Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: A package structure includes a substrate, a metal-insulator-metal capacitor, a circuit redistribution structure, and a chip. The metal-insulator-metal capacitor is disposed over the substrate and includes a first electrode, a second electrode, and an insulating layer. The circuit redistribution structure is disposed over the metal-insulator-metal capacitor and includes a first circuit redistribution layer and a second circuit redistribution layer. The first circuit redistribution layer includes a first wire electrically connected to the first electrode and a second wire electrically connected to the second electrode. The second circuit redistribution layer is disposed on the first circuit redistribution layer and includes a third wire electrically connected to the first wire and a fourth wire electrically connected to the second wire. The chip is disposed over the circuit redistribution structure and electrically connected to the third wire and the fourth wire.

Abstract: An embedded chip package includes a circuit board, a chip, a dielectric material layer, and a build-up circuit structure. The circuit board includes a glass substrate and at least one conductive via. The glass substrate has a first surface, a second surface opposite the first surface, and a through-hole penetrating the glass substrate. The conductive via penetrates the glass substrate. The chip is disposed inside the through-hole. The dielectric material layer is filled inside the through-hole and covers the chip. The build-up circuit structure is disposed on the circuit board. The build-up circuit structure is electrically connected to the conductive via. A lower surface of the chip is exposed outside the dielectric material layer.

Abstract: A server system is disclosed. The server system comprises a host system, at least one hard disk (HD) drive, a host bus adapter (HBA), at least one indicator, a storage enclosure processor (SEP), a baseboard management controller (BMC) and a snoop device. The HBA is used to issue a bus signal in a format suitable for transmission over a serial bus according to the received drive state from the at least one HD drive and send the bus signal over the serial bus. The SEP receives the bus signal over the serial bus and drives the at least one indicator to corresponding states. The BMC is coupled to a network. The snoop device detects the bus signal over the serial bus and sends a warning signal to the BMC when a drive failure event is detected.

Abstract: This invention is related to a heating plate for a heated clothing and a connecting structure of the same. The heating plate comprises a heater strip which two ends are connected with two electric wires respectively, and each electric wire comprises sequentially a first right angle, a horizontal segment, a second right angle, and a vertical segment. The vertical segments of the electric wires go out from a covering piece which covers the heater strip and the electric wires. Therefore, when the electric wires of the heating plate are pulled, the pull strength is dispersed at the right-angle bend to be decreased, avoiding the heater strip moving. Furthermore, when the heating plate is set on the heated clothing, according to different size of the heated clothing, the length of an assembly electric wire is relative to the distance between the heating plates.

Abstract: A break-proof assembly for wires of a temperature control switch of a heated clothing is revealed. Several first wires are extended from a switch body of the temperature control switch of the heated clothing and connected to second wires respectively while the second wires are connected to a heating plate of the heated clothing. A first end of a protective pad is connected to an edge of the switch body and extended toward a second end thereof to cover a part of the first wire outside the switch body. Thereby the first wires and the edge of the switch body are connected to one part to prevent breakage of the first wires caused by wear between the edge of the switch body and the first wires. Therefore the heated clothing can be washed directly in a washer and convenience in use is improved.

Abstract: A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.

Abstract: A gesture recognition method has steps of detecting a first number of first objects touching a touchpad, detecting a second number of second objects tapping the touchpad when the first number of first objects still touches the touchpad, determining that a shortest distance between the first number of first objects and the second number of second objects is less than a preset spacing distance, and enabling a gesture function. Accordingly, gestures provided through the foregoing gesture recognition method are advantageous in being user-friendly, relaxed, convenient and smooth in operation.

Abstract: A server system is disclosed. The server system comprises a host system, at least one hard disk (HD) drive, a host bus adapter (HBA), at least one indicator, a storage enclosure processor (SEP), a baseboard management controller (BMC) and a snoop device. The HBA is used to issue a bus signal in a format suitable for transmission over a serial bus according to the received drive state from the at least one HD drive and send the bus signal over the serial bus. The SEP receives the bus signal over the serial bus and drives the at least one indicator to corresponding states. The BMC is coupled to a network. The snoop device detects the bus signal over the serial bus and sends a warning signal to the BMC when a drive failure event is detected.

