Patents by Inventor Chien-Chang Pei

Chien-Chang Pei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7988492
    Abstract: A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided.
    Type: Grant
    Filed: January 5, 2011
    Date of Patent: August 2, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Feng-Ting Hsu
  • Patent number: 7982308
    Abstract: A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: July 19, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Sheng-Jia Sheu, Chien-Chang Pei
  • Patent number: 7960740
    Abstract: A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: June 14, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Sheng-Jia Sheu, Chien-Chang Pei
  • Publication number: 20110097944
    Abstract: A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided.
    Type: Application
    Filed: January 5, 2011
    Publication date: April 28, 2011
    Applicant: EVERLIGHT ELECTRONICS CO., LTD
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Feng-Ting Hsu
  • Publication number: 20110074268
    Abstract: A light source module including a heat dissipation block, a light emitting diode (LED) package and a circuit board is provided. The heat dissipation block has a surface and the LED package is disposed on the surface of the heat dissipation block. The circuit board is electrically connected to the LED package, and the circuit board and the LED package are located at two opposite sides of the heat dissipation block respectively.
    Type: Application
    Filed: May 7, 2010
    Publication date: March 31, 2011
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Yu-Ju Liu, Yi-Hung Chen, Chien-Chang Pei
  • Patent number: 7896701
    Abstract: A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: March 1, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Feng-Ting Hsu
  • Publication number: 20110031524
    Abstract: The invention provides a light emitting diode. The light emitting diode includes a ceramic substrate having a first surface and an opposite second surface. A first conductive trace metal layer and a second conductive trace metal layer are disposed on the first surface of the ceramic substrate. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate, respectively and electrically connected to the first and second conductive trace metal layers. A plurality of thermal metal pads is disposed on the second surface of the ceramic substrate, wherein the thermal metal pads are electrically isolated from the light emitting diode chip.
    Type: Application
    Filed: October 26, 2009
    Publication date: February 10, 2011
    Applicant: EVERLIGHT ELECTRONICS., LTD.
    Inventor: Chien-Chang Pei
  • Publication number: 20100118532
    Abstract: A light emitting diode (LED) module including a carrier, a first connector, a plurality of second connectors and a plurality of LEDs is provided. The carrier has a first edge and a plurality of second edges. The first connector is disposed on the first edge of the carrier and electrically connected to the carrier. The second connectors are disposed on the second edges and electrically connected to the carrier respectively. Each of the second connectors may correspond and be electrically connected to the first connector of the other LED module. The LEDs are disposed on the carrier and electrically connected to the carrier.
    Type: Application
    Filed: November 9, 2009
    Publication date: May 13, 2010
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Chia-Hao Liang, Chien-Chang Pei, Yi-Tsuo Wu
  • Publication number: 20100109501
    Abstract: A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided.
    Type: Application
    Filed: October 14, 2009
    Publication date: May 6, 2010
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Feng-Ting Hsu
  • Publication number: 20100110685
    Abstract: A light tube including a heat sink, a light transmissive cover disposed on the heat sink, and at least one light source module is provided. A containing space is formed between the heat sink and the light transmissive cover. The light source module includes a carrier, a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of non-light-emitting passive devices. The carrier is disposed on the heat sink. The first light-emitting devices are arranged on the carrier along a first straight reference line to form a first line of light-emitting devices. The second emitting devices are arranged on the carrier along a second straight reference line to form a second line of light-emitting devices. The non-light-emitting passive devices are disposed on the carrier and between the first and second lines of light-emitting devices and electrically connected to the first and the second light-emitting devices.
    Type: Application
    Filed: November 4, 2009
    Publication date: May 6, 2010
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Chien-Chang Pei, Yi-Hung Chen
  • Patent number: 7621782
    Abstract: A connector including an insulating base, two electrode rods, and two L-shaped electrode sheets is provided. The insulating base has a first side surface, a second side surface, a bottom surface connecting the first side surface and the second side surface, and two through holes. The two through holes pass through the insulating base and extend from the first side surface to the second side surface. The two electrode rods penetrate the two through holes, respectively. Each electrode rod has a first end and a second end, and the first end protrudes from the first side surface. Each L-shaped electrode sheet includes a bottom portion disposed on the bottom surface and a connection portion connected to the bottom portion. The connection portions are disposed on the second side surface and connected to the second ends of the two electrode rods, respectively. A light source apparatus is also provided.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: November 24, 2009
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Yi-Hung Chen, Yu-Ju Liu, Chien-Chang Pei
  • Patent number: D603548
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: November 3, 2009
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Hsi-Chuan Hsu, Yi-Hung Chen, Ying-Chu Lin, Chia-Hao Liang, Chao-Sheng Dong
  • Patent number: D608487
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: January 19, 2010
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Hsi-Chuan Hsu, Yi-Hung Chen, Ying-Chu Lin, Chia-Hao Liang, Chao-Sheng Dong
  • Patent number: D611171
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: March 2, 2010
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Jen-Hui Wang, Chien-Chang Pei
  • Patent number: D617013
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: June 1, 2010
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Yu-Ju Liu, Chao-Sheng Dong
  • Patent number: D619292
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: July 6, 2010
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Hsi-Chuan Hsu, Yi-Hung Chen, Ying-Chu Lin, Chia-Hao Liang, Chao-Sheng Dong
  • Patent number: D627915
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: November 23, 2010
    Assignee: Everlight Electronics Co., Ltd
    Inventors: Chien-Chang Pei, Hsi-Chuan Hsu, Yi-Hung Chen, Ying-Chu Lin, Chia-Hao Liang, Chao-Sheng Dong
  • Patent number: D630347
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: January 4, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Sheng-Tzu Yang
  • Patent number: D630349
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: January 4, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Jen-Hui Wang
  • Patent number: D636902
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: April 26, 2011
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Chang Pei, Yi-Hung Chen, Jen-Hui Wang