Abstract: A device includes a hybrid heat sink, and a heat generation component. The hybrid heat sink is attached to the heat generation component. The hybrid heat sink includes a front plate and a rear plate. The front plate is connected to the rear plate by a wall. The front plate includes fins extending away from the front plate and toward the rear plate.

Abstract: A power module may be attached to and detached from a network extender. The power module may include one or more power connectors that are specific to one or more countries/regions. The power module may include one or more other interfaces (e.g., Ethernet port, etc.). The power module may include a power connector and a male local area network connector on a first surface. The power module may include a local area network port on a second surface, wherein the local area network port is conductively connected to the male local area network connector via a local area network port access.

Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

Abstract: The present disclosure relates to an apparatus that includes a bottom electrode and a dielectric structure. The dielectric structure includes a first dielectric layer on the bottom electrode and the first dielectric layer has a first thickness. The apparatus also includes a blocking layer on the first dielectric layer and a second dielectric layer on the blocking layer. The second dielectric layer has a second thickness that is less than the first thickness. The apparatus further includes a top electrode over the dielectric structure.

Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

Abstract: A light emitting device includes: a plurality of light emitting stacked layers, including a first surface and a second surface, wherein the second surface is electrically opposite to the first surface; a mesa structure; a current blocking layer disposed on the first surface, including a sidewall; and a transparent conductive layer disposed on the first surface; and a first pad electrode, disposed on the transparent conductive layer and on the first surface; wherein a retract distance of the transparent conductive layer with respect to an edge of the mesa structure is less than 3 ?m; and wherein a retract distance of the transparent conductive layer with respect to an edge of the sidewall of the current blocking layer is less than 3 ?m.

Abstract: A device includes a hybrid heat sink, and a heat generation component. The hybrid heat sink is attached to the heat generation component. The hybrid heat sink includes a front plate and a rear plate. The front plate is connected to the rear plate by a wall. The front plate includes fins extending away from the front plate and toward the rear plate.

Abstract: A light emitting device includes: a plurality of light emitting stacked layers, including a first surface and a second surface, wherein the second surface is electrically opposite to the first surface; a mesa structure; and a current blocking (CB) layer disposed on the first surface; a transparent conductive layer disposed on or above the first surface; and a first pad electrode, disposed on the transparent conductive layer and on the first surface; wherein a sidewall of the CB layer comprises a first surface section and a second surface section having different slopes.

Abstract: A power module may be attached to and detached from a network extender. The power module may include one or more power connectors that are specific to one or more countries/regions. The power module may include one or more other interfaces (e.g., Ethernet port, etc.). The power module may include a power connector and a male local area network connector on a first surface. The power module may include a local area network port on a second surface, wherein the local area network port is conductively connected to the male local area network connector via a local area network port access.

Abstract: A mounting structure for removably mounting a cover body to an external component of the cover body includes a limiting member, a latching member, and a positioning member. The limiting member is coupled to the cover body. The latching member is coupled to the limiting member and configured to latch with the external component. The positioning member defines a positioning slot and a releasing slot continuous with the positioning slot. The latching member is received in the positioning slot or the releasing slot. The latching member is movably coupled to the positioning member. When the latching member is received within the positioning slot, the latching member is locked by the positioning member and latched with the external component. When the latching member is received within the releasing slot, the latching member is released by the positioning member and released from latching with the external component.

Abstract: A power module may be attached to and detached from a network extender. The power module may include one or more power connectors that are specific to one or more countries/regions. The power module may include one or more other interfaces (e.g., Ethernet port, etc.). The power module may include a power connector and a male local area network connector on a first surface. The power module may include a local area network port on a second surface, wherein the local area network port is conductively connected to the male local area network connector via a local area network port access.

Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

Abstract: A mounting structure for removably mounting a cover body to an external component of the cover body includes a limiting member, a latching member, and a positioning member. The limiting member is coupled to the cover body. The latching member is coupled to the limiting member and configured to latch with the external component. The positioning member defines a positioning slot and a releasing slot continuous with the positioning slot. The latching member is received in the positioning slot or the releasing slot. The latching member is movably coupled to the positioning member. When the latching member is received within the positioning slot, the latching member is locked by the positioning member and latched with the external component. When the latching member is received within the releasing slot, the latching member is released by the positioning member and released from latching with the external component.

Abstract: A power module may be attached to and detached from a network extender. The power module may include one or more power connectors that are specific to one or more countries/regions. The power module may include one or more other interfaces (e.g., Ethernet port, etc.). The power module may include a power connector and a male local area network connector on a first surface. The power module may include a local area network port on a second surface, wherein the local area network port is conductively connected to the male local area network connector via a local area network port access.

Abstract: A light emitting device includes: a plurality of light emitting stacked layers, including a first surface and a second surface, wherein the second surface is electrically opposite to the first surface; a mesa structure; and a current blocking (CB) layer disposed on the first surface; a transparent conductive layer disposed on or above the first surface; and a first pad electrode, disposed on the transparent conductive layer and on the first surface; wherein a sidewall of the CB layer comprises a first surface section and a second surface section having different slopes.

Abstract: A method for fabricating a light emitting device, comprising: forming a plurality of light emitting stacked layers above a substrate; forming and patterning a current blocking (CB) layer on the light emitting stacked layers; forming a transparent conductive layer covering the light emitting stacked layers and the current blocking layer; etching the transparent conductive layer and exposing a reserved region for a first pad electrode and a mesa structure, respectively; and etching an exposed portion of the light emitting stacked layers and a portion of the current blocking layer to form a remaining current blocking layer, the mesa structure and a first opening.

Abstract: An optical lens including an assembling portion and an optical portion is provided. The assembling portion is configured to fix the optical lens. The optical portion is configured to allow imaging rays to pass through. The assembling portion is located on the edge of the optical portion. The optical portion includes a first surface, a second surface, and a side wall, and the first surface surrounds the second surface. The side wall connects the first surface and the second surface and is located between the first surface and the second surface. The side wall surrounds the second surface, and a step difference exists on the boundary between the first surface and the second surface along the direction of an optical axis of the optical lens.

Abstract: A method for fabricating a light emitting device, comprising: forming a plurality of light emitting stacked layers above a substrate; forming and patterning a current blocking (CB) layer on the light emitting stacked layers; forming a transparent conductive layer covering the light emitting stacked layers and the current blocking layer; etching the transparent conductive layer and exposing a reserved region for a first pad electrode and a mesa structure, respectively; and etching an exposed portion of the light emitting stacked layers and a portion of the current blocking layer to form a remaining current blocking layer, the mesa structure and a first opening.

Abstract: A light emitting device, includes a substrate; a plurality of light emitting stacked layers, comprising a first surface and a second surface; a mesa structure; a current blocking (CB) layer; a transparent conductive layer; a first pad electrode and a second pad electrode; and a passivation layer, wherein the second surface is electrically opposite to the first surface, the transparent conductive layer is disposed on or above the first surface, the first pad electrode is disposed on the transparent conductive layer and on the first surface, and the second pad electrode is disposed on the second surface and on the mesa structure, the CB layer is disposed on the first surface, surrounded by the transparent conductive layer, and at a lower region of the first pad electrode, a portion of the first pad electrode is filling a first opening of the transparent conductive layer and the CB layer.