Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A card having a fingerprint sensor and a manufacturing method of the same are provided. The fingerprint sensor is disposed between a substrate and a protection layer. The protection layer has a first area and a second area thereon. The roughness of the second area is smaller than the roughness of the first area. The second area corresponds to the sensing area of the fingerprint sensor. When the user's finger is wet, the second area may effectively keep the water from remaining on it. Thus, the water does not affect the effect of fingerprint sensing.

Abstract: A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. An amount of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.

Abstract: A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. An amount of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.

Abstract: A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. An amount of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.

Abstract: A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. A count of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.

Abstract: A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. A count of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.

Abstract: A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. A count of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.

Abstract: A touchpad structure includes a substrate, a shielding layer and a sensing layer. The shielding layer fully covers a first surface of the substrate. By using a circuit forming process to form the sensing layer on the shielding layer so as to make the shielding layer sandwiched between the substrate and the sensing layer, the structural thickness and the manufacturing processes of the overall touchpad structure can be significantly reduced.

Abstract: A chip with a bump structure comprises a chip, a plurality of pads and a plurality of bumps. The chip includes a microcircuit fabricated by integrated circuit technique. The pads are metallized portions of the chip for electrical connection. The bumps are metal bulges on the pads of the chip for electrically connecting the pads with the terminals of other components. The bumps are arranged in a horizontal direction, and each of the bumps include a first section and a second section. wherein the first section and the second section are electrically connected to each other along a vertical direction. The first section electrically contacts the corresponding pad. The size of the second section in the horizontal direction is larger than that of the first section. The second section is used for electrically connecting the chip to other components. The first section and the second section of adjacent bumps are interlaced.

Abstract: A chip with a bump structure comprises a chip, a plurality of pads and a plurality of bumps. The chip includes a microcircuit fabricated by integrated circuit technique. The pads are metallized portions of the chip for electrical connection. The bumps are metal bulges on the pads of the chip for electrically connecting the pads with the terminals of other components. The bumps are arranged in a horizontal direction, and each of the bumps include a first section and a second section, wherein the first section and the second section are electrically connected to each other along a vertical direction. The first section electrically contacts the corresponding pad. The size of the second section in the horizontal direction is larger than that of the first section. The second section is used for electrically connecting the chip to other components. The first section and the second section of adjacent bumps are interlaced.

Abstract: A patterned gold bump structure for a semiconductor chip comprises at least a patterned gold bump disposed on an insulating layer of a semiconductor chip, wherein the gold bump is used as a circuit component or a passing line. In some embodiments, the circuit component is a capacitor, a resistor, or an inductor.