Abstract: A break-proof assembly for wires of a temperature control switch of a heated clothing is revealed. Several first wires are extended from a switch body of the temperature control switch of the heated clothing and connected to second wires respectively while the second wires are connected to a heating plate of the heated clothing. A first end of a protective pad is connected to an edge of the switch body and extended toward a second end thereof to cover a part of the first wire outside the switch body. Thereby the first wires and the edge of the switch body are connected to one part to prevent breakage of the first wires caused by wear between the edge of the switch body and the first wires. Therefore the heated clothing can be washed directly in a washer and convenience in use is improved.

Abstract: This invention is related to a heating plate for a heated clothing and a connecting structure of the same. The heating plate comprises a heater strip which two ends are connected with two electric wires respectively, and each electric wire comprises sequentially a first right angle, a horizontal segment, a second right angle, and a vertical segment. The vertical segments of the electric wires go out from a covering piece which covers the heater strip and the electric wires. Therefore, when the electric wires of the heating plate are pulled, the pull strength is dispersed at the right-angle bend to be decreased, avoiding the heater strip moving. Furthermore, when the heating plate is set on the heated clothing, according to different size of the heated clothing, the length of an assembly electric wire is relative to the distance between the heating plates.

Abstract: A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.

Abstract: A clothes structure with temperature falling device is provided, which has a fan provided in a low-permeability layer outside a clothes major body, and an air delivery space provided between the low-permeability layer and a lining layer inside. When the fan sucks the air from the outside of the clothes major body through air intake end and delivers the air to the inside of the clothes major body, air will flow uniformly in the air delivery space and to everywhere in the clothes major body. Then proper quantity of uniform air flow is output from an inner lining layer with meshes to everywhere of user's body to make user feeling cool and comfortable.

Abstract: A static random access memory system includes a static random access memory, a multiplexer, an input buffer, an output buffer, and a shifter. The input buffer writes write data stored in the input buffer to addresses of the static random access memory corresponding to a write address signal according to a write command. The output buffer reads read data of addresses of the static random access memory corresponding to a read address signal according to a read command. The multiplexer transmits the write address signal and the read address signal to the static random access memory, and generates the write command and the read command. The shifter shifts the write command to an operation clock behind the read command when the write command and the read command exist simultaneously.

Abstract: A display device capable of controlling an external light and a control method are provided. Image display of the display device and the external light are synchronously controlled through a synchronization signal generated by a control module in the display device. The control module generates a first and a second light source control signal during first cycles and second cycles of the synchronization signal. The first and the second light source control signal are used to control the external light to operate at a first operation state and at a second operation state respectively. Through the techniques of controlling the external light by the display device, i.e. turning off or reducing illumination intensity of the external light every other specific period, both influence of the external light on contrast ratio and light reflection from the display device are reduced. Power of the external light is also saved.

Abstract: A container system including cabinets, a main control unit connected to the cabinets and a heat dissipation zone is mentioned. The cabinet includes a plurality of serving zones each of which further includes a master server and at least one slave server. The heat dissipation zone is disposed at a side of the serving zone and coupled to the main control unit. Each slave server is coupled to the master server. The slave server includes at least one temperature sensor, and the temperature sensor is used for outputting temperature information to the master server when receiving the temperature demand. The master server collects the temperature information transmitted by each slave server. The master server forwards the temperature information to the main control unit. The main control unit drives the heat dissipation zone to dissipate heat of the serving zone according to the temperature information.

Abstract: The disclosure provides a server including a baseboard management controller (BMC), a programmable logic device (PLD) and a blocking unit. The BMC receives an update instruction, and according to the update instruction, generates a firmware update data. The BMC generates an update signal according to on a reception state of the update instruction. The PLD is coupled to the BMC, receives the firmware update data to update a firmware. When the firmware is updated, the PLD generates a restart signal. The blocking unit is coupled to the BMC and the PLD, receives the update signal and the restart signal, and according to the update signal, determines whether to block the restart signal.

Abstract: The invention relates to a retractable and adjustable heating brace. Primarily, a main body is provided with a tie portion, retractable portions and assembly portions. A heating piece is disposed within the tie portion, and the assembly portion is provided with a temperature controller. Furthermore, a first conductive wire is connected to the heating piece at one end thereof and to the temperature controller at the other end thereof by extending through the first, second and third spaces, wherein the length of the first conductive wire located in the retractable portion is larger than the length of the retractable portion. Thereby when the user ties the main body around his or her waist by pulling the retractable portion thereof, the length of the first conductive wire can be stretched appropriately according to the stretch of the retractable portion. Accordingly, it can prevent the first conductive wire from break or damage.