Abstract: A package structure includes a first die and a second die embedded in a first molding material, a first redistribution structure over the first die and the second die, a second molding material over portions of the first die and the second die, wherein the second molding material is disposed between a first portion of the first redistribution structure and a second portion of the first redistribution structure, a first via extending through the second molding material, wherein the first via is electrically connected to the first die, a second via extending through the second molding material, wherein the second via is electrically connected to the second die and a silicon bridge electrically coupled to the first via and the second via.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: A display device includes a plurality of sub-pixels. The sub-pixels include a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light emitting element and a first control circuit. The first control circuit is configured to provide a first driving current to the first light emitting element. The second sub-pixel includes a second light emitting element and a second control circuit. The second control circuit is configured to provide a second driving current to the second light emitting element. The first control circuit and the second control circuit are configured to differently control pulse amplitude of the first driving current and pulse amplitude of the second driving current, such that both of the first light emitting element and the second light emitting element emit at a target wavelength or a color point range (e.g. +/?1.5˜2 nm).

Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.

Abstract: A method for estimating distribution of wireless signal strength, selecting measuring locations to measure wireless signal strength and compensating estimated wireless signal strength is provided, wherein the method for estimating distribution of wireless signal strength estimates the wireless signal strength at an estimation location in accordance with a plurality of single-reflection paths started from a signal emitter, the method for selecting position for measuring wireless signal strength determines whether a signal measuring process should be performed at the specific location, and the method for compensating estimated wireless signal strength compensates an estimated wireless signal strength near a specific location in accordance with a signal strength value measured at the specific location.

Abstract: A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.

Abstract: A phosphorus-containing compound of Formula (1) and a preparation method thereof are provided. The phosphorus-containing compound is a compound having a reactive functional group and containing a phosphorus atom in its structure. The preparation method includes: (1) reacting magnolol and phosphoryl chloride in a first alkaline environment to obtain an intermediate product; and (2) reacting the intermediate product and a benzenediol in a second alkaline environment to obtain the phosphorus-containing compound.

Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3?-dimethyl-5,5?-diethyl-4,4?-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3?-dimethyl-5,5?-diethyl-4,4?-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method.

Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.

Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.

Abstract: A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.

Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.

Abstract: An electronic apparatus and a method for switching touch modes thereof are provided. A touch screen of the electronic apparatus has a plurality of touch modes. A current touch mode of the touch screen is one of the plurality of touch modes. The method includes the following steps. Firstly, the number of times a key module of the electronic apparatus is pressed is determined according to a pulse count of a trigger signal provided by the key module. Next, a first touch mode of the plurality of touch modes is looked up in a lookup table according to the number of times. Afterwards, the current touch mode of the touch screen is switched to the first touch mode.

Abstract: An electronic apparatus and a method for switching touch modes thereof are provided. A touch screen of the electronic apparatus has a plurality of touch modes. A current touch mode of the touch screen is one of the plurality of touch modes. The method includes the following steps. Firstly, the number of times a key module of the electronic apparatus is pressed is determined according to a pulse count of a trigger signal provided by the key module. Next, a first touch mode of the plurality of touch modes is looked up in a lookup table according to the number of times. Afterwards, the current touch mode of the touch screen is switched to the first touch mode.

Abstract: Embodiments relate to a computer device and a method for determining whether a solar energy panel array is abnormal. In the embodiments, the computer device uses a current power generation calculation model to calculate a set of current reference power generation parameters of the solar energy panel array according to a set of current environment parameters of the solar energy panel array. The computer device also defines a power generation indicator for the solar energy panel array according to a contrast between a set of current actual power generation parameters of the solar energy panel array and the set of current reference power generation parameters, and determines whether the solar energy panel array is abnormal according to the power generation indicator.

Abstract: A high power solar cell module including a cover plate, a back plate, a first encapsulant, a second encapsulant, a plurality of P type passivated emitter rear contact solar cells and a plurality of reflective connection ribbons is provided. Each of the P type passivated emitter rear contact solar cells has a light receiving surface and a non-light receiving surface opposite to the light receiving surface. The reflective connection ribbons are located between the first encapsulant and the second encapsulant, and any two adjacent P type passivated emitter rear contact solar cells are connected in series along a first direction by at least four of the reflective connection ribbons. Each of the reflective connection ribbons has a plurality of triangle columnar structures. Each of the triangle columnar structures points to the cover plate and extends along the first direction.

Abstract: A method and system for estimating traffic information by using integration of location update events and call events uses a sample capturing and analyzing device to associate location area update (LAU) and call sample data of a plurality of mobile users. The sample data at least includes at least one LAU event of at least one mobile user of the plurality of mobile users, and call arrival (CA) or call completion (CC) events of at least one call. Based on the sample data, a computation device is used to determine the location information and time information of the at least one LAU event and the CA or CC event of the at least one call, and estimate traffic information of one or more designated roads according to the location information and time information.