Abstract: A computer-implemented method, a computer system, and computer program product for associating security events. The method includes obtaining a result of implementation of one or more Locality-Sensitive Hashing (LSH) functions to feature data of a first event detected by a first device. The method also includes mapping the result to one or more positions in a data structure. In response to data elements of the one or more positions indicating first information associating with the one or more positions exists in a storage, the method includes obtaining the first information from the storage. The method further includes sending the first information to the first device.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A memory device and a management method thereof are provided. The memory device includes a controller and at least one memory channel. The memory channel includes at least one memory chip. The at least one memory chip is commonly coupled to the controller through an interrupt signal wire. The at least one memory chip generates at least one local interrupt signal and performs a logic operation on the at least one local interrupt signal to generate a common interrupt signal. The interrupt signal wire is configured to transmit the common interrupt signal to the controller.

Abstract: A method for calibrating element in a semiconductor processing device with a camera is provided. The method for calibrating element in a semiconductor processing device with a camera includes taking a first picture of a first element by a camera; providing a first actuator to move the first element an increment along a first direction; taking a second picture of the first element by the camera; and comparing the first picture and the second picture to calibrate the first element. A system for calibrating element in a semiconductor processing device with a camera is also provided.

Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.

Abstract: The proposed vacuum jacketed tube may deliver the high/low temperature fluid with less temperature-transfer, especially may delivery high/low temperature fluid through a flexible structure. The vacuum jacketed tube includes a tubular structure surrounding a pipe wherein the fluid is delivered therethrough. Also, the space between the tubular structure and the pipe may be vacuumed. Therefore, the heat transferred into and/or away the fluid may be minimized, especially if the tubular structure and the pipe is separated by at least one thermal insulator or is separated mutually. Moreover, the vacuum jacketed tube may be mechanically connected to the source/destination of the delivered fluid, even other vacuum jacketed tube, through the bellows and/or the rotary joint. Besides, the pipe may be surrounded by a Teflon bellows and the tubular structure may be surrounded by a steel bellows, so as to further reduce the heat transferred into/away the fluid delivered inside the pipe.

Abstract: A universal serial bus (USB) type C transmission line includes a host-to-host bridge, a first multiplexer, and a second multiplexer. When a first device and a second device are coupled to the first multiplexer and the second multiplexer respectively, the first multiplexer determines whether the first device is a host or a slave device and the second multiplexer determines whether the second device is another host or another slave device, and the first device optionally communicates with the second device through the host-to-host bridge, the first multiplexer, and the second multiplexer, or through the first multiplexer and the second multiplexer according to determination results of the first multiplexer and the second multiplexer.

Abstract: A method for calibrating element in a semiconductor processing device with a camera is provided. The method for calibrating element in a semiconductor processing device with a camera includes taking a first picture of a first element by a camera; providing a first actuator to move the first element an increment along a first direction; taking a second picture of the first element by the camera; and comparing the first picture and the second picture to calibrate the first element. A system for calibrating element in a semiconductor processing device with a camera is also provided.

Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.

Abstract: A liquid crystal display module comprises a thin film transistor array substrate, a liquid crystal layer, a color filter substrate and a plurality of light emitting diode chips. The thin film transistor array substrate has a first surface and a second surface. A circuit structure is formed on the first surface. A plurality of thin film transistors is formed on the second surface and electrically connecting to the circuit structure. The liquid crystal layer faces the second surface. The liquid crystal layer is formed between the thin film transistor array substrate and the color filter substrate. The light emitting diode chips are adhered on the first surface and electrically connecting to the circuit structure. Each light emitting diode chip has a light emitting surface. Light emitted from the light emitting surfaces is incident on the first surface of the thin film transistor array substrate.

Abstract: A liquid crystal display base includes a liquid crystal module, both a power circuit and a integration circuit, a electric device mounted on the power circuit. The liquid crystal module includes a TFT array substrate and a color filter substrate mounted on the TFT array substrate. The power circuit board mounted on the TFT array substrate. The TFT array substrate has a first surface and a second surface opposite to the first surface, a plurality of through holes extend through the first surface and the second surface, each through hole has equal inner diameter from the first surface to the second surface. the TFT array substrate 11 is made of glass, sapphire, ceramic, a plurality of conductive layers are in the plurality of through holes, both the electric device, the integration circuit and the power circuit board are coupled with the liquid crystal module.

