Abstract: The present disclosure provides a thickness measuring device including a base, a first moving component, a second moving component, a frame and a linking component. The base includes a base main body and a sensor. The first moving component moves along a first direction and includes a contacting end. The second moving component moves along a second direction and includes a sensing element corresponding to the sensor. The frame is connected to the base and includes a frame main body, a first guiding groove and a second guiding groove. The first and second guiding grooves are formed on the frame main body for accommodating the first and second moving components. The linking component includes a rotating element, a first connection portion and a second connection portion. The first and second connection portions are disposed on a surface of the rotating element and connected to the first and second moving components.

Abstract: A method (of manufacturing a semiconductor device) includes: forming via structures in a first via layer over a transistor layer; forming a first via structure of a first deep via arrangement in the first via layer; forming conductive segments in a first metallization layer over the first via layer; forming M_1st routing segments at least a majority of which, relative to a first direction, have corresponding long axes with lengths which at least equal if not exceed a first permissible minimum value for routing segments in the first metallization layer; forming an M_1st interconnection segment having a long axis which is less than the first permissible minimum value and which is included in the first deep via arrangement; and forming via structures in a second via layer over the first metallization layer, including forming a first via structure of the first deep via arrangement in the second via layer.

Abstract: A memory device includes at least one bit line, at least one word line, and at least one memory cell comprising a capacitor and a transistor. The transistor has a gate terminal coupled to the word line, a first terminal, and a second terminal. The capacitor has a first end coupled to the first terminal of the transistor, a second end coupled to the bit line, and an insulating material between the first end and the second end. The insulating material is configured to break down under a predetermined break-down voltage or higher applied between the first end and the second end.

Abstract: A method (of generating a layout diagram) includes: generating one or more first conductive patterns representing corresponding conductive material in the first metallization layer, long axes of the first conductive patterns extending substantially in a first direction; generating a first deep via pattern representing corresponding conductive material in each of the second via layer, the first metallization layer, and the first via layer; relative to the first direction and a second direction substantially perpendicular to the first direction, aligning the first deep via pattern to overlap a corresponding component pattern representing conductive material included in an electrical path of a terminal of a corresponding transistor in the transistor layer; and configuring a size of the first deep via pattern in the first direction to be substantially less than a permissible minimum length of a conductive pattern in the first metallization layer.

Abstract: A semiconductor device includes a first power rail, a second power rail, and a first cell. The first cell has a first first-type active region and a first second-type active region, and a first cell height of the first cell is defined as a pitch between the first power rail and the second power rail. The semiconductor device further includes a second cell having a second first-type active region and a second second-type active region, wherein the second first-type active region extends in a second row and a third row on a first side of the first row and has a first width in the column direction greater than a second width of the first first-type active region in the column direction. The semiconductor device also includes a third cell having a first portion and a second portion arranged in the second row and a fourth row, respectively.

Abstract: A method of generating an IC layout diagram includes positioning a first active region between second and third active regions, intersecting the first active region with first through fourth gate regions to define gate locations of first and second anti-fuse bits, aligning first and second conductive regions between the first and second active regions, thereby intersecting the first conductive region with the first gate region and the second conductive region with the fourth gate region, and aligning third and fourth conductive regions between the first and third active regions, thereby either intersecting the third and fourth conductive regions with the first and third gate regions, or intersecting the third and fourth conductive regions with the second and fourth gate regions. At least one of positioning or intersecting the first active region, or aligning the first and second or third and fourth conductive regions is executed by a processor.

Abstract: A method of generating a layout diagram of an IC cell includes defining a boundary recess in a boundary of the cell by extending a first portion of the boundary along a first gate track, extending a second portion of the boundary from the first gate track to a second gate track, the second portion being contiguous with the first portion, and extending a third portion of the boundary from the first gate track to the second gate track, the third portion being contiguous with the first portion An active region is positioned in the cell by extending the active region across a third gate track, wherein the first gate track is between the second gate track and the third gate track. The layout diagram is stored on a non-transitory computer-readable medium.

Abstract: A method of generating a layout diagram of an IC cell includes defining a boundary recess in a boundary of the cell by extending a first portion of the boundary along a first direction, extending a second portion of the boundary away from the first portion in a second direction perpendicular to the first direction, the second portion being contiguous with the first portion, and extending a third portion of the boundary away from the first portion in the second direction, the third portion being contiguous with the first portion. An active region is positioned in the cell by extending the active region away from the first portion in a third direction opposite to the second direction. The layout diagram is stored on a non-transitory computer-readable medium.

Abstract: A method, apparatus and system for determining a weakness or risk for devices of an Internet-of-things (IoT) network include determining a representation of a physical environment of the IoT network and expected physical and cyber interactions between the devices of the IoT network based at least in part on operating characteristics of the devices of the IoT network, monitoring the physical environment and actual interactions between the devices to generate a network model including at least one of uncharacteristic physical or cyber interaction paths between the devices, based on the determined network model, determining at least one weakness or risk of at least one of the IoT network or of at least one of the devices, and providing a metric of security of at least one of the IoT network or of at least one of the devices based on at least one of the determined weakness or risk.

