Abstract: A memory includes a data storage device, a data processing device, and a contact element. The data processing device is disposed over the data storage device. The contact element is disposed between the data storage device and the data processing device. The contact element electrically connects the data storage device with the data processing device.

Abstract: A method of manufacturing a semiconductor memory is provided. The method includes steps of forming a data storage device; forming a data processing device over the data storage device; forming a contact element electrically connected to the data storage device; and forming a data processing device over the data storage device and electrically connected to the contact element.

Abstract: A method of manufacturing a semiconductor structure is provided. A conductive layer is formed on a precursor memory structure. A target layer is formed on the conductive layer. A first photoresist with a first opening is formed on the target layer. A spacer is formed on sidewalls of the first opening. A second photoresist with a second opening is formed on the target layer and the spacer. The target layer is patterned by the second photoresist and the spacer to form a first patterned target layer. A third photoresist with a third opening is formed on the first patterned target layer. The first patterned target layer is patterned by the third photoresist to form a second patterned target layer. The conductive layer is patterned by the second patterned target layer to form a patterned conductive layer including a ring structure aligned with a source/drain region.

Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.

Abstract: A method and apparatus are disclosed, from the perspective of a UE, for transmitting UL RS. In one embodiment, the method includes deriving a first transmit power of a first UL RS based on a first power control mechanism, wherein derivation of the first transmit power based on the first power control mechanism is associated with an uplink data channel. In addition, the method includes deriving a second transmit power of a second UL RS based on a second power control mechanism, wherein derivation of the second transmit power based on the second power control mechanism is not associated with the uplink data channel. Furthermore, the method includes transmitting the first UL RS with the first transmit power. The method also includes transmitting the second UL RS with the second transmit power.

Abstract: A method and apparatus are disclosed. In an example from the perspective of a User Equipment (UE) configured with uplink (UL) spatial multiplexing and UL skipping, the UE receives, from a base station, two UL grants for a Transmission Time Interval (TTI). The UE generates two Medium Access Control (MAC) Protocol Data Units (PDUs) for the TTI, wherein a first MAC PDU of the two MAC PDUs is able to accommodate all available data of the UE. The UE transmits the two MAC PDUs to the base station.

Abstract: A detection element, a manufacturing method thereof and a flat panel detector are disclosed. The detection element includes: a base substrate; a first electrode on the base substrate; a photoelectric conversion layer; a transparent electrode and a second electrode electrically connected with the transparent electrode on a side of the photoelectric conversion layer away from the first electrode. An orthographic projection of the photoelectric conversion layer on the base substrate completely falls within an orthographic projection of the first electrode on the base substrate, in a plane parallel to the base substrate, the transparent electrode is located at a middle portion of the photoelectric conversion, an orthographic projection of a portion of the photoelectric conversion layer not covered by the transparent electrode on the base substrate at least partially falls within an orthographic projection of the second electrode on the base substrate.

Abstract: A semiconductor device includes a device layer with a semiconductor element, a first dielectric layer on the device layer, a first conductive line on the device layer and surrounded by the first dielectric layer, and a second dielectric layer on the first dielectric layer and around the first conductive line. The semiconductor includes a spacer disposed on the first conductive line and abutting a sidewall of the second dielectric layer, and a first conductive via disposed on the first conductive line and the spacer. The first conductive via includes a first segment positioned over the spacer and including a first width, and a second segment positioned between the first segment the first conductive line and including a second width. The first width is larger than the second width.

Abstract: A method and apparatus are disclosed. In an example from the perspective of a User Equipment (UE), a configuration for monitoring downlink control information (DCI) indicative of a slot format may be received. In some examples, the configuration indicates the UE to monitor a first DCI in a first monitoring occasion associated with a slot and to monitor a second DCI in a second monitoring occasion. The first DCI is indicative of the slot format. Configured transmission and/or configured reception may be performed on one or more symbols when the first DCI is not received in the first monitoring occasion, the second DCI is received in the second monitoring occasion and the second DCI is indicative of the slot format for the slot. The one or more symbols are configured as flexible by a Radio Resource Control (RRC) configuration. The one or more symbols are in the slot.

