Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.

Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.

Abstract: A backlight module and a display device are provided, and the backlight module includes a light guide plate, a plurality of light-emitting components, and a frame. The light guide plate includes a first side, a second side, and two third sides. The light-emitting components are disposed on the first side, and light generated from the light-emitting components enters the light guide plate from the first side. The frame covers the second side and the third sides and includes an opening and at least one buffer portion. The light-emitting components are disposed in the opening, and the buffer portion is disposed on a side of the opening and contacts the light guide plate.

Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.

Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.

Abstract: In a mask review method, a vacuum is drawn in a vacuum chamber that contains an extreme ultraviolet (EUV) actinic mask review system including an EUV illuminator, a mask stage, a projection optics box, and an EUV imaging sensor. With the vacuum drawn, a position is adjusted of at least one component of the EUV actinic mask review system. After the adjusting and with the vacuum drawn, an actinic image is acquired of an EUV mask mounted on the mask stage using the EUV imaging sensor. The acquiring includes transmitting EUV light from the EUV illuminator onto the EUV mask and projecting at least a portion of the EUV light reflected by the EUV mask onto the EUV imaging sensor using the projection optics box.

Abstract: Accordingly. the present disclosure provides a population of genetically engineered mesenchymal stem cells (MSCs), comprising an expression vector comprising an Akt or HGF gene and a PD-L1 gene. Also provided is a method for synergistically increasing survival status and immunomodulatory ability of an MSC or enhancing proliferation of an MSC, comprising transfecting an MSC with an Akt or HGF gene and a PD-L1 gene and a method for preventing, ameliorating and/or treating an ischemia condition, enhancing neuroregeneration or reducing neuronal death, comprising administering an effective amount of a population of genetically engineered MSCs of the present disclosure to a subject in need thereof.

Abstract: An artificial intelligence diagnosis system includes a diagnosis model responsive to data received from a plurality of sensors. Each of the sensors is a part of an input channel further including a converter operative to process the received sensor data. A system manager is provided and is operative with an allocator to selectively distribute sensor data to the converters. The system manager operates with the converters such that a converter which is allocated with the sensor data processes the allocated sensor data and inputs the processed sensor data into the artificial intelligence diagnosis model. A converter which is not allocated with the sensor data generates virtual sensor data according to an instruction of the allocator and inputs the virtual sensor data into the artificial intelligence diagnosis model.

Abstract: An inspection apparatus includes: a stage configured to receive a photomask; a radiation source configured to inspect the photomask; a mirror configured to direct a first radiation beam from the radiation source to the photomask at a first tilt angle; an aperture stop configured to receive a second radiation beam reflected from the photomask through an aperture of the aperture stop, wherein the aperture is tangent at a center of the aperture stop; and a detector configured to generate an image of the photomask according to the second radiation beam.

Abstract: A method includes: receiving a photomask; patterning a wafer by directing a first radiation beam to the wafer through the photomask at a first tilt angle; and inspecting the photomask. The inspecting includes: directing a second radiation beam to the photomask at a second tilt angle greater than the first tilt angle; receiving a third radiation beam reflected from the photomask; and generating an image of the photomask according to the third radiation beam.

Abstract: The present disclosure provides an engineered stem cell, comprising a vector comprising a polynucleotide comprising a nucleic acid sequence of suicide gene, a nucleic acid sequence of immune checkpoint gene and a natural cytotoxicity triggering receptor or a TNF-related apoptosis-inducing ligand, wherein the stem cell is a tumor-targeting cell. The present disclosure also provides a method for treating a cancer or enhancing intratumor immunity or enhancing immunity in tumor microenvironment in a subject, comprising administering an effective amount of the engineered stem cell of the present disclosure to the subject.

Abstract: A method includes: receiving a photomask; patterning a wafer by directing a first radiation beam to the wafer through the photomask at a first tilt angle; and inspecting the photomask. The inspecting includes: directing a second radiation beam to the photomask at a second tilt angle greater than the first tilt angle; receiving a third radiation beam reflected from the photomask; and generating an image of the photomask according to the third radiation beam.

