes Alx1Ga1-x1N, a material of the first functional layer includes Alx2Ga1-x2N, a material of the interlayer includes Alx3Ga1-x3N, a material of the second functional layer includes Alx4Ga1-x4N, wherein 0<x1?1, 0?x2?1, 0?x3?1, 0?x4<1, and x1?x2; and wherein the first functional layer includes a first thickness, the second functional layer includes a second thickness, and the second thic
    Type: Application
    Filed: July 28, 2021
    Publication date: November 18, 2021
    Inventors: Ya-Yu YANG, Shang-Ju TU, Tsung-Cheng CHANG, Chia-Cheng LIU
  • Publication number: 20210353605
    Abstract: Provided herein is a method for treating an oral cancer in a subject. According to embodiments of the present disclosure, the method comprises respectively obtaining a first and a second biological samples from a lesion site and a non-lesion site of the subject; respectively measuring the expression levels of CHEK1, PIK3CA, or PIK3CD in both biological samples by qRT-PCR thereby obtaining a first and a second expression level; determining the ratio of the first to the second expression level; and administering to the subject an effective amount of a checkpoint kinase 1 inhibitor when the ratio for CHEK1 is at least 1.7 or a phosphatidylinositol 3-kinase inhibitor when the ratio for PIK3CA is at least 2.4, or when the ratio for PIK3CD is at least 3.1.
    Type: Application
    Filed: May 14, 2020
    Publication date: November 18, 2021
    Applicants: Chang Gung University, Chang Gung Memorial Hospital, Linkou
    Inventors: Chia-Yu YANG, Kai-Ping CHANG, Chia-Hsun HSIEH, Chih-Ching WU, Chun-Nan OUYANG, Chiao-Rou LIU
  • Publication number: 20210357058
    Abstract: A touch display device includes a display panel, a conductive layer, an optical matching layer and a buffer layer. The display panel comprises a first substrate, a second substrate and a display medium layer. The first substrate comprises a first surface and a second surface, the second substrate is disposed opposite to the first substrate, and the display medium layer is disposed between the second surface of the first substrate and the second substrate. The conductive layer is disposed on the first surface of the first substrate, and comprises a plurality of sensing electrodes. The optical matching layer is disposed between the conductive layer and the first surface of the first substrate. The buffer layer with a thickness greater than or equal to 50 ? and less than or equal to 3000 ? is disposed between the optical matching layer and the first surface of the first substrate.
    Type: Application
    Filed: April 14, 2021
    Publication date: November 18, 2021
    Inventors: Tzung-Hsien Hsu, Chih-Wei Chen, Mei-Ling Chou, Chia-Yu Liu, Yao-Chih Chuang
  • Publication number: 20210351172
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Application
    Filed: July 19, 2021
    Publication date: November 11, 2021
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11171065
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: November 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Publication number: 20210343591
    Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.
    Type: Application
    Filed: July 13, 2021
    Publication date: November 4, 2021
    Inventors: Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen
  • Patent number: 11153233
    Abstract: A network packet receiving device that includes packet queues, a credit allocation circuit and a credit management circuit is provided. Each of the packet queues corresponds to a packet transmission channel and receives packets. The credit allocation circuit calculates packet amount of each of the packet queues to control the descriptor credit of each of the packet queues within a credit range. The credit management circuit points each of public entries of a public link list to one of descriptors in a single descriptor buffer. The credit management circuit further receives a credit requesting command from the packet queues to assign the descriptors to the packet queues through the public entries under the condition that the descriptor credit is within a credit range such that a DMA circuit performs a DMA operation on the packets according to the descriptors.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: October 19, 2021
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Xi-Cheng Shan, Jie Wang, Chang-Chun Li, Chia-Hung Lin, Guan-Yu Liu, Shan Che, Jian-Jun Wang, Jun-Da Shi
  • Publication number: 20210310803
    Abstract: A sensing element includes a plurality of sensing pixel areas arranged in matrix, wherein each of the plurality of sensing pixel areas includes a first pixel, a second pixel, a first shielding layer, a second shielding layer and at least one micro lens. The second pixel is adjacent to the first pixel in a predetermined direction. The first shielding layer is disposed on the first pixel and has a first opening, wherein an aperture of the first opening increases along the predetermined direction from a center of the first pixel. The second shielding layer is disposed on the second pixel and has a second opening, wherein a shape of the second opening is mirror symmetrical with that of the first opening in the predetermined direction. The at least one micro lens is disposed on the first shielding layer and the second shielding layer.
