Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes first and second package components stacked upon and electrically connected to each other. The first package component includes first and second conductive bumps, the second package component includes third and fourth conductive bumps, and dimensions of the first and second conductive bumps are less than those of the third and fourth conductive bumps. The semiconductor package includes a first joint structure partially wrapping the first conductive bump and the third conductive bump, and a second joint structure partially wrapping the second conductive bump and the fourth conductive bump. A curvature of the first joint structure is different from a curvature of the second joint structure.

Abstract: A system and a method for uniformed surface measurement are provided, in which a sensor is provided to perform measurements on a carrier in a polishing machine, and a measuring trajectory of the sensor on the carrier is adjusted by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine in order to achieve uniformed surface measurements of the carrier and real-time constructions of the surface topography. This allows the polishing state of the carrier to be monitored in real time, thereby improving the efficiency of the polishing process. A sensing apparatus for uniformed surface measurement is also provided.

Abstract: The present invention is directed to systems and methods for generating virtually averaged optical coherence tomography (Oct.) images. An illustrative method can include receiving an image, identifying a first voxel of the image, and selecting a plurality of local voxels of the image. Each of the plurality of local voxels is within a defined region of the first voxel. The values of the plurality of local voxels can indicate an appearance of the local voxels in the image.

Abstract: A package structure includes a circuit element, a first semiconductor die, a second semiconductor die, a heat dissipating element, and an insulating encapsulation. The first semiconductor die and the second semiconductor die are located on the circuit element. The heat dissipating element connects to the first semiconductor die, and the first semiconductor die is between the circuit element and the heat dissipating element, where a sum of a first thickness of the first semiconductor die and a third thickness of the heat dissipating element is substantially equal to a second thickness of the second semiconductor die. The insulating encapsulation encapsulates the first semiconductor die, the second semiconductor die and the heat dissipating element, wherein a surface of the heat dissipating element is substantially leveled with the insulating encapsulation.

Abstract: A method for forming a semiconductor package structure includes stacking chips to form a chip stack over an interposer. The method also includes disposing a semiconductor die over the interposer. The method also includes filling a first encapsulating layer between the chips and surrounding the chip stack and the semiconductor die. The method also includes forming a second encapsulating layer covering the chip stack and the semiconductor die. The first encapsulating layer fills the gap between the chip stack and the semiconductor die.

Abstract: A touch electrode is provided in the disclosure, including a first electrode layer and a second electrode layer. The first electrode layer includes a plurality of first electrodes. Each of the first electrodes includes a plurality of first electrode wires and a plurality of first axis wires, in which each of the first axis wires is connected to and perpendicular to the first electrode wires. The second electrode layer is electrically insulated and located above or beneath the first electrode layer. The second electrode layer includes a plurality of second electrodes. Each of the second electrodes includes a plurality of second electrode wires, and the second electrodes are spaced apart from each other and connected to each other in parallel. The material of the first and the second electrode layers is metal nanowires. A touch panel and a touch display, including the touch electrode described herein, are also provided.

Abstract: Apparatus, circuits and methods for clock generation are disclosed herein. In some embodiments, an apparatus is disclosed. The apparatus includes: a first transistor pair electrically coupled to a pair of output nodes; a second transistor pair electrically coupled to the pair of output nodes; and an inductive unit electrically coupled between the output nodes and electrically coupled between gates of the first transistor pair. The inductive unit comprises: a first inductive element electrically coupled to one gate of the first transistor pair; and a second inductive element electrically coupled to one of the output nodes. The first inductive element and the second inductive element are configured to be magnetically coupled to each other.

Abstract: Apparatus, circuits and methods for clock generation are disclosed herein. In some embodiments, an apparatus is disclosed. The apparatus includes: a first transistor pair electrically coupled to a pair of output nodes; a second transistor pair electrically coupled to the pair of output nodes; and an inductive unit electrically coupled between the output nodes and electrically coupled between gates of the first transistor pair. The inductive unit comprises: a first inductive element electrically coupled to one gate of the first transistor pair; and a second inductive element electrically coupled to one of the output nodes. The first inductive element and the second inductive element are configured to be magnetically coupled to each other.

Abstract: A frequency generator is disclosed. The frequency generator is for generating an oscillator clock according to a reference clock, and the frequency generator is used in a frequency hopping system that switches a carrier frequency among a plurality of channels, and the carrier frequency further carries a modulation frequency for data transmission. The frequency generator includes: a frequency hopping and modulation control unit, arranged for generating a current channel according to a channel hopping sequence and a frequency command word (FCW) based on the reference clock, a digital-controlled oscillator (DCO), arranged for to generating the oscillator clock according to an oscillator tuning word (OTW) obtained according to the estimated DCO normalization value. An associated method is also disclosed.

Abstract: According to some embodiments, an integrated circuit device is disclosed. The integrated circuit device include at least one inductor having at least one turn, a magnetic coupling ring positioned adjacent to the at least one inductor, the magnetic coupling ring comprising at least two magnetic coupling turns, the at least two magnetic coupling turns are disposed adjacent to the at least one turn to enable magnetic coupling between the at least two magnetic coupling turns and the at least one turn The integrated circuit device also includes a power electrode and a ground electrode, wherein the power electrode and the ground electrode are coupled to the at least one inductor and the magnetic coupling ring to provide a first current in the at least one inductor having a direction opposite to a second current in the magnetic coupling ring to cancel at least a portion of a magnetic field generated by the at least one inductor.

