PLCC package with integrated lens and method for making the package
A plastic leaded chip carrier (PLCC) package includes an encapsulant having a domed portion, which is formed as an integral single piece structure. The encapsulant may be formed using an injection molding process. Another injection molding process may be used to form a structural body of the PLCC package.
Light emitting diodes (“LEDs”) have many advantages over conventional light sources, such as incandescent, halogen and fluorescent lamps. These advantages include longer operating life, lower power consumption and smaller size. Consequently, conventional light sources are increasingly being replaced with LEDs in traditional lighting applications. As an example, LEDs are currently being used in flashlights, traffic signal lights, automotive exterior and interior lights and display devices.
Among the various packages for LEDs, an LED package of interest is the plastic leaded chip carrier (PLCC) package for a surface mount LED. Some PLCC packages have flat tops, while other PLCC packages have domed tops. The domed top PLCC packages are currently produced by attaching lenses on tops of the flat top PLCC packages. This process of producing a conventional domed top PLCC package is described with reference to
A concern with the current process for producing the domed top PLCC packages is that the attached lens may be tilted or not centered correctly, which will reduce the optical efficiency of the package. Another concern is that an excessive amount of adhesive material may be applied to attach the lens, which will also reduce the optical efficiency of the package. The finished packages with one or more of these quality issues may have to be rejected, which would lower the yield of the packages during manufacture. Furthermore, visual inspection of all finished packages is required in order to screen out the problematic packages.
Another concern is that the attached lens can become delaminated from the package at some later time. Such delamination of the attached lens would degrade the performance of the package.
In view of these concerns, there is a need for a domed top PLCC package and method for making the package that addresses at least some of these concerns.
SUMMARY OF THE INVENTIONA plastic leaded chip carrier (PLCC) package and method for making the package utilizes an encapsulant having a domed portion, which is formed as an integral single piece structure. The encapsulant may be formed using an injection molding process. Another injection molding process may be used to form a structural body of the PLCC package. The domed encapsulant eliminates the need to attach a lens onto the PLCC package, and thus, resolves quality issues associated with an attached lens.
A PLCC package in accordance with an embodiment of the invention comprises a structural body, a light source, first and second leadframes and an encapsulant. The first and second leadframes are attached to the structural body. The light source is mounted onto the first leadframe. The second leadframe is electrically connected to the light source. The encapsulant is attached to the light source and the first and second leadframes. The encapsulant has a domed portion that functions as a lens. The encapsulant is an integral single piece structure.
A method for making a PLCC package in accordance with an embodiment of the invention comprises providing first and second leadframes, mounting a light source, e.g., a light emitting diode die, onto the first leadframe, electrically connecting the light source to the second leadframe, forming an encapsulant over the light source and the first and second leadframes, the encapsulant having a domed portion that functions as a lens, the encapsulant being an integral single piece structure, and forming a structural body on the first and second leadframe.
Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrated by way of example of the principles of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
With reference to
The PLCC package 100 includes a light emitting diode (LED) die 102, leadframes 104 and 106, a bond wire 108, a structural body 110 and a domed encapsulant 112. The LED die 102 is a semiconductor chip that generates light in response to applied driving current. Thus, the LED die 102 is a light source of the PLCC package 100. As an example, the LED die 102 may be a transparent-substrate aluminum indium gallium phosphide (TS AlInGaP) LED die. Although the PLCC package 100 is shown in
The structural body 110 of the PLCC package 100 holds the leadframes 104 and 106 together. Thus, the structural body 110 provides structural integrity for the LED package 100. The structural body 110 may be made of an electrically insulating material, such as a polymer-based material. The structural body 110 is shaped to include a depression 114 over the leadframes 104 and 106, which serves as a reflector cup. The LED die 102 on the leadframe 104 is positioned within the reflector cup 114 so that light emitted from the LED die can be reflected upward as useful output light. The structural body 110 may be formed by a single injection molding process. In this embodiment, the dimensions of the structural body 110 conform to the PLCC-4 standard. However, in other embodiments, the dimensions of the structural body 110 may conform to other PLCC-4 standards.
The domed encapsulant 112 of the PLCC package 100 is positioned over the LED die 102, the bond wire 108 and the leadframes 104 and 106. The domed encapsulant 112 fills the reflector cup 114, and is attached to the LED die 102, the bond wire 108 and exposed portions of the leadframes 104 and 106 within the reflector cup. The domed portion 116 of the encapsulant 112 protrudes from the reflector cup 114. The domed portion 116 of the encapsulant 112 functions as a lens to focus the light emitted from the LED die 102. The domed encapsulant 112 is an integral single piece structure. That is, the domed encapsulant 112 is formed as a single complete structure, not formed from multiple structures that are attached together. The domed encapsulant 112 can be made of any optically transparent material. As an example, the domed encapsulant 112 can be made of epoxy, silicone, a hybrid of silicone and epoxy, amorphous polyamide resin or fluorocarbon, glass and/or plastic material. In an embodiment, the domed encapsulant 112 is formed by a single injection molding process.