    Type: Application
    Filed: June 18, 2021
    Publication date: October 7, 2021
    Inventors: EN-FENG HSU, CHIA-YU LIU
  • Patent number: 11132941
    Abstract: A display panel and a pixel circuit of the display panel are provided. The pixel circuit includes a driving transistor and a light-emitting time length modulator. The driving transistor has a control terminal receiving a pulse width control signal and an amplitude control signal, and the driving transistor generates a driving signal. In a first time period, the light-emitting time length modulator modulates a time length of a plurality of second time periods for providing the driving signal to a light-emitting device according to a light-emitting time control signal.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: September 28, 2021
    Assignee: Au Optronics Corporation
    Inventors: Peng-Bo Xi, Chen-Chi Lin, Yan-Ru Chen, Cheng-Nan Yeh, Sheng-Yu Hsu, Chia-Che Hung, En-Chih Liu
  • Patent number: 11128830
    Abstract: A sensing module is provided, including a sensing unit. The sensing unit is formed by a plurality of sensing pixels arranged in an array. Each of the plurality of sensing pixels includes a body and a sensing element. The sensing element is disposed on a bottom surface of the body. During sensing, a light may enter and pass through the bodies and be transmitted to the sensing elements. The sensing pixels are divided into at least a first group and a second group from a center of the array to a periphery of the array, and photon collection efficiency of sensing pixels in the first group is less than photon collection efficiency of sensing pixels in the second group. Meanwhile, a design method of a sensing module is also provided.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 21, 2021
    Assignee: Egis Technology Inc.
    Inventor: Chia-Yu Liu
  • Patent number: 11121031
    Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: September 14, 2021
    Assignee: XINTEC INC.
    Inventors: Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen
  • Patent number: 11115606
    Abstract: A motherboard is capable of outputting image data and includes an image transmission port, an on-board video graphics array (VGA) card, a switching circuit, a control circuit, and a first network connection port. The image transmission port is configured to receive an external image signal. The on-board VGA card is configured to provide an internal image signal. The switching circuit selectively uses the external image signal or the internal image signal as image data. The control circuit selectively uses the image data or Ethernet network data as output data. The first network connection port is configured to transmit the output data.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: September 7, 2021
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Yin-Yu Lin, Chia-En Liu, Chun-Chung Huang
  • Patent number: 11079062
    Abstract: A display device includes a monitor and a support module including a base frame, a support frame and a driving unit. The base frame includes a base seat and a rotating seat connected to the base seat and rotatable about an axis. The support frame includes a connecting mechanism connected to the monitor, and a support member connected co-rotatably to the rotating seat and connected to the connecting mechanism. The driving unit includes a drive subunit co-rotatably secured to the rotating seat, and a control subunit mounted to the base seat, connected to the drive subunit, and being operable to drive rotation of the rotating seat about the axis via the drive subunit, thereby rotating the monitor about the axis.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: August 3, 2021
    Assignee: TOP VICTORY INVESTMENTS LIMITED
    Inventors: Yi-Sheng Lin, Chia-Yu Liu, Tung-Jung Hsueh
  • Patent number: 11073386
    Abstract: A sensing element includes a plurality of sensing pixel areas arranged in matrix, wherein each of the plurality of sensing pixel areas includes a first pixel, a second pixel, a first shielding layer, a second shielding layer and at least one micro lens. The second pixel is adjacent to the first pixel in a predetermined direction. The first shielding layer is disposed on the first pixel and has a first opening, wherein an aperture of the first opening increases along the predetermined direction from a center of the first pixel. The second shielding layer is disposed on the second pixel and has a second opening, wherein a shape of the second opening is mirror symmetrical with that of the first opening in the predetermined direction. The at least one micro lens is disposed on the first shielding layer and the second shielding layer.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: July 27, 2021
    Assignee: PIXART IMAGING INC.