Abstract: A cable connector disposed at a cable includes a signal protection device, an outer pipe and a transmission member. The signal protection device includes an inner pipe and a signal protection module. The inner pipe is inserted into the outer pipe through an end opening thereof such that a metallic conducting rod of the inner pipe is in the outer pipe. The signal protection module is inserted through another end opening of the outer pipe such that the metallic conducting rod of the inner pipe is penetratingly disposed at the signal protection module. The transmission member is inserted through another end opening of the outer pipe such that a conducting element is electrically connected to the metallic conducting rod of the inner pipe, revealing a transmission element. Therefore, the signal protection device is modularized and miniaturized.

Abstract: Systems and methods are provided for hopping a digitally controlled oscillator (DCO) among a plurality of channels, wherein a gain of the DCO KDCO is a nonlinear function of frequency. A first normalized tuning word (NTW) corresponding to a first channel of the plurality of channels is generated. A first normalizing gain multiplier X is generated based on the nonlinear function of frequency, on an estimate of the nonlinear function of frequency, at a first frequency corresponding to the first channel. The first NTW is multiplied by the first X to obtain a first oscillator tuning word (OTW). The first OTW is input to the DCO to cause the DCO to hop to the first channel. A system for hopping among a plurality of channels at a plurality of respective frequencies comprises a phase-locked loop (PLL), a digitally controlled oscillator (DCO), a multiplexer, and an arithmetic module.

Abstract: A frequency generator is disclosed. The frequency generator is for generating an oscillator clock according to a reference clock, and the frequency generator is used in a frequency hopping system that switches a carrier frequency among a plurality of channels, and the carrier frequency further carries a modulation frequency for data transmission. The frequency generator includes: a frequency hopping and modulation control unit, arranged for generating a current channel according to a channel hopping sequence and a frequency command word (FCW) based on the reference clock, a digital-controlled oscillator (DCO), arranged for to generating the oscillator clock according to an oscillator tuning word (OTW) Obtained according to the estimated DCO normalization value. An associated method is also disclosed.

Abstract: According to some embodiments, an integrated circuit device is disclosed. The integrated circuit device include at least one inductor having at least one turn, a magnetic coupling ring positioned adjacent to the at least one inductor, the magnetic coupling ring comprising at least two magnetic coupling turns, the at least two magnetic coupling turns are disposed adjacent to the at least one turn to enable magnetic coupling between the at least two magnetic coupling turns and the at least one turn. The integrated circuit device also includes a power electrode and a ground electrode, wherein the power electrode and the ground electrode are coupled to the at least one inductor and the magnetic coupling ring to provide a first current in the at least one inductor having a direction opposite to a second current in the magnetic coupling ring to cancel at least a portion of a magnetic field generated by the at least one inductor.

Abstract: A package structure includes a circuit element, a first semiconductor die, a second semiconductor die, a heat dissipating element, and an insulating encapsulation. The first semiconductor die and the second semiconductor die are located on the circuit element. The heat dissipating element connects to the first semiconductor die, and the first semiconductor die is between the circuit element and the heat dissipating element, where a sum of a first thickness of the first semiconductor die and a third thickness of the heat dissipating element is substantially equal to a second thickness of the second semiconductor die. The insulating encapsulation encapsulates the first semiconductor die, the second semiconductor die and the heat dissipating element, wherein a surface of the heat dissipating element is substantially leveled with the insulating encapsulation.

Abstract: A circuit is disclosed. The circuit includes a time-to-digital converter (TDC), and an evaluation circuit coupled to the TDC and a phase-locked loop (PLL) external to the circuit.

Abstract: A power distribution apparatus includes a power source terminal, a power-distributing module, at least a power distribution module, an input detection unit, at least an output detection unit and a management unit. The power source terminal receives an input power. The power-distributing module converts the input power into an output power. Each of the power distribution modules includes a plurality of output ports. The power distribution module receives the output power to output the output power through the output ports. The input detection unit detects the input power to generate a set of input information. The output detection unit detects the output power to generate at least a set of output information correspondingly. According to the input information or the output information, the management unit controls the output ports to be turned on or off correspondingly.

Abstract: A cable connector disposed at a cable includes a signal protection device, an outer pipe and a transmission member. The signal protection device includes an inner pipe and a signal protection module. The inner pipe is inserted into the outer pipe through an end opening thereof such that a metallic conducting rod of the inner pipe is in the outer pipe. The signal protection module is inserted through another end opening of the outer pipe such that the metallic conducting rod of the inner pipe is penetratingly disposed at the signal protection module. The transmission member is inserted through another end opening of the outer pipe such that a conducting element is electrically connected to the metallic conducting rod of the inner pipe, revealing a transmission element. Therefore, the signal protection device is modularized and miniaturized.

Abstract: Systems and methods are provided for hopping a digitally controlled oscillator (DCO) among a plurality of channels, wherein a gain of the DCO KDCO is a nonlinear function of frequency. A first normalized tuning word (NTW) corresponding to a first channel of the plurality of channels is generated. A first normalizing gain multiplier X is generated based on the nonlinear function of frequency, on an estimate of the nonlinear function of frequency, at a first frequency corresponding to the first channel. The first NTW is multiplied by the first X to obtain a first oscillator tuning word (OTW). The first OTW is input to the DCO to cause the DCO to hop to the first channel. A system for hopping among a plurality of channels at a plurality of respective frequencies comprises a phase-locked loop (PLL), a digitally controlled oscillator (DCO), a multiplexer, and an arithmetic module.

Abstract: A signal processing method and a signal processing system are provided to convert optical or electric signals by an effective circuit to have an increased dynamic contrast and reduced noises. The signal processing system includes an analog signal processing module and a digital signal processing module. When an optical signal of an object-to-be-detected is strong, an image-to-be-detected is obtained by an analog signal processing method. When the optical signal of the object-to-be-detected is weak, the image-to-be-detected is obtained by a digital signal processing method after background noises are filtered out.