Abstract: An OLED display device includes a substrate, an active element array, at least one OLED, a light absorption layer or an optical scattering layer, and an encapsulation plate. The active element array and the OLED are disposed over an upper surface of the substrate. The OLED includes a first electrode, a second electrode, and an organic light-emitting layer. The first electrode is disposed on a side adjacent to the active element array, and the second electrode is opposite to the first electrode. Both the first and second electrodes have a high transmittance and a low reflection in a wavelength range of visible light. The organic light-emitting layer is interposed between the first and second electrodes. The light absorption layer or optical scattering layer is disposed between the OLED and the substrate. The encapsulation plate is disposed over the second electrode.

Abstract: An access point that provides link aggregation is described. During operation, this access point receives a message that may include a Dynamic Host Configuration Protocol (DHCP) response with an Internet protocol (IP) address of a gateway for an electronic device to access a network and a media access control (MAC) address of the electronic device. Based on the MAC address and/or at least a characteristic of the electronic device (such as a configuration, a capability and/or an operating system of the electronic device), the access point may determine a different IP address of another gateway for the electronic device to access the network. Moreover, the access point may modify the DHCP response by substituting the IP address of the other gateway for the IP address of gateway in a modified DHCP response. Next, the access point provides the modified DHCP response to the electronic device.

Abstract: Systems and methods of providing zero configuration (zeroconf) networking by a processor according to some embodiments of the inventions here may include bridging a zeroconf multicast service discovery query from a first multicast domain to a second multicast domain, and receiving a multicast service advertisement of the second multicast domain at the first multicast domain in response to the bridged multicast service discovery query.

Abstract: A composition having Lactobacillus Plantarum strain GMNL-662 for promoting bone regrowth is provided. The Lactobacillus Plantarum strain GMNL-662 has an ability to promote the expression of osteogenic genes, inhibit the expression of osteoclast related genes, and promote the expression of osteogenesis-related cytokine TGF-?, so that the bone loss is improved.

Abstract: The present disclosure provides a method of forming a nanoscale conductive film. The method comprises providing a nanoscale base film, forming a first patterned insulating layer on the nanoscale base film, and etching the nanoscale base film in a current generation system, using the first patterned insulating layer as a mask. The nanoscale base film includes a substrate, a first overcoat on one side of the substrate, and a first nano material layer laminated between the substrate and the first overcoat. The first patterned insulating layer is formed on the first overcoat, exposing portions of the first overcoat. In the first nano material layer, first regions are masked by the first insulating layer and second regions are not masked by the first insulating layer. The first regions and the second regions are electrically isolated from each other after etching the nanoscale base film in the current generation system.

Abstract: A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package substrate includes a first surface, a second surface opposite to the first surface, and an edge. The first electronic device is positioned over and electrically connected to the package substrate through the first surface. The second electronic device is positioned over and electrically connected to the first electronic device. The first molding layer is positioned over the package substrate, and the first molding layer encapsulates a portion of the first surface and the edge of the package substrate.

Abstract: The disclosure describes embodiments of an apparatus including a first gas chromatograph including a fluid inlet, a fluid outlet, and a first temperature control. A controller is coupled to the first temperature control and includes logic to apply a first temperature profile to the first temperature control to heat, cool, or both heat and cool the first gas chromatograph. Other embodiments are disclosed and claimed.

Abstract: A method of determining if a layout design for fabricating a layer of features of an integrated circuit is N-colorable, comprising identifying a set of candidate cells among layout cells of a layout design. Each candidate cell of the set of candidate cells is one of the set of base layout cells, or one of the set of composite layout cells, and constituent layout cells of the one of the set of composite layout cells having been determined as N-colorable. Whether a first candidate cell of the set of candidate cell is N-colorable is determined. An abutment-sensitive conflict graph of the first candidate cell is generated when the first candidate cell is N-colorable and the first candidate cell is not the top layout cell.

Abstract: A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c) disposing a redistribution layer on the dielectric layer to electrically connect to the conductive pad; (d) connecting a die to the redistribution layer; (e) removing at least a portion of the carrier to expose the conductive pad; and (f) disposing an electrical contact to electrically connect to the conductive pad.

Abstract: A touch display is disclosed including a display module, a polarizer disposed on the display module, and a plurality of touch electrodes at least partly coated on the polarizer, wherein the touch electrodes are formed by nano-silver. Since the touch electrodes formed by nano-silver is employed in the display, a multifunctional touch display is provided. A method for making the touch display is also disclosed.