Abstract: A universal serial bus (USB) type C transmission line includes a host-to-host bridge, a first multiplexer, and a second multiplexer. When a first device and a second device are coupled to the first multiplexer and the second multiplexer respectively, the first multiplexer determines whether the first device is a host or a slave device and the second multiplexer determines whether the second device is another host or another slave device, and the first device optionally communicates with the second device through the host-to-host bridge, the first multiplexer, and the second multiplexer, or through the first multiplexer and the second multiplexer according to determination results of the first multiplexer and the second multiplexer.

Abstract: The present invention provides a smart meter including a wireless-communication chip, a wired-communication chip and a microprocessor. The microprocessor receives a data transmission request and determines whether the data type of the data transmission request is mobile data, meter information, or emergency meter information. According to the data type, the microprocessor will select either the wireless-communication chip or the wired-communication chip to transmit the data which corresponds to the data transmission request.

Abstract: A thin-film deposition apparatus comprises a chamber; a carrier in the chamber; a showerhead on the carrier, wherein the showerhead comprises multiple first gas-dispensing holes, multiple second gas-dispensing holes and multiple plasma-generating portions; and a first gas inlet system for providing a first process gas, wherein the first process gas outputted from the multiple first gas-dispensing holes.

Abstract: A rechargeable battery includes an energy harvesting unit and an energy storage unit, wherein the rechargeable battery has a positive pole and a negative pole for coupling to an external electronic device. The energy harvesting unit is used for harvesting ionization energy. The energy storage unit is electrically connected to the energy harvesting unit and the positive pole and the negative pole of the rechargeable battery for receiving the ionization energy harvested by the energy harvesting unit. The ionization energy harvested by the energy harvesting unit is used for extending a battery life of the energy storage unit after the energy storage unit is charged by an external power source every time.

Abstract: The present invention provides a smart meter including a wireless-communication chip, a wired-communication chip and a microprocessor. The microprocessor receives a data transmission request and determines whether the data type of the data transmission request is mobile data, meter information, or emergency meter information. According to the data type, the microprocessor will select either the wireless-communication chip or the wired-communication chip to transmit the data which corresponds to the data transmission request.

Abstract: A USB 3.0 host with low power consumption includes a super speed circuit, a non-super speed circuit, and a control module. The super speed circuit is used for transmitting data at a first transmission speed. A default state of the super speed circuit is turning-off. The non-super speed circuit is used for transmitting data at a second transmission speed, a third transmission speed, or a fourth transmission speed. The first transmission speed is faster than the second transmission speed, the third transmission speed, and the fourth transmission speed. The control module is used for detecting whether a USB peripheral device is connected to the USB 3.0 host, and controlling turning-on and turning-off of the super speed circuit.

Abstract: A USB 3.0 compatible host with low power consumption includes a super speed circuit, a non-super speed circuit, and a control module. The super speed circuit transmits data at a first transmission speed and the non-super speed circuit transmits data at a second transmission speed, a third transmission speed, or a fourth transmission speed wherein the first transmission speed is faster than the second transmission speed, the third transmission speed, and the fourth transmission speed. Further, the control module is coupled to the super speed circuit and the non-super speed circuit for determining to turn on or off the super speed circuit of the USB 3.0 compatible host, during the USB 3.0 compatible host being connected to a USB 3.0 compatible peripheral device, based on whether transmission data quantity between the USB 3.0 compatible host and the USB 3.0 compatible peripheral device is greater than a predetermined value.

Abstract: An LED chip package having a topographical glass coating on top surface for enhancing heat dissipation is disclosed. A circular wall is optionally built to surround the LED chip for reflecting light beams from the LED chips; the glass coating further extends to cove the inner wall surface of the circular wall. The larger area the glass coating covers, the more heat the package dissipates in a time unit. The LED chip package according to the present invention exhibits higher thermal dissipation and helps to last longer the life of the LED chip package than a traditional one.

Abstract: A phosphor plate includes a glass layer, a wide-angle reflection dichroic filter and a phosphor layer. The wide-angle reflection dichroic filter is disposed on an exit surface of the glass layer. A first blue light and a second blue light of the incident ray are transmissible through the wide-angle reflection dichroic filter. The phosphor layer is disposed beside the wide-angle reflection dichroic filter. By the phosphor layer, the first blue light is excited as a first green light to be outputted and the second blue light is reflected to the wide-angle reflection dichroic filter. The second blue light and a portion of the first green light outputted from the phosphor layer are reflected by the wide-angle reflection dichroic filter, so that the portion of the first green light is transmitted through the phosphor layer and the second blue light is excited as a second green light by the phosphor layer.