Patents by Inventor Chien-Kuo Chang

Chien-Kuo Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10039378
    Abstract: An adjustable table includes a table board, an inclining structure, a supporting structure, and a foot structure. The table board is provided with a pivoting portion on one end thereof. The inclining structure is provided with a mounting portion on one end thereof, and the mounting portion is pivotally combined with the pivoting portion of the table board, such that the table board and the inclining structure pivotally sway to open and close. The supporting structure is combined between the table board and the inclining structure for supporting and fixing the table board and the inclining structure. The foot structure is pivotally combined with the inclining structure, such that the inclining structure sways toward the foot structure.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: August 7, 2018
    Assignee: PRODUCT DEPOT INTERNATIONAL CORP.
    Inventor: Chien-Kuo Chang
  • Publication number: 20180206630
    Abstract: A table with adjustable height and inclination includes a foot; a first support rack clutchably and pivotally combined with the foot; a second support rack clutchably and pivotally combined with the first support rack and fixed to a table board; a first positioning assembly rotatably disposed at a location of the pivotal combination between the first support rack and the foot for adjusting and fixing an angle of the first support rack swaying against the foot; and a second positioning assembly rotatably disposed at a location of the pivotal combination between the first support rack and the second support rack for adjusting and fixing an angle of the second support rack swaying against the first support rack.
    Type: Application
    Filed: January 23, 2017
    Publication date: July 26, 2018
    Inventor: CHIEN-KUO CHANG
  • Publication number: 20180140090
    Abstract: An adjustable table includes a table board, an inclining structure, a supporting structure, and a foot structure. The table board is provided with a pivoting portion on one end thereof. The inclining structure is provided with a mounting portion on one end thereof, and the mounting portion is pivotally combined with the pivoting portion of the table board, such that the table board and the inclining structure pivotally sway to open and close. The supporting structure is combined between the table board and the inclining structure for supporting and fixing the table board and the inclining structure. The foot structure is pivotally combined with the inclining structure, such that the inclining structure sways toward the foot structure.
    Type: Application
    Filed: November 23, 2016
    Publication date: May 24, 2018
    Inventor: CHIEN-KUO CHANG
  • Patent number: 9805997
    Abstract: Packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling a ring to a substrate, and coupling an integrated circuit die to the substrate within the ring. A molding material is disposed around the integrated circuit die within the ring.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: October 31, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Liu, Chien-Kuo Chang, Wei-Ting Lin, Kuan-Lin Ho, Chin-Liang Chen, Shih-Yen Lin
  • Patent number: 9666556
    Abstract: An integrated circuit (IC) package includes a first substrate; a second substrate disposed over the first substrate; a plurality of connectors disposed between the first and second substrates such to electrically couple the first and second substrate; a constraint layer disposed over the first and second substrates such that a cavity is formed between the constraint layer and the first substrate; and a molding material disposed within the cavity and extending through the constraint layer. The constraint layer has a top surface and an opposing bottom surface and the molding material extends from the top surface to the bottom surface of the constraint layer.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 30, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Liu, Chien-Kuo Chang, Chi-Yang Yu, Jing Ruei Lu, Chih-Hao Lin
  • Publication number: 20160379955
    Abstract: An integrated circuit (IC) package includes a first substrate; a second substrate disposed over the first substrate; a plurality of connectors disposed between the first and second substrates such to electrically couple the first and second substrate; a constraint layer disposed over the first and second substrates such that a cavity is formed between the constraint layer and the first substrate; and a molding material disposed within the cavity and extending through the constraint layer. The constraint layer has a top surface and an opposing bottom surface and the molding material extends from the top surface to the bottom surface of the constraint layer.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Yu-Chih Liu, Chien-Kuo Chang, Chi-Yang Yu, Jing Ruei Lu, Chih-Hao Lin
  • Patent number: 9402474
    Abstract: An article of furniture wherein two or more components of the article of furniture are connected by a barbed fastener that extends through bores formed in the components. Barbs project from the fasteners and engage an outer surface of the bores to prevent the fastener from backing out of the bores.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: August 2, 2016
    Inventor: Chien-Kuo Chang
  • Publication number: 20160032955
    Abstract: An article of furniture wherein two or more components of the article of furniture are connected by a barbed fastener that extends through bores formed in the components. Barbs project from the fasteners and engage an outer surface of the bores to prevent the fastener from backing out of the bores.
    Type: Application
    Filed: July 31, 2014
    Publication date: February 4, 2016
    Inventor: Chien-Kuo Chang
  • Patent number: 9147584
    Abstract: A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: September 29, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing Ruei Lu, Yu-Chih Liu, Ming-Chung Sung, Wei-Ting Lin, Chien-Kuo Chang
  • Publication number: 20150214074
    Abstract: Packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling a ring to a substrate, and coupling an integrated circuit die to the substrate within the ring. A molding material is disposed around the integrated circuit die within the ring.
