Abstract: An embodiment semiconductor package includes a package substrate, a first semiconductor die electrically and mechanically coupled to the package substrate, a second semiconductor die electrically and mechanically coupled to the package substrate, a non-conductive film formed between the first semiconductor die and the package substrate, and a capillary underfill material formed between the second semiconductor die and the package substrate. The non-conductive film may be formed in a first region over a surface of the package substrate and the capillary underfill material may be formed over a second region of the surface of the package substrate, such that the second region surrounds the first region in a plan view. The semiconductor package may further include a multi-die frame partially surrounding the first semiconductor die and the second semiconductor die such that a multi-die chip is formed that includes the first semiconductor die, the second semiconductor die, and the multi-die frame.

Abstract: A method for image alignment is provided. The method for image alignment includes the following stages. A first image with a first property from a first sensor is received. A second image with a second property from a second sensor is received. The first property is similar to the second property. The first feature correspondence between the first image and the second image is calculated. A third image with a third property from the first sensor and a fourth image with a fourth property from the second image sensor are received. The third property is different from the fourth property. Image alignment is performed on the third image and the fourth image based on the first feature correspondence between the first image and the second image.

Abstract: A method for high dynamic range imaging is provided. The method includes the following stages. A first image from a first sensor capable of sensing a first spectrum is received. A second image from a second sensor capable of sensing a second spectrum is received. The second spectrum has a higher wavelength range as compared to the first spectrum. A first image feature from the first image and a second image feature from the second image are retrieved. The first and second images are fused by referencing the first image feature and the second image feature to generate a final image.

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

Abstract: An image calibration method is applied to an image calibration device includes an image receiver and an operation processor. The image calibration method of providing a motion deblur function includes driving a first camera to capture a first image having a first exposure time, driving a second camera disposed adjacent to the first camera to capture a second image having a second exposure time different from and at least partly overlapped with the first exposure time, and fusing a first feature of the first image and a second feature of the second image to generate a fusion image.

Abstract: Disclosed herein are recombinant baculoviruses suitable for detecting the presence of arthropod-borne viruses in a biological sample of a test subject. The information derived from the detection may also be used to render a diagnosis on whether the test subject is infected with the arthropod-borne viruses or not, so that proper course of treatment may be assigned to the subject.

Abstract: A method for calibrating element in a semiconductor processing device with a camera is provided. The method for calibrating element in a semiconductor processing device with a camera includes taking a first picture of a first element by a camera; providing a first actuator to move the first element an increment along a first direction; taking a second picture of the first element by the camera; and comparing the first picture and the second picture to calibrate the first element. A system for calibrating element in a semiconductor processing device with a camera is also provided.

Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.

Abstract: The proposed vacuum jacketed tube may deliver the high/low temperature fluid with less temperature-transfer, especially may delivery high/low temperature fluid through a flexible structure. The vacuum jacketed tube includes a tubular structure surrounding a pipe wherein the fluid is delivered therethrough. Also, the space between the tubular structure and the pipe may be vacuumed. Therefore, the heat transferred into and/or away the fluid may be minimized, especially if the tubular structure and the pipe is separated by at least one thermal insulator or is separated mutually. Moreover, the vacuum jacketed tube may be mechanically connected to the source/destination of the delivered fluid, even other vacuum jacketed tube, through the bellows and/or the rotary joint. Besides, the pipe may be surrounded by a Teflon bellows and the tubular structure may be surrounded by a steel bellows, so as to further reduce the heat transferred into/away the fluid delivered inside the pipe.

Abstract: A universal serial bus (USB) type C transmission line includes a host-to-host bridge, a first multiplexer, and a second multiplexer. When a first device and a second device are coupled to the first multiplexer and the second multiplexer respectively, the first multiplexer determines whether the first device is a host or a slave device and the second multiplexer determines whether the second device is another host or another slave device, and the first device optionally communicates with the second device through the host-to-host bridge, the first multiplexer, and the second multiplexer, or through the first multiplexer and the second multiplexer according to determination results of the first multiplexer and the second multiplexer.

Abstract: A method for calibrating element in a semiconductor processing device with a camera is provided. The method for calibrating element in a semiconductor processing device with a camera includes taking a first picture of a first element by a camera; providing a first actuator to move the first element an increment along a first direction; taking a second picture of the first element by the camera; and comparing the first picture and the second picture to calibrate the first element. A system for calibrating element in a semiconductor processing device with a camera is also provided.

