Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.

Abstract: The present invention provides an electrostatic charge detecting packaging device comprising a carrier, multiple dies, and multiple electrostatic-charge-sensitive components; the carrier has a surface; the dies are mounted on the surface of the carrier; and the electrostatic-charge-sensitive components are mounted on the surface of the carrier; since an electrostatic voltage tolerance of each of the electrostatic-charge-sensitive components is lower than an electrostatic voltage tolerance of each of the dies, accumulated electrostatic charges are more likely to discharge towards the electrostatic-charge-sensitive components than towards the dies, and as such, by electrically testing whether the electrostatic-charge-sensitive components are functioning normally when packaging the dies, the present invention allows personnel to debug for knowing which packaging steps exactly cause more serious problems that lead to damaging electrostatic discharges in the dies.

Abstract: A semiconductor package with improved solderability at sidewall includes a chip, a molding compound encapsulating the chip, and multiple leads distributed at sidewalls of the semiconductor package. The leads are formed as a conductive layer that is electrically connected to bonding pads of the chip. Each of the leads has a stepped surface exposed from the molding compound, wherein the stepped surface is shaped by two sequentially overlapped photoresist layers. The stepped surface of each lead allows to accommodate more solder to enhance the reliability of a solder joint between the semiconductor and a printed circuit board. Therefore, the solder joints of the semiconductor package are easily inspected by automatic optical inspection (AOI) equipment.

Abstract: A package structure is provided, including a substrate, a first passivation layer, a metallization layer, a second passivation layer, and a polymer layer. The first passivation layer is formed over the substrate. The metallization layer is conformally formed on the first passivation layer. The second passivation layer is conformally formed on the first passivation layer and the metallization layer. A step structure is formed on the top surface of the second passivation layer, and includes at least one lower part that is lower than the other parts of the step structure. The polymer layer is formed over the second passivation layer. A portion of the polymer layer extends into the lower part of the step structure to engage with the step structure.

Abstract: The present invention includes a chip, a plastic film layer, and an electroplated layer. A front side and a back side of the chip each comprises a signal contact. The plastic film layer covers the chip and includes a first via and a second via. The first via is formed adjacent to the chip, and the second via is formed extending to the signal contact of the front side. A conductive layer is added in the first and the second via. The conductive layer in the second via is electrically connected to the signal contact of the front side. Through the electroplated layer, the signal contact on the back side is electrically connected to the conductive layer in the first via. The conductive layer protrudes from the plastic film layer as conductive terminals. The present invention achieves electrical connection of the chip without using expensive die bonding materials.

Abstract: A method for forming a semiconductor structure is provided. The method includes forming a seed layer over a substrate and forming a first mask layer over the seed layer. The method also includes forming a first trench and a second trench in the first mask layer and forming a first conductive material in the first trench and the second trench. The method further includes forming a second mask layer in the first trench and over the first conductive material, and forming a second conductive material in the second trench and on the first conductive material. A first conductive connector is formed in the first trench with a first height, a second conductive connector is formed in the second trench with a second height, and the second height is greater than the first height.

Abstract: A method for forming a semiconductor structure is provided. The method includes forming a seed layer over a substrate and forming a first mask layer over the seed layer. The method also includes forming a first trench and a second trench in the first mask layer and forming a first conductive material in the first trench and the second trench. The method further includes forming a second mask layer in the first trench and over the first conductive material, and forming a second conductive material in the second trench and on the first conductive material. A first conductive connector is formed in the first trench with a first height, a second conductive connector is formed in the second trench with a second height, and the second height is greater than the first height.

Abstract: The present invention relates to a terminal stand, particularly, to a terminal stand with a base body, a movable part and a metal elastic part. The base body includes a casing and a side cover. One end of the movable part is a pressing end, the other end extends to form two arms. The metal elastic part is disposed in the accommodating space, one end of the metal elastic part has two abutments, one of the abutments passes through the first through hole and abut against one of the abutment holes, the other abutment passes through the second through hole and abuts against the other abutment hole, the other end of the metal elastic part has two pins, and at least one leg respectively passes through the corresponding pin hole.

Abstract: A terminal stand is provided. The terminal stand includes a base body, a movable part, a metal elastic part, a first signal element and a second signal element. One end of the metal elastic member includes two first abutments. The first signal element is disposed in a second receiving slot. One end of the first signal element includes a first contact portion and a second abutment. The second signal element is disposed in the second receiving slot. One end of the second signal element includes a second contact portion. The second contact portion contacts with the first contact portion and makes a signal circuit. When the movable member is pressed, the movable member drives the two first abutments to move, and the abutment drives the second abutment to move, with the first contact portion leaving the second contact portion, and the signal circuit is in an off-state state.

Abstract: A simple connector structure includes a connecting body. The connecting body has a first accommodating space and a second accommodating space. The first accommodating space is matched with a PCB, and the second accommodating space is matched with a ribbon cable body. In addition, the first accommodating space is provided with at least one first conductive part, and the second accommodating space is provided with at least one second conductive part. Therefore, quick connection and labor cost reduction can be effectively achieved through connecting the first accommodating space with the PCB and connecting the second accommodating space with the ribbon cable body.