    Type: Application
    Filed: July 17, 2014
    Publication date: July 30, 2015
    Inventors: Yu-Chih Liu, Chien-Kuo Chang, Wei-Ting Lin, Kuan-Lin Ho, Chin-Liang Chen, Shih-Yen Lin
  • Publication number: 20150182021
    Abstract: A television cabinet includes a front board, a rear board, at least two active boards, two side boards, and a top board. Therein, the active boards are hinged between the front board and the rear board, while each active board comprises a first panel and a second panel hinged together for enabling the front board and the rear board to move between a folded position and an unfolded position. The side boards are slidingly disposed between the front board and the rear board at the unfolded position. The top board is combined to the front board, the rear board, and the two side boards as a plane on top at the unfolded position. Therefore, the cost and inconvenience of transportation are lowered.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 2, 2015
    Inventor: Chien-Kuo Chang
  • Publication number: 20130263762
    Abstract: A table adjustable in height and pitch is disclosed. The table includes a base, a pair of upper rods, a table board and a first pitch-adjusting mechanism. The base includes a pair of legs, each having a slot and a plurality of dents. The leg and the upper rods include a first included angle. The first pitch-adjusting mechanism serving to adjust the first included angle includes two positioning rods, a lever and a plurality of links. Each of the positioning rods has an insert and the two inserts have an engaged state where they are retained by the dents and a disengaged state where they are slidable along the slots. The links build kinetic connection between the positioning rods and the lever, so that when the lever is operated, the two inserts are switched between the engaged and disengaged states.
    Type: Application
    Filed: April 10, 2012
    Publication date: October 10, 2013
    Inventor: Chien-Kuo CHANG
  • Publication number: 20130119565
    Abstract: A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.
    Type: Application
    Filed: November 16, 2011
    Publication date: May 16, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing Ruei Lu, Yu-Chih Liu, Ming-Chung Sung, Wei-Ting Lin, Chien-Kuo Chang
  • Patent number: 8333444
    Abstract: A furniture kit that is configured to be transformed into a furniture piece. The furniture kit includes a folding unit comprising a front member and a back member, both of which are interconnected by folding arms. The front and back members are movable between retracted and extended positions. There is also provided a pair of side panels with each side panel being connectable through a tongue and groove arrangement to the front and back members. A top is secured to the folding unit. The entire furniture kit can be packaged in a compact container with the folding unit in a collapsed or retracted position and other individual components of the kit placed adjacent thereto.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: December 18, 2012
    Inventor: Chien-Kuo Chang
  • Patent number: 8302539
    Abstract: A folding table with positioning function is provided. Therein a table board, two support sets pivotally connected and parallel with the table board and a fixing frame pivotally connected with the table board between and perpendicular to the two support sets are included. The two support sets each contain at least one holder having at least one positioning hole at one side thereof and the two support sets can engage with the fixing frame by connecting ends of the fixing frame, wherein the connecting end is inserted with a spring member having a pin movably projecting from a through hole corresponding to the positioning hole and engaging with the positioning hole when the two support sets and the fixing frame are unfolded so as to secure the folding table stably.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: November 6, 2012
    Inventor: Chien-Kuo Chang
  • Patent number: 8288208
    Abstract: Methods for making a substrate for semiconductor packaging with improved warpage and an apparatus. A method includes providing on a die side of a substrate at least one flip chip mounted integrated circuit die. The substrate may include through substrate vias (TSVs). An underfill is dispensed between the integrated circuit die and the substrate. Initially the underfill is left uncured. A thermal interface material is provided on the upper surface of the at least one integrated circuit die. A heat sink is mounted over the integrated circuit die and in thermal contact with the thermal interface material. A thermal cure is performed to simultaneously cure the underfill material and the thermal interface material. In another embodiment, the thermal cure may simultaneously cure an adhesive mounting the heat sink to the substrate. Solder balls are disposed on a board surface of the substrate to form a ball grid array package.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: October 16, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Liu, Jing Ruei Lu, Wei-Ting Lin, Sao-Ling Chiu, Chien-Kuo Chang
  • Publication number: 20120067256
    Abstract: A folding table with positioning function is provided. Therein a table board, two support sets pivotally connected and parallel with the table board and a fixing frame pivotally connected with the table board between and perpendicular to the two support sets are included. The two support sets each contain at least one holder having at least one positioning hole at one side thereof and the two support sets can engage with the fixing frame by connecting ends of the fixing frame, wherein the connecting end is inserted with a spring member having a pin movably projecting from a through hole corresponding to the positioning hole and engaging with the positioning hole when the two support sets and the fixing frame are unfolded so as to secure the folding table stably.
    Type: Application
    Filed: September 17, 2010
    Publication date: March 22, 2012
    Inventor: Chien-Kuo CHANG
  • Patent number: D716587
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: November 4, 2014
    Inventor: Chien-Kuo Chang
  • Patent number: D732317
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: June 23, 2015
    Inventor: Chien-Kuo Chang
  • Patent number: D747122
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: January 12, 2016
    Assignee: AU OPTRONICS CORPORATION
    Inventor: Chien-Kuo Chang