A fabrication process for producing the PLCC package 100 of
After the structural body 110 is formed, the domed encapsulant 112 is formed over the LED die 102, the bond wire 108 and exposed portions of the leadframes 104 and 106 within the reflector cup 114 of the structural body, as illustrated in
After the domed encapsulant 112 is formed, the leadframes 104 and 106 are trimmed, as illustrated in
A fabrication process for making the PLCC package 100 of
A method for making a PLCC package in accordance with an embodiment of the invention is described with reference to the process flow diagram of
Although specific embodiments of the invention have been described and illustrated, the invention is not to be limited to the specific forms or arrangements of parts so described and illustrated. The scope of the invention is to be defined by the claims appended hereto and their equivalents.
Claims
1. A plastic leaded chip carrier (PLCC) package comprising:
- a PLCC structural body;
- a first leadframe attached to said PLCC structural body;
- a light source mounted onto said first leadframe;
- a second leadframe attached to said PLCC structural body, said second leadframe being electrically connected to said light source; and
- an encapsulant attached to said light source and said first and second leadframes, said encapsulant having a domed portion that functions as a lens, said encapsulant being an integral single piece structure.
2. The PLCC package of claim 1 wherein said light source includes a light emitting diode die.
3. The PLCC package of claim 1 wherein said encapsulant includes a material selected from a group consisting of epoxy, silicone, a hybrid of silicone and epoxy, amorphous polyamide resin or fluorocarbon, glass and plastic.
4. The PLCC package of claim 1 wherein said PLCC structural body is an integral single piece structure having a depression that serves as a reflector cup, said PLCC structural body being configured to surround said light source such that said light source is positioned in said depression over a portion of said PLCC structural body.
5. (cancel).
6. The PLCC package of claim 1 wherein said PLCC structural body has dimensions that conform to the PLCC-4 standard.
7. A method for making a plastic leaded chip carrier (PLCC) package, said method comprising:
- providing first and second leadframes;
- mounting a light source onto said first leadframe;
- electrically connecting said light source to said second leadframe;
- forming an encapsulant over said light source and said first and second leadframes, said encapsulant having a domed portion that functions as a lens, said encapsulant being an integral single piece structure; and
- forming a structural body on said first and second leadframe.
8. The method of claim 7 wherein said mounting includes mounting a light emitting diode die onto said first leadframe.
9. The method of claim 7 wherein said forming said encapsulant includes performing an injection molding process to form said encapsulant.
10. The method of claim 9 wherein said forming said structural body includes performing another injection molding process to form said structural body.
11. The method of claim 10 wherein said injection molding process to form said encapsulant is performed prior to said another injection molding process to form said structural body.
12. The method of claim 10 wherein said another injection molding process to form said structural body is performed prior to said injection molding process to form said encapsulant.
13. The method of claim 7 wherein said forming said encapsulant includes forming said encapsulant using a material selected from a group consisting of epoxy, silicone, a hybrid of silicone and epoxy, amorphous polyamide resin or fluorocarbon, glass and plastic.
14. The method of claim 7 wherein said forming said structural body includes creating a reflector cup on said structural body.
15. The method of claim 14 wherein said forming said structural body includes positioning said reflector cup such that said light source is positioned within said reflector cup of said structural body.
16. The method of claim 7 wherein said forming said structural body includes performing an injection molding process to form said structural body.
17. The method of claim 7 wherein said forming said structural body includes forming said structural body such that dimensions of said structural body conform to the PLCC-4 standard.
18. A method for making a plastic leaded chip carrier (PLCC) package, said method comprising:
- providing first and second leadframes;
- mounting a light emitting diode die onto said first leadframe;
- electrically connecting said light emitting diode die to said second leadframe;
- forming an encapsulant over said light emitting diode die and said first and second leadframes using an injection molding process, said encapsulant having a domed portion that functions as a lens, said encapsulant being an integral single piece structure; and
- forming a structural body on said first and second leadframe using another injection molding process.
19. The method of claim 18 wherein said another injection molding process to form said structural body is performed prior to said injection molding process to form said encapsulant.
20. The method of claim 18 wherein said forming said structural body includes forming said structural body such that dimensions of said structural body conform to the PLCC-4 standard.
International Classification: H01L 33/00 (20060101); H01L 21/00 (20060101);