Abstract: An OLED touch display device includes an OLED display and a laminated package component covering the OLED display and including a quarter-wave plate, a liquid crystal polarizer, a first touch sensor layer and a second touch sensor layer. The first touch sensor layer and the second touch sensor layer are configured to cooperatively detect touch events.

Abstract: The present invention provides a touch panel, including a lower substrate, an organic light-emitting component, disposed on the lower substrate, a nano silver sensing layer, disposed on the organic light emitting component, and an upper substrate, disposed on the nano silver sensing layer.

Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.

Abstract: The disclosure describes embodiments of an apparatus including a first gas chromatograph including a fluid inlet, a fluid outlet, and a first temperature control. A controller is coupled to the first temperature control and includes logic to apply a first temperature profile to the first temperature control to heat, cool, or both heat and cool the first gas chromatograph. Other embodiments are disclosed and claimed.

Abstract: In one or more embodiments, a semiconductor package includes a redistribution layer, a conductive pad, a dielectric layer, a silicon layer, and a conductive contact. The redistribution layer includes a first surface and a second surface opposite to the first surface. The conductive pad is on the first surface of the redistribution layer. The dielectric layer is disposed on the first surface of the redistribution layer to cover a first portion of the conductive pad and to expose a second portion of the conductive pad. The silicon layer is disposed on the dielectric layer, the silicon layer having a recess to expose the second portion of the conductive pad. The conductive contact is disposed over the silicon layer and extends into the recess of the silicon layer.

Abstract: A thin-film device may include a carrier, a release layer, a stacking structure, and a flexible substrate. The release layer may be overlaid on the carrier, and the stacking structure is overlaid on the release layer. The stacking structure may include a first protective layer and a second protective layer, wherein the refractive index of the first protective layer exceeds that of the second protective layer. The flexible substrate may be overlaid on the release layer.

Abstract: A chip package includes a chip, an isolation layer on the bottom surface and the sidewall, a redistribution layer that is on the isolation layer and in electrical contact with a side surface of the conductive pad, and a passivation layer. The chip has a sensor, at least one conductive pad, a top surface, a bottom surface, and a sidewall. The sensor is located on the top surface. The conductive pad is located on an edge of the top surface. The redistribution layer at least partially protrudes from the conductive pad so as to be exposed. The passivation layer is located on the isolation layer and the redistribution layer, such that the redistribution layer not protruding from the conductive pad is between the passivation layer and the isolation layer, and the redistribution layer protruding from the conductive pad is located on the passivation layer.

Abstract: A chip package includes a chip, an insulating layer and a conductive layer. The chip includes a substrate, an epitaxy layer, a device region and a conductive pad. The epitaxy layer is disposed on the substrate, and the device region and the conductive pad are disposed on the epitaxy layer. The conductive pad is at a side of the device region and connected to the device region. The conductive pad protrudes out of a side surface of the epitaxy layer. The insulating layer is disposed below the substrate and extended to cover the side surface of the epitaxy layer. The conductive layer is disposed below the insulating layer and extended to contact the conductive pad. The conductive layer and the side surface of the epitaxy layer are separated by a first distance.

Abstract: An uninterruptible power system includes a power conversion apparatus, a switch unit and a control apparatus. The switch unit outputs a mains voltage in a line mode, and output an alternating conversion voltage in a battery mode. The control apparatus is configured to generate a base triangular wave signal according to the mains voltage. When the uninterruptible power system is in a battery mode and the control apparatus detects the regeneration of the mains voltage, the control apparatus is configured to determine whether a cross-over value of the base triangular wave signal is within a predetermined range when the mains voltage is at a zero-cross point. The control apparatus is configured to control the switch unit to output the mains voltage instead of the alternating conversion voltage when the cross-over value of the base triangular wave signal is within the predetermined range.

Abstract: A dynamic voltage controller applied to a display apparatus is disclosed. The display apparatus includes a display panel and a power supply. The power supply is coupled to the display panel. The dynamic voltage controller includes a data analyzing module and a voltage control module. The data analyzing module receives and analyzes an image data to obtain a maximum brightness, an average brightness and an average current to further estimate a minimum driving voltage needed for the display panel to display the image data. The voltage control module coupled between the data analyzing module and power supply is used to output a voltage control signal to the power supply according to the minimum driving voltage, so that the power supply is controlled by the voltage control signal to output the minimum driving voltage to the display panel to drive the display panel to display the image data.