Abstract: A light source driving circuit includes a voltage signal source and a temperature-improving current source for adjusting luminance of a series of LEDs. A first end of the series of LEDs is electrically connected to a ground end. The temperature-improving current source includes an adjustable power supply for outputting an adjustable voltage, a voltage-controlled current source for outputting currents according to the voltage signal source, and a feedback circuit electrically connected between a second end of the series of the LEDs and the adjustable power supply for controlling the output voltage of the adjustable power supply according to the voltage on the second end of the series of LEDs.

Abstract: The present invention discloses a microfluidic separating and transporting device, which utilizes free-energy gradient surfaces having micro/nano physical and chemical properties to drive and separate microfluids automatically. The device of the present invention comprises a platform having microchannels. The surfaces of the microchannels have surface energy gradient-inducing rare-to-dense microstructures. The rare-to-dense microstructures are formed in two regions; one is formed in the primary microchannel and used to transport microfluids, and the other is formed in the microfluid bifurcation region. When different microfluids flow through the microfluid bifurcation region, the microfluids will separate automatically to their own secondary microchannels according to the surface energy gradient. Thereby, droplets of different microfluids can be separated apart or split into diffluences.

Abstract: A method for fabricating ultra high density optical discs is disclosed, which comprises the steps of: (a) providing a substrate; (b) coating a photoresist on the substrate; (c) forming patterns on the photoresist by irradiating the same with a light source; (d) developing the photoresist for enabling the photoresist with patterns to be resided on the substrate; (e) dry etching the substrate for forming protrusions at the positions of the substrate corresponding to the patterns while generating apertures on the substrate; (f) removing the photoresist from the substrate completely; (g) placing the substrate on a fixture; (h) evenly coating an ultra-violet (UV) resin on the substrate while covering the apertures thereof; (i) curing the UV resin by irradiating the same with an UV light; (j) attaching a base panel onto the cured UV resin and then separating the cured UV resin from the apertures of the substrate; (k) coating a metal layer on the cured UV resin; (l) coating a protective layer on the metal layer.

Abstract: A method for bonding patterned imprint by transferring is disclosed, which comprises the following steps: (a) providing a first module having a molding substrate, a molding layer and a patterned molding features, and a second module having a substrate; wherein said molding layer and said patterned molding features are located on said molding substrate; (b) coating a release layer on said molding features; (c) filling a transfer layer into the recess which is located between the patterned molding features; (d) coating an adhesion layer on said substrate of said second module; (e) combining and contacting said second module and said first module together for transferring said transfer layer to said substrate of said second module; and (f) separating said second module from said first module.

Abstract: An electron anti-reflection arrangement includes a substrate, an electron resistant layer formed on a top side of the substrate, and an electron anti-reflective layer provided in between the substrate and the electron resistant layer for enabling an electron beam to pass to the inside of the substrate in an incident direction and minimizing the amount of electrons of the electron beam that return to the electron resistant layer after reflection by the substrate.

Abstract: An anti-electron reflector is constructed to include a substrate, an electron resistant layer formed on a top side of the substrate, and an anti-electron reflective layer provided in between the substrate and the electron resistant layer for enabling an electron beam to pass to the inside of the substrate in an incident direction and minimizing the amount of electrons of the electron beam that return to the electron resistant layer after reflection by the substrate.