PACKAGE OF A CONTROLLER AND SCREEN CONTROL MODULE WITH THE SAME
A screen control module of a mobile electronic device has at least one controller formed on a circuit board. The circuit board has multiple solder pads formed on the circuit board and respectively aligning along a first direction and a second direction. An amount of the solder pads along the first direction is greater than that along the second direction. The controller is formed by an integrated circuit with a package, and the aspect ratio of the package is not less than 2. The package has multiple electrical contacts respectively aligning along a length direction and a width direction. Each electrical contact aligns with and is electrically connected to a corresponding solder pad. Accordingly, the screen control module mounted within a side frame of a display of the mobile electronic device can increase the aspect ratio to meet the demand for narrowing the side frame of the display.
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This application is a divisional application of co-pending application Ser. No. 14/927,051 filed on Oct. 29, 2015, which is a divisional application of application Ser. No. 13/802,845 filed on Mar. 14, 2013 (now U.S. Pat. No. 9,207,719 issued on Dec. 8, 2015). Application Ser. No. 13/802,845 claims priority to Taiwan Patent Application No. 101147414 filed in Taiwan on Dec. 14, 2012 under 35 U.S.C. §119(a). The entire contents of all are hereby incorporated by reference.
BACKGROUND OF THE INVENTION 1. Field of the InventionThe present invention relates to a package of a controller and a screen control module with the same, and more particularly to a package of a controller.
2. Description of the Related ArtThe rising tablet computers have re-prioritized the importance of all types of computers in the computer market and have further squeezed their market share. Tablet computers impact most directly on notebook computers in terms of the market acceptance. From the perspective of fashion and technology, it is not very difficult to image why tablet computers can sweep the computer market. However, when compared in terms of practicability, notebook computers still own advantages and features that tablet computers cannot surpass. For example, tablet computers rely on excellent touch interfaces in support of humanized and intuitive operation, but when it comes to large text input, the drawback of handwriting input is quite obvious because the speed of handwriting input is far lower than the speed of keyboard input, which approximately rates tens of characters per minute. Although notebook computers fall behind tablet computers in some categories, such as size, weight, battery standby time and the like, tablet computers are still unable to replace notebook computer for the sake of intended operation functions and purposes.
From the foregoing, in some degrees, notebook computers can still maintain their strength in the computer market. Despite the strength, manufacturers of notebook computers still constantly develop and improve techniques related to notebook computers. Among all the developed and improved techniques, laptop lid is one of the categories attracting much attention. With reference to
The so-called screen control module has at least one controller 81 mounted on a circuit board 80. The at least one controller 81 is electrically connected to the display monitor 73 and/or the touch panel through wires and connectors 82 on the circuit board 80. When consumers further demand for a larger effective display area of the display monitor 73, first thing that comes to mind is to reduce the width of the side frame 720 of the lid 72. Nevertheless, the side frame reduction should also take the width of the screen control module into account. The side frame reduction is possible only when the width of the screen control module can be reduced.
Given the composition of conventional screen control modules, a barrier exists for the width reduction of the conventional screen control modules. With reference to
As a summary, when the computer market further demands for enlarged effective display area on the display monitor of the lid, the width reduction of the side frame of the lid should be considered. However, the width of the side frame is limited by the width of the screen control module. Therefore, to reduce the width of the side frame of the lid, a concrete solution targeting at the width reduction of the screen control module should be provided.
SUMMARY OF THE INVENTIONA first objective of the present invention is to provide a screen control module of a mobile electronic device targeting at a controller mounted on a circuit board and having a package with a desired aspect ratio so that the circuit board can increase its aspect ratio and reduce a width of the screen control module to prevent the screen control module from dominating the width of the side frame of the display.
To achieve the foregoing objective, the screen control module of the mobile electronic device has a circuit board and at least one controller.
The circuit board has a surface and multiple solder pads. The solder pads respectively align along a first direction and a second direction. An amount of the solder pads along the first direction is greater than an amount of the solder pads along the second direction. Each one of the at least one controller is formed by an integrated circuit mounted on the circuit board and having a package. The package comprises multiple electrical contacts and a packaging substrate. The electrical contacts respectively align along the first direction and the second direction and respectively corresponds to the solder pads. The packaging substrate has two metal layers and a dielectric layer mounted between the metal layers. The metal layers and the dielectric layer at least overlap in part.
In the foregoing screen control module of a mobile electronic device, the solder pads on the circuit board respectively align along the different first and second directions, and the amount of the solder pads along the first direction is greater than that along the second direction, so as to constitute an elongated electrical connection interface. The electrical contacts on the package of the controller have a corresponding arrangement and align with the respective solder pads on the circuit. Therefore, the aspect ratio of the package of the controller should not be less than two. Under the circumstance of reducible width of the package of the controller, the width of the circuit board of the screen control module can be also reduced so that it is possible for a flip-up lid of the mobile electronic device to narrow its side frame and enlarge an effective display area of a display monitor.