    Inventors: En-Feng Hsu, Chia-Yu Liu
  • Publication number: 20210226474
    Abstract: A power system including a battery, a first port, a first converter, a second port, a second converter, a switch, a power controller, and a control unit is provided. The first port is electrically connected to the battery through a first charging/discharging path. The second port is electrically connected to the battery through a second charging/discharging path and is electrically connected to the first port through a third charging/discharging path. The first converter and the second converter are disposed on the first charging/discharging path and the second charging/discharging path respectively. The switch is disposed on the third charging/discharging path. The power controller is electrically connected to the first port and the second port for forming a power transmission mode with an external device. The control unit is configured to control the first converter, the second converter, and the switch according to the power transmission mode.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 22, 2021
    Inventors: Chia-Yu LIU, Yii-Lin WU, Kian-Ming CHEE, Kai-Chun LIANG
  • Publication number: 20210226457
    Abstract: A power system applied to a handheld device including a battery, a first connecting port, a second connecting port, a first detector, a second detector, a power delivery controller, a control unit, and a switching element is provided. The first connecting port is electrically connected to the battery through a first charging path. The second connecting port is electrically connected to the battery through a second charging path. The first detector is electrically connected to the first connecting port to generate a first detection signal. The second detector is electrically connected to the second connecting port to generate a second detection signal. The control unit controls the switching element according to the first detection signal and the second detection signal to selectively electrically connect the power delivery controller to the first connecting port or the second connecting port and controls conduction statuses of the charging paths.
    Type: Application
    Filed: January 19, 2021
    Publication date: July 22, 2021
    Inventors: Kai-Chun LIANG, Kian-Ming CHEE, Chia-Yu LIU, Yii-Lin WU
  • Publication number: 20210204393
    Abstract: A method for manufacturing a flexible panel is provided, and the method includes following steps. A column is formed on a carrier substrate. A flexible layer is formed on the carrier substrate, where at least a part of a side surface of the column is surrounded by the flexible layer, so as to form a through hole in the flexible layer. A component layer is formed on the flexible layer, and the column and the carrier substrate are removed. No chars, cracks, and cutting marks are formed on an edge of the through hole of the flexible panel.
    Type: Application
    Filed: November 23, 2020
    Publication date: July 1, 2021
    Applicant: HannStar Display Corporation
    Inventors: Yao-Chih Chuang, Mei-Ling Chou, Chih-Wei Chen, Ming-Chang Yu, Chia-Yu Liu, Yen-Chung Chen
  • Publication number: 20210180741
    Abstract: A display device includes a monitor and a support module including a base frame, a support frame and a driving unit. The base frame includes a base seat and a rotating seat connected to the base seat and rotatable about an axis. The support frame includes a connecting mechanism connected to the monitor, and a support member connected co-rotatably to the rotating seat and connected to the connecting mechanism. The driving unit includes a drive subunit co-rotatably secured to the rotating seat, and a control subunit mounted to the base seat, connected to the drive subunit, and being operable to drive rotation of the rotating seat about the axis via the drive subunit, thereby rotating the monitor about the axis.
    Type: Application
    Filed: April 2, 2020
    Publication date: June 17, 2021
    Inventors: Yi-Sheng LIN, Chia-Yu LIU, Tung-Jung HSUEH
  • Patent number: 11015927
    Abstract: An optical sensor includes at least two optical sensing pixels and at least two different grating elements. These grating elements are disposed above these optical sensing pixels correspondingly.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 25, 2021
    Assignee: PIXART IMAGING INC.
    Inventors: En-Feng Hsu, Chia-Yu Liu