Abstract: The present invention relates to a terminal stand, particularly, to a terminal stand with a base body, a movable part and a metal elastic part. The base body includes a casing and a side cover. One end of the movable part is a pressing end, the other end extends to form two arms. The metal elastic part is disposed in the accommodating space, one end of the metal elastic part has two abutments, one of the abutments passes through the first through hole and abut against one of the abutment holes, the other abutment passes through the second through hole and abuts against the other abutment hole, the other end of the metal elastic part has two pins, and at least one leg respectively passes through the corresponding pin hole.

Abstract: A terminal stand is provided. The terminal stand includes a base body, a movable part, a metal elastic part, a first signal element and a second signal element. One end of the metal elastic member includes two first abutments. The first signal element is disposed in a second receiving slot. One end of the first signal element includes a first contact portion and a second abutment. The second signal element is disposed in the second receiving slot. One end of the second signal element includes a second contact portion. The second contact portion contacts with the first contact portion and makes a signal circuit. When the movable member is pressed, the movable member drives the two first abutments to move, and the abutment drives the second abutment to move, with the first contact portion leaving the second contact portion, and the signal circuit is in an off-state state.

Abstract: An electrical connector includes a first metal housing and a flexible flat transmission component. The first metal housing includes an installation portion. The flexible flat transmission component is disposed on the installation portion of the first metal housing, the flexible flat transmission component includes a plurality of contacts, and a first inclined surface is formed on a front end of each contact and opposite to the installation portion.

Abstract: A simple connector structure includes a connecting body. The connecting body has a first accommodating space and a second accommodating space. The first accommodating space is matched with a PCB, and the second accommodating space is matched with a ribbon cable body. In addition, the first accommodating space is provided with at least one first conductive part, and the second accommodating space is provided with at least one second conductive part. Therefore, quick connection and labor cost reduction can be effectively achieved through connecting the first accommodating space with the PCB and connecting the second accommodating space with the ribbon cable body.

Abstract: A connector structure includes a first metal housing, a flexible flat transmission component and a second metal housing. The first metal housing includes an installation portion and two guiding portions disposed on two sides of the installation portion. Each guiding portion includes a bottom section, a top section opposite to the bottom section, and a bending section connected to the bottom section and the top section. A slot is formed on the bottom section, and an extending section extends from the top section and toward the bottom section to engage inside the slot. The flexible flat transmission component is disposed on the installation portion and includes a plurality of contacts. The second metal housing is assembled with the first metal housing and covers the flexible flat transmission component, and the plurality of contacts exposes out of the second metal housing.

Abstract: An electrical connector includes a first metal housing and a flexible flat transmission component. The first metal housing includes an installation portion. The flexible flat transmission component is disposed on the installation portion of the first metal housing, the flexible flat transmission component includes a plurality of contacts, and a first inclined surface is formed on a front end of each contact and opposite to the installation portion.

Abstract: A connector structure includes a first metal housing, a flexible flat transmission component and a second metal housing. The first metal housing includes an installation portion and two guiding portions disposed on two sides of the installation portion. Each guiding portion includes a bottom section, a top section opposite to the bottom section, and a bending section connected to the bottom section and the top section. A slot is formed on the bottom section, and an extending section extends from the top section and toward the bottom section to engage inside the slot. The flexible flat transmission component is disposed on the installation portion and includes a plurality of contacts. The second metal housing is assembled with the first metal housing and covers the flexible flat transmission component, and the plurality of contacts exposes out of the second metal housing.

Abstract: A connector structure includes an upper connecting component, a lower connecting component, a shielding plate, a metal housing, an upper insulating component, an upper grounding component, a lower insulating component and a lower grounding component. The upper/lower connecting component includes an upper/lower main body and a plurality of upper/lower terminals. The shielding plate is disposed between the upper connecting component and the lower connecting component. The metal housing covers the upper main body, the shielding plate and the lower main body and covers the plurality of upper/lower terminals to form a docking space. A docking opening is formed on a side of the docking space, and the metal housing includes a stopping portion disposed around the docking opening. The upper/lower insulating component is disposed in the docking space and restrained between the stopping portion and the upper/lower main body. The upper/lower grounding component is disposed on the upper/lower insulating component.

Abstract: A connector structure includes an upper connecting component, a lower connecting component, a shielding plate, a metal housing, an upper insulating component, an upper grounding component, a lower insulating component and a lower grounding component. The upper/lower connecting component includes an upper/lower main body and a plurality of upper/lower terminals. The shielding plate is disposed between the upper connecting component and the lower connecting component. The metal housing covers the upper main body, the shielding plate and the lower main body and covers the plurality of upper/lower terminals to form a docking space. A docking opening is formed on a side of the docking space, and the metal housing includes a stopping portion disposed around the docking opening. The upper/lower insulating component is disposed in the docking space and restrained between the stopping portion and the upper/lower main body. The upper/lower grounding component is disposed on the upper/lower insulating component.

Abstract: A connector module includes a board connector and a cable connector. The board connector includes a board connecting body whereon a slot is formed, conductive terminals disposed on the board connecting body and extending into the slot, and two metal pads disposed on two sides of the board connecting body and each having a resilient buckle. The cable connector includes a cable connecting body including an installation portion and two engaging portions, and a flexible transmission unit installed in the installation portion. Contacts are disposed on a front end of the flexible transmission unit. The front end of the flexible transmission unit is inserted into the slot, the conductive terminals contact with the contacts, and the resilient buckles engage with the engaging portions when the cable connector is connected with the board connector.