Abstract: A cable management device includes a wiring body, having a first sidewall, a second sidewall and a groove rail, wherein the groove rail is formed between the first and second sidewalls and has a input end, a output end, and a corner between the input end and the output end. A first resisting element extends from one side of the first sidewall of the wiring body. A first elastic connecting element includes a first connecting part and a first elastic arm, wherein the first connecting part is connected between the wiring body and the first elastic arm. A second resisting element extends from one side of the second sidewall of the wiring body. A second elastic connecting element has a second connecting part and a second elastic arm, wherein the second connecting part is connected between the wiring body and the second elastic arm.

Abstract: A cable management device includes a wiring body, having a first sidewall, a second sidewall and a groove rail, wherein the groove rail is formed between the first and second sidewalls and has a input end, a output end, and a corner between the input end and the output end. A first resisting element extends from one side of the first sidewall of the wiring body. A first elastic connecting element includes a first connecting part and a first elastic arm, wherein the first connecting part is connected between the wiring body and the first elastic arm. A second resisting element extends from one side of the second sidewall of the wiring body. A second elastic connecting element has a second connecting part and a second elastic arm, wherein the second connecting part is connected between the wiring body and the second elastic arm.

Abstract: A light-emitting device comprising a heat dissipation carrier, a circuit board, a light-emitting element, a side heat conduction plate, an insulation shell and a light cover is provided. The circuit board is disposed on the heat dissipation carrier. The light-emitting element is disposed on the circuit board. The light cover is directly engaged with the heat dissipation carrier. The side heat conduction plate is engaged with the heat dissipation carrier and comprises a transverse plate and a side plate. The transverse plate carries the circuit board. The side plate is connected with the transverse plate. The insulation shell covers the side plate of the side heat conduction plate.

Abstract: A light-emitting device comprising a heat dissipation carrier, a circuit board, a light-emitting element, a side heat conduction plate, an insulation shell and a light cover is provided. The circuit board is disposed on the heat dissipation carrier. The light-emitting element is disposed on the circuit board. The light cover is directly engaged with the heat dissipation carrier. The side heat conduction plate is engaged with the heat dissipation carrier and comprises a transverse plate and a side plate. The transverse plate carries the circuit board. The side plate is connected with the transverse plate. The insulation shell covers the side plate of the side heat conduction plate.

Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

Abstract: Various examples of a lamp that produces omnidirectional light are described. The lamp may include a light-emission module. The light-emission module may include a substrate having a first primary surface. The first primary surface of the substrate may define a first horizontal plane that is substantially perpendicular to a longitudinal axis of the lamp. The light-emission module may also include at least one first light source and at least one second light source disposed on the first primary surface of the substrate. Each of the at least one second light source may include a light-emitting surface at an individually adjustable angle with respect to the first horizontal plane.

Abstract: A frame for a light apparatus and the light apparatus are provided. The light apparatus has at least one light-emitting diode chip. The frame includes an electrode portion, a first body and a second body. The frame has a first portion, a second portion and a bendable connecting portion which is located between the first portion and the second portion. An angle is formed between the first portion and the second portion by the connecting portion. The first body is disposed on the first portion. The first body has a first recess exposing a portion of a first electrode surface of the first portion. The light-emitting diode chip is disposed in the first recess and connected with the first electrode surface electrically. The second body is disposed on the second portion and exposes a portion of the connection surface of the second portion.

Abstract: A light tube including a heat sink, a light transmissive cover disposed on the heat sink, and at least one light source module is provided. A containing space is formed between the heat sink and the light transmissive cover. The light source module includes a carrier, a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of non-light-emitting passive devices. The carrier is disposed on the heat sink. The first light-emitting devices are arranged on the carrier along a first straight reference line to form a first line of light-emitting devices. The second emitting devices are arranged on the carrier along a second straight reference line to form a second line of light-emitting devices. The non-light-emitting passive devices are disposed on the carrier and between the first and second lines of light-emitting devices and electrically connected to the first and the second light-emitting devices.

Abstract: A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.

Abstract: The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip.

Abstract: Various embodiments of a lighting module are described. In one aspect, a lighting module comprises a metal support, a circuit board, and a plurality of light emitting diodes. The metal support has a recess, sidewalls, and a plurality of holes on the sidewalls. The circuit board is fastened on a bottom portion of the recess of the metal support and has two long sides, two short sides, and a respective plurality of flanges on each of the two long sides. The flanges are inserted into the holes of the metal support to compact the circuit board and the metal support. The light emitting diodes are disposed on the circuit board.

Abstract: A light source module including a heat dissipation block, a light emitting diode (LED) package and a circuit board is provided. The heat dissipation block has a surface and the LED package is disposed on the surface of the heat dissipation block. The circuit board is electrically connected to the LED package, and the circuit board and the LED package are located at two opposite sides of the heat dissipation block respectively.

Abstract: Embodiments of a light emitting diode (LED) package structure are provided. In one aspect, an LED package structure includes a base, at least one LED chip, a blocking plate, and a transparent cover plate. The LED chip is disposed on and electrically coupled to the base. The blocking plate is disposed on the base and surrounds the LED chip. The blocking plate has an opening for exposing the LED chip. The blocking plate comprises a light-absorbing material that is opaque. The transparent cover plate is disposed on the blocking plate and covers the opening of the blocking plate.

Abstract: A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.

Abstract: The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip.

Abstract: Various embodiments of a lighting module are described. In one aspect, a lighting module comprises a metal support, a circuit board, and a plurality of light emitting diodes. The metal support has a recess, sidewalls, and a plurality of holes on the sidewalls. The circuit board is fastened on a bottom portion of the recess of the metal support and has two long sides, two short sides, and a respective plurality of flanges on each of the two long sides. The flanges are inserted into the holes of the metal support to compact the circuit board and the metal support. The light emitting diodes are disposed on the circuit board.

Abstract: An LED back light module includes a metal support, a thermal conductive material, a circuit board and at least one light emitting diode. The metal support has a recess and a plurality of holes. The thermal conductive material has a first surface in contact with a bottom of the recess. The circuit board is disposed on a second surface of the thermal conductive material, in which the circuit board has a plurality of flanges lodged into the holes of the metal support for compacting the circuit board, the thermal conductive material and the metal support. The light emitting diode is disposed on the circuit board, in which the thermal energy generated by the light emitting diode is delivered to the metal support through the circuit board and the thermal conductive material.

Abstract: The invention provides a light emitting diode. The light emitting diode includes a ceramic substrate having a first surface and an opposite second surface. A first conductive trace metal layer and a second conductive trace metal layer are disposed on the first surface of the ceramic substrate. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate, respectively and electrically connected to the first and second conductive trace metal layers. A plurality of thermal metal pads is disposed on the second surface of the ceramic substrate, wherein the thermal metal pads are electrically isolated from the light emitting diode chip.

Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.