Abstract: A liquid crystal display module comprises a thin film transistor array substrate, a liquid crystal layer, a color filter substrate and a plurality of light emitting diode chips. The thin film transistor array substrate has a first surface and a second surface. A circuit structure is formed on the first surface. A plurality of thin film transistors is formed on the second surface and electrically connecting to the circuit structure. The liquid crystal layer faces the second surface. The liquid crystal layer is formed between the thin film transistor array substrate and the color filter substrate. The light emitting diode chips are adhered on the first surface and electrically connecting to the circuit structure. Each light emitting diode chip has a light emitting surface. Light emitted from the light emitting surfaces is incident on the first surface of the thin film transistor array substrate.

Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.

Abstract: A liquid crystal display base includes a liquid crystal module, both a power circuit and a integration circuit, a electric device mounted on the power circuit. The liquid crystal module includes a TFT array substrate and a color filter substrate mounted on the TFT array substrate. The power circuit board mounted on the TFT array substrate. The TFT array substrate has a first surface and a second surface opposite to the first surface, a plurality of through holes extend through the first surface and the second surface, each through hole has equal inner diameter from the first surface to the second surface. the TFT array substrate 11 is made of glass, sapphire, ceramic, a plurality of conductive layers are in the plurality of through holes, both the electric device, the integration circuit and the power circuit board are coupled with the liquid crystal module.

Abstract: A universal serial bus (USB) type C transmission line includes a host-to-host bridge, a first multiplexer, and a second multiplexer. When a first device and a second device are coupled to the first multiplexer and the second multiplexer respectively, the first multiplexer determines whether the first device is a host or a slave device and the second multiplexer determines whether the second device is another host or another slave device, and the first device optionally communicates with the second device through the host-to-host bridge, the first multiplexer, and the second multiplexer, or through the first multiplexer and the second multiplexer according to determination results of the first multiplexer and the second multiplexer.

Abstract: The present invention provides a smart meter including a wireless-communication chip, a wired-communication chip and a microprocessor. The microprocessor receives a data transmission request and determines whether the data type of the data transmission request is mobile data, meter information, or emergency meter information. According to the data type, the microprocessor will select either the wireless-communication chip or the wired-communication chip to transmit the data which corresponds to the data transmission request.

Abstract: A thin-film deposition apparatus comprises a chamber; a carrier in the chamber; a showerhead on the carrier, wherein the showerhead comprises multiple first gas-dispensing holes, multiple second gas-dispensing holes and multiple plasma-generating portions; and a first gas inlet system for providing a first process gas, wherein the first process gas outputted from the multiple first gas-dispensing holes.

Abstract: A rechargeable battery includes an energy harvesting unit and an energy storage unit, wherein the rechargeable battery has a positive pole and a negative pole for coupling to an external electronic device. The energy harvesting unit is used for harvesting ionization energy. The energy storage unit is electrically connected to the energy harvesting unit and the positive pole and the negative pole of the rechargeable battery for receiving the ionization energy harvested by the energy harvesting unit. The ionization energy harvested by the energy harvesting unit is used for extending a battery life of the energy storage unit after the energy storage unit is charged by an external power source every time.

Abstract: The present invention provides a smart meter including a wireless-communication chip, a wired-communication chip and a microprocessor. The microprocessor receives a data transmission request and determines whether the data type of the data transmission request is mobile data, meter information, or emergency meter information. According to the data type, the microprocessor will select either the wireless-communication chip or the wired-communication chip to transmit the data which corresponds to the data transmission request.

Abstract: A USB 3.0 host with low power consumption includes a super speed circuit, a non-super speed circuit, and a control module. The super speed circuit is used for transmitting data at a first transmission speed. A default state of the super speed circuit is turning-off. The non-super speed circuit is used for transmitting data at a second transmission speed, a third transmission speed, or a fourth transmission speed. The first transmission speed is faster than the second transmission speed, the third transmission speed, and the fourth transmission speed. The control module is used for detecting whether a USB peripheral device is connected to the USB 3.0 host, and controlling turning-on and turning-off of the super speed circuit.