Abstract: A socket of a testing tool is configured to provide testing signals. A device-under-test (DUT) board is configured to provide electrical routing. An integrated circuit (IC) die is disposed between the socket and the DUT board. The testing signals are electrically routed to the IC die through the DUT board. The IC die includes a substrate in which plurality of transistors is formed. A first structure contains a plurality of first metallization components. A second structure contains a plurality of second metallization components. The first structure is disposed over a first side of the substrate. The second structure is disposed over a second side of the substrate opposite the first side. A trench extends through the DUT board and extends partially into the IC die from the second side. A signal detection tool is configured to detect electrical or optical signals generated by the IC die.

Abstract: A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector, rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: A socket of a testing tool is configured to provide testing signals. A device-under-test (DUT) board is configured to provide electrical routing. An integrated circuit (IC) die is disposed between the socket and the DUT board. The testing signals are electrically routed to the IC die through the DUT board. The IC die includes a substrate in which plurality of transistors is formed. A first structure contains a plurality of first metallization components. A second structure contains a plurality of second metallization components. The first structure is disposed over a first side of the substrate. The second structure is disposed over a second side of the substrate opposite the first side. A trench extends through the DUT board and extends partially into the IC die from the second side. A signal detection tool is configured to detect electrical or optical signals generated by the IC die.

Abstract: An indirect operating system is suitable for a mobile electronic device to remotely operate a controlled device, and allows the mobile electronic device, after scanning a device barcode of the controlled device, to obtain a corresponding set of user operation pages from a background device and display it on a remote control interface shown by the mobile electronic device, and then, the mobile electronic device converts the user's operation on the user operation page(s) into a control barcode or a driving packet with identification information of the controlled device. Through the driving packet or control barcode, the controlled device can obtain the user's input information and operate according to the input information.

Abstract: A non-contact control system includes a control circuit board, a Beacon Gateway, and a mobile electronic device with the original structure of the device to be controlled. The main feature is that when the application of the mobile electronic device is activated, the mobile electronic device displays a control screen for the user to click to control the actuating of the main body. Therefore, the user does not need to touch physical buttons and make a sound in the control operation, so direct contact and droplet infection can be avoided.

Abstract: A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: A method includes loading the semiconductor structure on a stage; providing a detector disposed above the semiconductor structure and the stage; applying a voltage to the semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage and recording a rotation of the stage after identifying the portion of the semiconductor structure; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: A method includes loading the semiconductor structure on a stage; providing a detector disposed above the semiconductor structure and the stage; applying a voltage to the semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage and recording a rotation of the stage after identifying the portion of the semiconductor structure; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: The present invention provides a low-toxic and high-recovery industrial process for synthesizing an optically active diamine derivative represented by formula (D), the process comprising the steps of: (a) mixing a compound represented by formula (A) and a compound represented by formula (C) in organic solvents and secondary amine; (b) reaction under heating; (c) cooling and adding water to the mixed solution, allowing it to crystallize to obtain the compound represented by formula (D).

Abstract: The present invention provides a low-toxic and high-recovery industrial process for synthesizing an optically active diamine derivative represented by formula (D), the process comprising the steps of: (a) mixing a compound represented by formula (A) and a compound represented by formula (C) in organic solvents and secondary amine; (b) reaction under heating; (c) cooling and adding water to the mixed solution, allowing it to crystallize to obtain the compound represented by formula (D).

Abstract: A memory controller including a detection module and a protection module is provided. The memory controller is applicable to a memory having a command transmission port and a data transmission port. The detection module detects whether an error condition occurs in an electronic device associated with the memory. When the error condition is detected, the protection module sends an interrupt command to the memory via the command transmission port to stop an operation associated with the data transmission port.

Abstract: A method of forming an integrated circuit structure includes providing a wafer having a first semiconductor chip, a second semiconductor chip, and a scribe line between and adjoining the first semiconductor chip and the second semiconductor chip; forming a notch in the scribe line, wherein the notch has a bottom no higher than a top surface of a semiconductor substrate in the wafer; forming a first insulation film over the wafer, wherein the first insulation film extends into the notch; removing a portion of the first insulation film from a center of the notch, wherein a remaining portion of the first insulation film comprises an edge in the notch; and sawing the wafer to separate the first semiconductor chip and the second semiconductor chip.

Abstract: A memory controller including a detection module and a protection module is provided. The memory controller is applicable to a memory having a command transmission port and a data transmission port. The detection module detects whether an error condition occurs in an electronic device associated with the memory. When the error condition is detected, the protection module sends an interrupt command to the memory via the command transmission port to stop an operation associated with the data transmission port.

Abstract: A method is disclosed for a flash memory including a plurality of data units includes determining whether to refresh data of the data units according to number of time the data units that are being read when the flash memory is read. The present invention provides methods for flash memory devices and a specialized controller to utilize values stored in counters relating to the number of read instances of corresponding blocks of data units for the selective control of refreshing data blocks when associated counter values exceed a threshold value.

Abstract: A testing device includes a shielding case and a driving member opening and closing the shielding case. The shielding case includes a receiving space for receiving an electronic device therein, a cover, and a base. The driving member includes a first driving member mechanically connected to an outside of the cover of the shielding case and a second driving member mechanically connected to an outside of the base of the shielding case. The first driving member moves the cover vertically relative to the base. The second driving member moves the base horizontally relative to the cover. Movement of the shielding case in an open position allows the electronic device to be received in or removed from the shielding case. Movement of the shielding case in a closed position allows the electronic device to be tested.

Abstract: A method of forming an integrated circuit structure includes providing a wafer having a first semiconductor chip, a second semiconductor chip, and a scribe line between and adjoining the first semiconductor chip and the second semiconductor chip; forming a notch in the scribe line, wherein the notch has a bottom no higher than a top surface of a semiconductor substrate in the wafer; forming a first insulation film over the wafer, wherein the first insulation film extends into the notch; removing a portion of the first insulation film from a center of the notch, wherein a remaining portion of the first insulation film comprises an edge in the notch; and sawing the wafer to separate the first semiconductor chip and the second semiconductor chip.

Abstract: A testing device includes a shielding case and a driving member opening and closing the shielding case. The shielding case includes a receiving space for receiving an electronic device therein, a cover, and a base. The driving member includes a first driving member mechanically connected to an outside of the cover of the shielding case and a second driving member mechanically connected to an outside of the base of the shielding case. The first driving member moves the cover vertically relative to the base. The second driving member moves the base horizontally relative to the cover. Movement of the shielding case in an open position allows the electronic device to be received in or removed from the shielding case. Movement of the shielding case in a closed position allows the electronic device to be tested.

Abstract: A light-shielding module including a bracket, a pendulous member, a shielding member, a first magnet, a second magnet and a first coil is provided. The pendulous member has a first end and a second end opposite to each other and is pivoted on the bracket. The first end extends along a direction from a pivoting place of the pendulous member to a top of the bracket. The shielding member is connected to the first end. The first magnet is disposed at the pendulous member and located between the pivoting place and the first end. The second magnet is disposed at the pendulous member and adjacent to the second end. A mass-of-center of the second magnet is located beside a center line passing a center-of-mass of the first magnet and the pivoting center. The first coil is disposed on one of the first side wall and the second side wall.