Abstract: A plastic leaded chip carrier (PLCC) package includes an encapsulant having a domed portion, which is formed as an integral single piece structure. The encapsulant may be formed using an injection molding process. Another injection molding process may be used to form a structural body of the PLCC package.

Abstract: A method for fabricating a light-emitting device is disclosed. A die that includes a semiconductor light emitting device is mounted on a carrier, the die having a face through which light is emitted. A mixture of photocurable epoxy and phosphor particles is dispensed on the face in a pattern that covers the face. The dispensed mixture is then irradiated with light to cure the epoxy in a time period that is less than the time period in which the phosphor particles settle. In one embodiment, the photocurable epoxy includes a UV curable epoxy. In one embodiment, the die includes sides through which some of the light is emitted and the mixture is allowed to run down the sides prior to being irradiated.

Abstract: Disclosed are systems and methods which provide an illuminator configuration in which an optical element is provided integral with a reflector component. Embodiments provide an LED encapsulation optical element having a boundary with a surrounding medium, such as air, which avoids or minimizes total internal reflection phenomena. Such an LED encapsulation optical element is formed integral with a reflector component in order to ensure proper relative placement of the LED light source, optical element, and reflector component and/or to facilitate rapid and predictable mechanical assembly of an illuminator. Plated through holes may be disposed in a substrate beneath the LED light source to dissipate heat from the LED light source, prolonging the life of the LED light source and/or the encapsulation material.