Abstract: A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees.

Abstract: An light emitting diode (LED) module includes a circuit board, a set of LED chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a set of first recesses defined in a top surface of the encapsulant.

Abstract: An light emitting diode (LED) module includes a circuit board, a plurality of LED chips arranged on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a plurality of first recesses defined in a first surface of the circuit board.

Abstract: An LED illumination device includes an LED package and a switch electrically connecting the LED package. The LED package includes a first lamp group and a second lamp group installed in parallel. A direction of the current of the first lamp group is inverted to that of the second lamp group. Different contact parts of the switch respectively connect a power source to make the first lamp group and the second lamp group on or off respectively.

Abstract: An LED (light emitting diode) lighting apparatus includes an LED, a light adjusting device and a shell. The LED includes a main lighting surface and a heat dissipating surface. The shell receives the LED and the light adjusting device therein, the shell having a light emitting window for light emitted from the LED to transmit therethrough after the light is directed by the light adjusting device. The heat dissipating surface of the LED connects the light emitting window, and heat generated by the LED is transferred from the heat dissipating surface to the light emitting window to prevent snow from accumulating on the light emitting window.

Abstract: An LED light source device includes an LED light source, a first translucent structure covering the LED light source and a second translucent structure covering the first translucent structure. An interior of the first translucent structure has light scattering powder distributed therein. The LED light source is embedded in the first translucent structure. The LED light source is covered by the light scattering powder. The second translucent structure has a radius of R and an index of refraction of N1, while the first translucent structure has a radius of r, wherein R, r and N1 satisfy the following relation: N1<R/(2r?R).

Abstract: An exemplary light emitting device includes a blue-green light source and a orange-red light source. The blue-green light source emits blue-green light and the orange-red light source emits orange-red light when they are activated. The blue-green light and the orange-red light are mixed together to obtain white light.

Abstract: An exemplary illumination device includes a lamp and an air purifying apparatus received in the lamp. The lamp includes a base, a lamp post, a lamp cover, and a light source in the lamp cover. The air purifying apparatus is received in the base. A plurality of inlets and outlets is defined in the base. The inlets and outlets communicate with the air purifying apparatus. Air near the inlets is drawn into the air purifying apparatus via the air inlets, and the air is exhausted out of the base via the air outlets after purified by the air purifying apparatus.

Abstract: An LED light source device includes an LED light source and a reflective layer located on a forward direction of light path of the LED light source. The LED light source includes a substrate with a first electrode and a second electrode, an LED chip and an encapsulation layer sealing the LED chip therein. The LED chip is electrically connected to the first electrode and the second electrode, respectively. The reflective layer receives part of the light emitted from the LED light source, and guides the part light to a lateral direction of the LED light source.

Abstract: An LED package includes a substrate, an LED chip mounted on the substrate, and a lens formed on the substrate and encapsulating the LED chip therein. The lens includes a top surface and a bottom surface connecting a bottom end of the top surface. The bottom surface is directly formed on the substrate. A tangent of the top surface extends through a joint of the top surface and the bottom surface to define a contacting angle between the tangent and a plumb line, and the contacting angle is not larger than 60 degrees.

Abstract: A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees.

Abstract: A method for manufacturing a method for manufacturing a light emitting diode (LED) package includes following steps: providing a substrate and a blocking member formed on a top surface of the substrate; providing an LED chip and mounting the LED chip on the top surface of the substrate, the LED chip enclosed by the blocking member; providing a dispensing machine with glue, dispensing the glue in the blocking member to make the glue encapsulate the LED chip; and heating the glue to obtain a lens formed on the substrate directly.

Abstract: An LED (light emitting diode) lighting apparatus includes an LED, a light adjusting device and a shell. The LED includes a main lighting surface and a heat dissipating surface. The shell receives the LED and the light adjusting device therein, the shell having a light emitting window for light emitted from the LED to transmit therethrough after the light is directed by the light adjusting device. The heat dissipating surface of the LED connects the light emitting window, and heat generated by the LED is transferred from the heat dissipating surface to the light emitting window to prevent snow from accumulating on the light emitting window.

Abstract: An LED light source device includes an LED light source, a first powder layer located at a light path of the LED light source and a lamp shell located around the LED light source and the first powder layer. The lamp shell defines a receiving room. A second powder layer is formed on an inner surface of the lamp shell. The first powder layer and the second powder layer each have a characteristic of scattering light.

Abstract: A semiconductor light-emitting device includes: a hollow body including a bottom wall and a surrounding wall cooperating with the bottom wall to define an encapsulant-receiving recess, the bottom wall being formed with a through-hole, the surrounding wall having a diffuse surface that surrounds the encapsulant-receiving recess; a heat-dissipating body provided on a bottom side of the bottom wall and covering the through-hole in the bottom wall; a light-emitting chip disposed in the through-hole in the bottom wall; a transparent encapsulant filling the encapsulant-receiving recess and the through-hole; and a wavelength-converting layer covering the transparent encapsulant.

Abstract: A semiconductor light-emitting device includes: a hollow body including a bottom wall and a surrounding wall cooperating with the bottom wall to define an encapsulant-receiving recess, the bottom wall being formed with a through-hole, the surrounding wall having a diffuse surface that surrounds the encapsulant-receiving recess; a heat-dissipating body provided on a bottom side of the bottom wall and covering the through-hole in the bottom wall; a light-emitting chip disposed in the through-hole in the bottom wall; a transparent encapsulant filling the encapsulant-receiving recess and the through-hole; and a wavelength-converting layer covering the transparent encapsulant.