A second objective of the present invention is to provide the aforementioned package of an integrated circuit for a controller of a screen control module having a desired aspect ratio and satisfying applications requiring elongated electrical connection interfaces.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
A screen control module in accordance with the present invention is applied to a mobile electronic device. The so-called mobile electronic device includes, but is not limited to, notebook computers, electronic dictionaries and other electronic devices each having a flip-up lid and a display monitor mounted on the lid. When the screen control module is applied to a notebook computer, the screen control module is mounted inside the flip-up lid of the notebook computer.
With reference to
In the present embodiment, the controllers 20, the connectors 31, 32 and the passive elements 33 are mounted on one surface of the circuit board 10. The connectors 31, 32 and the passive elements 33 are mounted by through-hole soldering means, surface mount technology (SMT) and the like, which pertain to techniques known to persons in the related field and are not repeated here.
The circuit board 10 is slender and elongated. The circuit board 10 is implemented with a length range of 50˜80 millimeters (hereinafter mm) and a width range less than or equal to 9 mm. The circuit board 10 has at least one elongated electrical connection interface 11 for mounting the respective controller 20. Each one of the at least one electrical connection interface 11 is composed of multiple solder pads 110 formed on the surface of the circuit board 10. The solder pads 110 respectively align along a first direction and a second direction. In the present embodiment, the first direction is a length direction of the circuit board 10, and the second direction is a width direction of the circuit board 10 perpendicular to the length direction. In other words, the solder pads 110 are arranged in the form of a matrix. The number of the solder pads 110 along the length direction is greater than that along the width direction. For example, the number of the solder pads 110 along the length direction is 20 and the number of the solder pads 110 along the width direction is 8.
With reference to
Here is a table listing the aspect ratio and the number of electrical contacts of several types of packages 200 as follows.
The forms of the electrical contacts 210 of the package 200 of the foregoing controller 20 vary according to the adopted packaging technology. In the present embodiment, the controller 20 is a ball grid array (BGA) element, and the electrical contacts 210 on the package 200 are formed by solder balls. Besides, when the controller 20 is a chip scale packaging (CSP) element or a wafer level chip scale packaging (WLCSP) element, the electrical contacts 210 on the package 200 are still formed by solder balls. When the controller 20 is a land grid array (LGA) element, which is free of solder balls, the solder pads on the bottom surface of the controller 20 constitute the electrical contacts 210 on the package 200.
As described earlier, the solder pads 110 on the circuit board 10 respectively align along the first direction and the second direction, and the number of the solder pads 110 along the first direction is greater than the number of the solder pads 110 along the second direction, thereby constituting an elongated electrical connection interface aligning and connected with a corresponding controller 20 having multiple electrical contacts 210 with an identical alignment. Under the matching relationship, the package 200 of the controller 20 can expand its aspect ratio. When the length L is extended and the width W is shortened, the ratio between the width of the controller 20 and that of the circuit board 10 can be reduced. Hence, the width of the circuit board 10 and the width of the screen control module can be also reduced to eliminate the concern that the screen control module dominates the reduction of the width of the side frame of the flip-up lid. With reference to
From the foregoing embodiment, the aspect ratio of the package 200 of the controller 20 is increased to aim at reducing the ratio between the widths of the controller 20 and the circuit board 10. To prevent warp from occurring when the controller 20 is mounted (such as reflow), the following technical approaches are further addressed in response to the warp that might occur.
One of the technical approaches is to employ a WLCSP element in the controller 20. With reference to
As the above-mentioned WLCSP element is completed during a wafer fabrication process and the chip 41 and the silicon substrate 40 are all made by silicon, the low thermal expansion coefficient of their laminate can effectively mitigate the warp effect on elements due to heat generated during a reflow process.
Another technical approach is to employ a CCL substrate as a packaging substrate. The anti-warp capability of the CCL substrate is adopted to tackle the warp effect on the packaging substrate during a reflow process. With reference to
With reference to
When being a CCL substrate, the packaging substrate 50 has multiple dielectric layers 501 and multiple copper wire layers 502 alternately stacked to constitute a multi-layer substrate. Each dielectric layer 501, 501A respectively has at least one layer of glass fiber cloth 503. To enhance the anti-warp strength of the multi-layer substrate, a thickness of the glass fiber cloth 503 inside at least one dielectric layer 501A can be reduced while the number of layer for the glass fiber cloth 503 inside the dielectric layer 501A is increased. In other words, if the dielectric layer 501A has multiple layers of glass fiber cloth 503, a thickness of the dielectric layer 501A is 0.15 mm, and an original thickness of the glass fiber cloth 503 is 0.14 mm (cloth number 1056), the thickness of the glass fiber cloth 503 can be reduced to 0.05 mm (cloth number 1086) and the number of layer for the glass fiber cloth can be increased. When the thickness of the dielectric layer 501A is 0.25 mm and the original thickness of each of the two layers of glass fiber cloth 503 is 0.09 mm (cloth number 2116), the thickness of the glass fiber cloth 503 can be reduced to 0.08 mm (cloth number 3313) and the number of layer for the glass fiber cloth can be increased.
