Abstract: A system and method for performing an information handling system multi mount option mounting operation. The information handling system multi mount option mounting operation is performed by an information handling system multi mount option mounting system which includes a a base panel, the base panel comprising a symmetric mounting feature, the symmetric mounting feature comprising a plurality of mounting apertures; and, an alignment feature, alignment feature comprising a plurality of mounting slots, the plurality of mounting slots being configured to interact with alignment features of an information handing system chassis when the information handling system chassis is attached to the information handling system multi mount option mounting component; and wherein the information handling system multi mount option mounting component enables mounting of an information handing system via any of a plurality of different mounting options.

Abstract: A system and method for performing a card retention operation. The card retention operation is performed by a card mounting system which includes a card bay and a card retention component coupled to the card bay, the card retention component include a vertical structural component; a slot feature coupled with the vertical structural component, the slot feature being configured to mate with a projection extending from a card conforming to a first card form factor; and, a side latch feature coupled with the vertical structural component, the side latch feature being configured to provide horizontal pressure against a card conforming to a second card form factor where the slot feature and the side latch feature enable the card retention component to retain cards conforming to the plurality of different card form factors within a single card bay.

Abstract: Described herein is a temperature sensing module for determining and adjusting temperature of dual inline memory module (DIMM) of an information handling system. The temperature sensing module includes a flexible printed circuit (FPC) and a temperature sensor integrated into the FPC. The temperature sensor is configured to contact and receive temperature the DIMM. The received temperature is used to adjust temperature of the DIM by heating a heating pad. Fasteners are to connect the temperature sensing module to the DIMM.

Abstract: An open compute project mounting system. The open compute project mourning system includes an OCP mounting bay, the OCP mounting bay defining a plurality of guide slots; a first OCP card module, the first OCP card module being positioned within the OCP mounting bay via a first pair of the plurality of guide slots; and, a second OCP card module, the second OCP card module being positioned within the OCP mounting bay via a second pair of the plurality of guide slots.

Abstract: A light emitting package structure includes a light emitting unit, a reflective layer, a reflective element and an optical layer. The light emitting unit has a top surface, a bottom surface and sidewall surfaces. The bottom surface and the top surface are opposing to each other. The sidewall surfaces are between the top surface and the bottom surface. The light emitting unit further has an electrode portion on the bottom surface. The reflective layer encloses the sidewall surfaces of the light emitting unit. The reflective element is disposed on the light emitting unit and the reflective layer. The optical layer includes a phosphor layer, a light diffusion layer or a combination thereof. The optical layer is disposed between the top surface of the light emitting unit and the reflective element.

Abstract: A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.

Abstract: A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.

Abstract: A light emitting package structure includes: a light emitting chip, an encapsulant covering the light emitting chip and having an anti-adhesion upper surface and an anti-adhesion surrounding surface. A method of manufacturing a light emitting package structure is further provided and includes: configuring a plurality of light emitting chips on a temporary carrier; forming an encapsulant to cover the plurality of light emitting chips; cutting the encapsulant to form the independent light emitting package structure; and surface treating the cut encapsulant such that the encapsulant has an anti-adhesion upper surface and an anti-adhesion surrounding surface.

Abstract: A cargo container with strong and structurally supportive but unobtrusive built-in carrying handles cargo container includes a case, a cover, a positioning member mounted on the case, and the carrying handles lifting member. The carrying handles lifting member can slide up and down and a first lock opening and a second lock opening are defined. lifting member. When the carrying handle lifting member is in a first position, the first lock opening engages the carrying handle in a retracted state lifting member. When the carrying handle lifting member is at a second position, the second lock opening engages and locks the carrying handle while lifting member extended out of the cover.

Abstract: A wafer is provided and loaded in a reaction chamber. Subsequently, the wafer is lifted up, and a dry clean process is performed on the wafer to clean the front side, the back side, and the bevel of the wafer. Following that, a deposition process is performed on the wafer. The dry clean process and the deposition process are carried out in an in-situ manner.

Abstract: The present invention discloses an improved shallow trench isolation process. A semiconductor substrate having a pad oxide disposed thereon and a pad nitride disposed directly on the pad oxide is provided. A trench is etched, through the pad oxide and the pad nitride, into the semiconductor substrate. A thermal oxide liner is then grown in the trench. A silicon nitride liner is deposited into the trench, wherein the silicon nitride liner covering the pad nitride and the thermal oxide liner has a first stress status. A stress alteration process is performed to alter the silicon nitride liner from the first stress status to a second stress status. A trench fill dielectric having the second stress status is deposited into the trench.

Abstract: A wafer is provided and loaded in a reaction chamber. Subsequently, the wafer is lifted up, and a dry clean process is performed on the wafer to clean the front side, the back side, and the bevel of the wafer. Following that, a deposition process is performed on the wafer. The dry clean process and the deposition process are carried out in an in-situ manner.

Abstract: The present invention discloses an improved shallow trench isolation process. A semiconductor substrate having a pad oxide disposed thereon and a pad nitride disposed directly on the pad oxide is provided. A trench is etched, through the pad oxide and the pad oxide, into the semiconductor substrate. A thermal oxide liner is then grown in the trench. A silicon nitride liner is deposited into the trench, wherein the silicon nitride liner covering the pad nitride and the thermal oxide liner has a first stress status. A stress alteration process is performed to alter the silicon nitride liner from the first stress status to a second stress status. A trench fill dielectric having the second stress status is deposited into the trench.

Abstract: A manufacturing method of an electronic diaper is to provide a sensor feeding band or box supplying a diaper body with a sensor which will be in advance attached on the upper or the lower dry layer of the diaper body for carrying out a sequent process of automatically manufacturing an electronic diaper. The electronic diaper includes an upper and lower dry layer and an sbsorbing layer sandwiched between the two dry layers, a sensor attached on the upper or the lower dry layer. The sensor has a connecting member for connecting with a controller. Sensing the diaper body wetted, the sensor will give a signal to the controller which will immediately give out warning signals to remind a nurse that the diaper is wet and needs to be replaced with a new one so that a user may feel comfortable in using the electronic diaper.

Abstract: An electronic diaper and its manufacturing method includes a diaper body and sensing wires positioned on the diaper body, and an electronic device to connect with the sensing wires so as to get signal from the sensing wires about the condition of the diaper body. If the sensing wires are connected electrically by urine absorbed by the diaper body, then the electronic device gets signal from the sensing wires to operate to light up an LED or let a speaker sound out so as to give out an alarm that the diaper body has wetted to be replaced with a new one. The electronic device is separatively combined with the diaper body so as to be used repeatedly in spite of the diaper body having to be discarded when wetted by urine.

Abstract: An electronic diaper includes a diaper, a sensor a controller, an LED lamp or a horn. The sensor senses dampness of a diaper and give a signal to the controller, which has a control circuit for calculating and converting the signal and gives out a warning signal to the LED lamp or the horn to give out light or sound for indicating that the diaper has become wet and needs to be replaced with a new one. And a timer may be further added to show the time of wetting of the diaper.

Abstract: A multi-function electric bar lamp includes a cylindrical housing, a tubular lamp cover thread ably combined with the an upper end of the housing, a cylindrical cap thread ably combined with a lower end of the housing, an LED lamp unit and a battery contained stably in a hollow interior of the housing and the cap. The LED lamp is turned on and off by placing the battery with the positive located up or down in the cap. Further, the housing, the cap and lamp cover may be changed in their shape to alter the use of an electric bar lamp.