Abstract: A transceiver includes: a first transforming network arranged for using a first input impedance to receive a first modulated signal and using a first output impedance to output a first transformed signal during a transmitting mode of a first communication standard, and for using the first input impedance to receive a second modulated signal and using a second output impedance to output a second transformed signal during the transmitting mode of a second communication standard; a second transforming network arranged for using a second input impedance to receive the second transformed signal and using a third output impedance to output a first RF signal to a connecting port of the transceiver during the transmitting mode of the second communication standard; a power amplifier, arranged to generate a second RF signal; and a switching circuit for selectively coupling the second transformed signal to the second transforming network.

Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.

Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.

Abstract: An audio/video system includes a display having a plurality of input sources and a first peripheral device connected to one of the input sources. The display provides a user interface for receiving a switching command for switching current input source of the display among the input sources from a user, and the display automatically generates a first standby command to the first peripheral device when the received switching command is not switching the current input source to the input source corresponding to the first peripheral device.

Abstract: An audio/video (A/V) display system comprising a display and a peripheral device connected to the display. The display is capable of displaying a user interface. The peripheral device transmits raw data of the peripheral device to the display. The display enables an option corresponding to the peripheral device in the user interface after receiving the raw data of the peripheral device. Both the display and the peripheral device are controlled by a control device.

Abstract: An audio/video system includes a display having a plurality of input sources and a first peripheral device connected to one of the input sources. The display provides a user interface for receiving a switching command for switching current input source of the display among the input sources from a user, and the display automatically generates a first standby command to the first peripheral device when the received switching command is not switching the current input source to the input source corresponding to the first peripheral device.

Abstract: A recombinant vector, transgenic fish egg using the same and biomaterial using the same are applied to provide a transgenic fish that secreting recombinant human procollagens or collagens, and further to provide the biomaterial having the recombinant human procollagens or collagens and extract the recombinant human procollagens or collagens from the part(s), having the recombinant human procollagens or collagens, of the transgenic fish.

Abstract: A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.

Abstract: A method for maintaining address mapping for a flash memory module is disclosed including: recording a first set of addresses corresponding to a first set of sequential logical addresses in a first section of a first addressing block; recording a second set of addresses corresponding to a second set of sequential logical addresses in a second section of the first addressing block; recording a third set of addresses corresponding to a third set of sequential logical addresses in a first section of a second addressing block; and recording a fourth set of addresses corresponding to a fourth set of sequential logical addresses in a second section of the second addressing block; wherein the second set of logical addresses is successive to the first set of logical addresses, and the third set of logical addresses is successive to the second set of logical addresses.

Abstract: An RF transmitter for a Wireless LAN device for enhancing an output linearity of the Wireless LAN device includes an RF processing unit for generating an RF signal, a voltage generator for generating a control voltage, a power amplifier coupled to the RF processing unit and driven by a bias, for amplifying power of the RF signal, and a low-pass filter coupled between the voltage generator and the power amplifier, for low-pass-filtering the control voltage to form the bias.

Abstract: The present invention discloses a transmit-receive (TR) front end. The TR front end includes a low-noise amplifier (LNA); a power amplifier (PA); a transformer, coupled to the PA, for increasing a voltage swing and a power transmission of the PA; and a TR switch, coupled between the transformer and the LNA. The LNA is single ended and there is no transformer between the LNA and the TR switch.

Abstract: The method for manufacturing hyaluronic acid rich matrix comprises the steps of providing a crest; and decellularizing a tissue of crest to form a decellularized hyaluronic acid rich matrix.

Abstract: The invention comprises a memory module capable of wear-leveling. In one embodiment, the memory module comprises a flash memory and a controller. The flash memory comprises a plurality of management units, wherein each of the management units comprises a plurality of blocks. The controller receives new data with a logical address managed by a first management unit selected from the management units, pops a first spare block from a spare area of the first management unit, determines whether an erase count of the first spare block is greater than a first threshold value, searches a second management unit selected from the management units for a replacing block with an erase count lower than a second threshold value when the erase count of the first spare block is greater than the first threshold value, and directs the first management unit and the second management unit to exchange the first spare block with the replacing block.

Abstract: A display device includes a display panel, a back light module, a printed circuit board and a ground slice. The back light module includes a first frame, a second frame and a light source disposed between the first frame and the second frame. The first frame has a first side plate having an opening, and the second frame has a second side plate opposite to the first side plate. The printed circuit board includes a control circuit electrically connected to the display panel. The printed circuit board is disposed at a side of the back light module, and the control circuit is disposed at the outer side of the first side plate and the second side plate, such that the control circuit is opposite to the second side plate through the opening. The ground slice is connected between the control circuit and the second side plate through the opening.

Abstract: A method for pairing a pair of shutter glasses and a display apparatus includes providing a pair of shutter glasses, in which the pair of shutter glasses may switch turning on of the left shutter and the right shutter according to a default command; receiving an information packet sent from a display apparatus; parsing the information packet; and controlling on/off durations of the left shutter and the right shutter of the pair of shutter glasses according to a sequence of on/off commands in the information packet, in which the sequence of on/off commands in the information packet are different from the default command. The pair of shutter glasses is operable to review three-dimensional (3D) images presented by display apparatuses of different brands, thereby solving limitation of a fixed pairing of a pair of shutter glasses and a display apparatus of the same brand in the prior art.

Abstract: A semiconductor package is provided, which includes a substrate unit having conductive pads and ESD protection pads formed on a bottom surface thereof; an encapsulant covering a top surface of the substrate unit; and a metal layer disposed on a top surface of the encapsulant and having connecting extensions formed on side surfaces of the substrate unit and the encapsulant for electrically connecting the ESD protection pads, wherein portions of the side surfaces of the substrate unit corresponding in position to the conductive pads are exposed from the metal layer so as to ensure that solder bumps subsequently formed to connect the conductive pads of the semiconductor package to a circuit board are not in contact with the metal layer, thereby effectively avoiding the risk of short circuits.

Abstract: A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.

Abstract: A display device includes a display panel, a flexible printed circuit and a back light module. The flexible printed circuit is suitable for supporting the driving element and is electrically connected to the display panel. The back light module includes at least one light source, a first frame and a second frame. The second frame surrounds the light source, the first frame surrounds the second frame, and the display panel and the flexible printed circuit are disposed at one side of the first frame, wherein the first frame has at least an opening, the second frame has a element contacting surface, the driving element is disposed on the flexible printed circuit, and the element contacting surface protrudes from the opening for being connected to the driving element.

Abstract: An approximation method for SNR soft information for a transmitter of a communications system includes obtaining a conditional probability density function (PDF) corresponding to a response message of a transmitted packet, obtaining a PDF of a probability distribution model, and a mean and a variance of the PDF, by approximating the conditional PDF corresponding to the response message with the probability distribution model, and calculating a second mean and a second variance of a second PDF approximated to a conditional PDF of SNR corresponding to the transmitted packet according to the mean and the variance of the PDF, and a first mean and a first variance of a first PDF approximated to a conditional PDF of SNR corresponding to another transmitted packet immediately preceding the transmitted packet.