Mounting glass fiber cloth in the dielectric layer 501, 501A of regular CCL substrate is intended to provide significant anti-warp capability. Adding more layers of glass fiber cloth 503 in an identical dielectric layer 501A can further raise the anti-warp strength.
In sum, the solder pads of the screen control module of the present invention respectively align along the first direction and the second direction. Given the condition that the number of the solder pads along the first direction is greater than the number of the solder pads along the second direction, an elongated electrical connection interface can be formed. A controller having multiple electrical contacts identically arranged on the elongated package thereof to correspond to and connect with the respective solder pads. Under the foregoing design, the package of the controller can increase its aspect ratio. Under the circumstance of longer length and shorter width, the ratio between the width of the controller and the width of the circuit board can be reduced. Accordingly, the width of the circuit board can be reduced and the width of the screen control module can be also reduced, thereby satisfying the need of reducing the width of the side frame of the flip-up lid.
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims
1. A package of a touch panel controller of a screen control module comprising:
- a body having a length and a width;
- multiple electrical contacts respectively aligning along the length and the width, wherein an amount of the electrical contacts along the length is greater than an amount of the electrical contacts along the width; and
- a packaging substrate having two metal layers and a dielectric layer mounted between the metal layers, wherein the metal layers and the dielectric layer at least overlap in part.
2. The package as claimed in claim 1, wherein the aspect ratio between the length and the width of the body of the package is in a range of 2:1 to 4:1.
3. The package as claimed in claim 1, wherein the length of the body of the package is less than or equal to 20 millimeters and the width of the body of the package is less than or equal to 6 millimeters.
4. The package as claimed in claim 1, wherein the dielectric layer has at least two layers of fiber cloth.
5. The package as claimed in claim 2, wherein the dielectric layer has at least two layers of fiber cloth.
6. The package as claimed in claim 3, wherein the dielectric layer has at least two layers of fiber cloth.
7. The package as claimed in claim 4, wherein the layers of fiber cloth are layers of glass fiber cloth.
8. The package as claimed in claim 5, wherein the layers of fiber cloth are layers of glass fiber cloth.
9. The package as claimed in claim 6, wherein the layers of fiber cloth are layers of glass fiber cloth.
10. A screen control module of a mobile electronic device, comprising:
- a circuit board having: a surface; and multiple solder pads respectively aligning along a length and a width, wherein an amount of the solder pads along the length is greater than an amount of the solder pads along the width; and;
- a controller formed by an integrated circuit mounted on the circuit board and having a package comprising a body having a length and a width; multiple electrical contacts respectively aligning along the length and the width, and the electrical contacts respectively corresponds to the solder pads; and a packaging substrate having two metal layers and a dielectric layer mounted between the metal layers, wherein the metal layers and the dielectric layer at least overlap in part.
11. The screen control module as claimed in claim 10, wherein the aspect ratio between the length and the width of the body of the package is in a range of 2:1 to 4:1.
12. The screen control module as claimed in claim 10, wherein the length of the body of the package is less than or equal to 20 millimeters and the width of the body of the package is less than or equal to 6 millimeters.
13. The screen control module as claimed in claim 10, wherein the dielectric layer has at least two layers of fiber cloth.
14. The screen control module as claimed in claim 11, wherein the dielectric layer has at least two layers of fiber cloth.
15. The screen control module as claimed in claim 12, wherein the dielectric layer has at least two layers of fiber cloth.
16. The screen control module as claimed in claim 13, wherein the layers of fiber cloth are layers of glass fiber cloth.
17. The screen control module as claimed in claim 14, wherein the layers of fiber cloth are layers of glass fiber cloth.
18. The screen control module as claimed in claim 15, wherein the layers of fiber cloth are layers of glass fiber cloth.
Type: Application
Filed: Jan 26, 2017
Publication Date: May 25, 2017
Applicant: ELAN MICROELECTRONICS CORPORATION (Hsinchu)
Inventors: Ming-Lung HO (Taoyuan City), Chien-Wen TSAI (Zhubei City)
Application Number: 15/416,725