Abstract: A semiconductor reaction device and a semiconductor reaction method are disclosed. The semiconductor reaction device includes a vacuum chamber, a stage unit, a heating unit, and a first lifting mechanism. The stage unit carries a substrate. When the stage unit drives the substrate to rise, the substrate separates the vacuum chamber to form a reaction space and a bottom space. The heating unit is disposed in the vacuum chamber. The heating unit and the substrate are located on opposite sides of the stage unit. The first lifting mechanism connects with the heating unit so as to move the heating unit, so that the heating unit is movable relative to the stage unit. When the substrate rises to form the reaction space, the distance between the heating unit and the substrate is changed by the first lifting mechanism, thereby changing the temperature of the substrate.

Abstract: The present disclosure provides an engineered stem cell, comprising a vector comprising a polynucleotide comprising a nucleic acid sequence of suicide gene, a nucleic acid sequence of immune checkpoint gene and a natural cytotoxicity triggering receptor or a TNF-related apoptosis-inducing ligand, wherein the stem cell is a tumor-targeting cell. The present disclosure also provides a method for treating a cancer or enhancing intratumor immunity or enhancing immunity in tumor microenvironment in a subject, comprising administering an effective amount of the engineered stem cell of the present disclosure to the subject.

Abstract: Disclosure herein is related to an outdoor wireless modem and a signal processing method thereof. The outdoor wireless modem is particularly disposed in the midst of and bridging a local-area network and a wide-area network established by a mobile communication network. One of the objectives of the invention is to provide a solution replacing the present last mile connection. According to one of the embodiments, main circuit of the outdoor wireless modem includes a radio-frequency module and a baseband module. The baseband module includes at least two processing circuits for respectively processing the signals over the mobile communication network and the packets over the local-area network. The processing circuits are packaged into one module according to the design. Further in one embodiment, a bandwidth integration unit is introduced to the modem. The bandwidth integration unit serves to achieve load balance and bandwidth integration.

Abstract: A method includes scanning a lithography mask with a repair process, and measuring back-scattered electron signals of back-scattered electrons generated from the scanning. An endpoint is determined from the back-scattered electron signals. A stop point is calculated from the endpoint. The step of scanning is stopped when the calculated stop point is reached.

Abstract: Disclosure herein is related to an outdoor wireless modem and a signal processing method thereof. The outdoor wireless modem is particularly disposed in the midst of and bridging a local-area network and a wide-area network established by a mobile communication network. One of the objectives of the invention is to provide a solution replacing the present last mile connection. According to one of the embodiments, main circuit of the outdoor wireless modem includes a radio-frequency module and a baseband module. The baseband module includes at least two processing circuits for respectively processing the signals over the mobile communication network and the packets over the local-area network. The processing circuits are packaged into one module according to the design. Further in one embodiment, a bandwidth integration unit is introduced to the modem. The bandwidth integration unit serves to achieve load balance and bandwidth integration.

Abstract: Disclosure herein is related to an outdoor wireless modem and a signal processing method thereof. The outdoor wireless modem is particularly disposed in the midst of and bridging a local-area network and a wide-area network established by a mobile communication network. One of the objectives of the invention is to provide a solution replacing the present last mile connection. According to one of the embodiments, main circuit of the outdoor wireless modem includes a radio-frequency module and a baseband module. The baseband module includes at least two processing circuits for respectively processing the signals over the mobile communication network and the packets over the local-area network. The processing circuits are packaged into one module according to the design. Further in one embodiment, a bandwidth integration unit is introduced to the modem. The bandwidth integration unit serves to achieve load balance and bandwidth integration.

Abstract: A method includes scanning a lithography mask with a repair process, and measuring back-scattered electron signals of back-scattered electrons generated from the scanning. An endpoint is determined from the back-scattered electron signals. A stop point is calculated from the endpoint. The step of scanning is stopped when the calculated stop point is reached.