Abstract: An illumination system and a projection device are provided. The illumination system includes a laser light source, a light splitting element, a wavelength conversion module, a filter module, and a homogenizing element. The laser light source provides a laser beam to the light splitting element. The filter module rotates around a rotation axis and has multiple dichroic filter regions on a surface perpendicular to the rotation axis. The filter module receives the laser beam from the light splitting element, and an acute angle is formed between the rotation axis and a direction in which the laser beam enters the filter module. The homogenizing element is located on a transmission path of the laser beam penetrating the filter module, and the laser beam enters the homogenizing element along a long axis direction of the homogenizing element.

Abstract: A portable electronic device is provided. The portable electronic device includes a main body and an accessory. The main body includes a display region, a non-display region, and a plurality of magnetic sensors. The magnetic sensors are disposed on the non-display region along a path. The accessory is movably disposed on the non-display region and includes a magnetic element. When the accessory moves on the non-display region, the accessory drives the magnetic element moving along the path.

Abstract: A protective case applied to assemble to a handheld electronic device is provided. The protective case includes an inner surface, an outer surface, a connector, a plurality of first detachable connecting structures, and a plurality of first electrical connecting structures. The connector is located at the inner surface to electrically connect to the handheld electronic device. The connector includes a plurality of signal transmitting pins. The first detachable connecting structures are arranged in a first array on the outer surface. The first electrical connecting structures are arranged in a second array on the outer surface. The first electrical connecting structures are electrically connected to the signal transmitting pins respectively.

Abstract: A method for manufacturing a semiconductor device includes preparing a first group of wafers having a plurality of first semiconductor dies embedded in a first photosensitive material layer; forming a plurality of first through vias in the first photosensitive material layer; attaching at least two of the first group of wafers using a first adhesive layer to form a first structure; preparing a second group of wafers having a plurality of second semiconductor dies embedded in a second photosensitive material layer; forming a plurality of second through vias in the second photosensitive material layer; attaching at least two of the second group of wafers using a second adhesive layer to form a second structure; and connecting the first structure to the second structure with a plurality of first metal bumps.

Abstract: Methods and apparatuses are provided for channel access switching in a wireless communication system, with or without Listen-Before-Talk (LBT), and/or with different types of efficiently operated LBT. A device, including a User Equipment (UE) or a base station, can determine whether and/or how to perform LBT for a transmission based on a property of the transmission. The property could be a resource allocation for the transmission. The property could be a way to allocate resources for the transmission. The property could be a length or size of resource allocated for the transmission. The property could be an amount of resources allocated for the transmission. The resource allocation could be a time domain resource allocation and/or a frequency domain resource allocation.

Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.

Abstract: The present disclosure provides a composition for submucosal injection including a divalent cation and an oligosaccharide obtained by exposing powdered polysaccharides to irradiation, heat, ultrasound, or ultraviolet radiation. The composition may be provided as a single solution; or the divalent cation and the oligosaccharide may be separately packaged, with the divalent cation being provided in solution form and the oligosaccharide being provided in powder form. The divalent cation may be 0.1-0.5% w/v of Ca2+, Mg2+, Fe2+, Cu2+, Ba2+, Zn2+, or any combination thereof. The oligosaccharide may be 0.5-2% w/v of degraded sodium alginate, degraded xanthan gum, degraded dextran, degraded welan gum, degraded gellan gum, degraded diutan gum, or any combination thereof. When the divalent cation is in contact with the oligosaccharide, viscosity of the composition is greater than 1000 cP, and injection pressure of the composition falls within a range of 2.5-4 kgf.

Abstract: A wet wipe which includes a first surface layer, a second surface layer and an absorbent layer is disclosed. The first surface layer has a first outer surface. The second surface layer has a second outer surface. The absorbent layer is arranged between the first surface layer and the second surface layer. A first coefficient of friction of the first outer surface is less than a second coefficient of friction of the second outer surface.

Abstract: An illumination system for providing an illumination light beam is provided, which includes a light-source module, a scattering element and a light uniforming element. The light-source module emits an illumination light beam. The scattering element is between the light-source module and the light uniforming element, and has multiple scattering areas with different haze values. A haze value of a first scattering area that is close to a center of the scattering element is greater than a haze value of a second scattering area that is remote from the center. A projection device is also provided. A scattering element of the invention has multiple scattering areas with different haze values, and a haze value of one that is close to a center of the scattering element is greater than a haze value of the other that is remote from the center, thereby increasing light energy utilization.