Abstract: A method (of generating a layout diagram) includes: generating one or more first conductive patterns representing corresponding conductive material in the first metallization layer, long axes of the first conductive patterns extending substantially in a first direction; generating a first deep via pattern representing corresponding conductive material in each of the second via layer, the first metallization layer, and the first via layer; relative to the first direction and a second direction substantially perpendicular to the first direction, aligning the first deep via pattern to overlap a corresponding component pattern representing conductive material included in an electrical path of a terminal of a corresponding transistor in the transistor layer; and configuring a size of the first deep via pattern in the first direction to be substantially less than a permissible minimum length of a conductive pattern in the first metallization layer.

Abstract: A method of generating a layout diagram of an IC cell includes defining a boundary recess in a boundary of the cell by extending a first portion of the boundary along a first direction, extending a second portion of the boundary away from the first portion in a second direction perpendicular to the first direction, the second portion being contiguous with the first portion, and extending a third portion of the boundary away from the first portion in the second direction, the third portion being contiguous with the first portion. An active region is positioned in the cell by extending the active region away from the first portion in a third direction opposite to the second direction. The layout diagram is stored on a non-transitory computer-readable medium.

Abstract: A dual drive pressing apparatus for plural pressing heads is disclosed. The dual drive pressing apparatus includes a platform, a first rotation plate, a second rotation plate, a return set and a switch set. While the first rotation plate is driven by a first driving force, the first rotation plate rotates with the second rotation plate to a selectively specific angle relative to the platform, and the set of pressing columns is selectively aligned with a corresponding pressing head. While a second driving force is provided by the switch set to resist the resilience of the return set and push against the end of the supporting cylinder to move towards the second surface, the supporting cylinder of the second rotation plate drives the fourth surface separated from the first rotation plate, and the set of pressing columns on the third surface pushes the corresponding pressing head set.

Abstract: In some embodiments, a first cell layout and a second cell layout are provided and combined into a third cell layout. Each of the first cell layout and the second cell layout includes a higher power line, a lower power line, an output pin, at least one up transistor and at least one down transistor formed to electrically couple the output pin to the higher power line and the output pin to the lower power line, respectively. The at least one up transistor and the at least one down transistor of the second cell layout include a gate line. For the combining, the gate line is non-selectively electrically coupled to the output pin of the first cell layout to form a first node. A design layout in which the third cell layout is used at different locations is generated.

Abstract: The disclosure relates to a dual drive pressing apparatus for plural pressing heads. The dual drive pressing apparatus includes a platform, a first rotation plate, a second rotation plate, a return set and a switch set. While the first rotation plate is driven by a first driving force, the first rotation plate rotates with the second rotation plate to a selectively specific angle relative to the platform, and the set of pressing columns is selectively aligned with a corresponding pressing head. While a second driving force is provided by the switch set to resist the resilience of the return set and push against the end of the supporting cylinder to move towards the second surface, the supporting cylinder of the second rotation plate drives the fourth surface separated from the first rotation plate, and the set of pressing columns on the third surface pushes the corresponding pressing head set.

Abstract: A steel wire transmission system includes plural slide rail seats, plural slide rails, plural wheel sets corresponding to the plural slide rails, plural slide blocks, plural steel wires, plural guide rods and a printhead module. The plural slide rails are disposed on the corresponding slide rail seats. Each wheel set includes a driving wheel and a driven wheel corresponding to the driving wheel. The driving wheel and the driven wheel of each wheel set are fixed at two ends of the corresponding slide rail. Each slide block is sheathed around the corresponding slide rail and movable between the corresponding driving wheel and the corresponding driven wheel. The plural steel wires are wound around the corresponding wheel sets. Each guide rod is connected with two corresponding slide blocks. The printhead module is connected with the plural guide rods.

Abstract: In some embodiments, a first cell layout and a second cell layout are provided and combined into a third cell layout. Each of the first cell layout and the second cell layout includes a higher power line, a lower power line, an output pin, at least one up transistor and at least one down transistor formed to electrically couple the output pin to the higher power line and the output pin to the lower power line, respectively. The at least one up transistor and the at least one down transistor of the second cell layout include a gate line. For the combining, the gate line is non-selectively electrically coupled to the output pin of the first cell layout to form a first node. A design layout in which the third cell layout is used at different locations is generated.

Abstract: The present disclosure relates to a printing platform supporting module and a three-dimensional printer using same. The printing platform supporting module comprises a supporting frame, the printing platform, a heating assembly, an adjusting module, and a printing plate. The heating assembly is disposed on the printing platform. The adjusting module is disposed on the printing platform and comprises a plurality of locking units. The printing plate has a working surface and a mounting surface opposite to the working surface. The mounting surface is urged against the heating assembly. The printing plate is removably disposed on the printing platform by means of a locking action and an unlocking action of the locking units.

Abstract: A printing platform adjusting system of a three-dimensional printer, and an adjusting method therefor are disclosed. The printing platform adjusting system includes a printhead, a supporting frame, a printing platform, a driving unit, a distance sensor, a control unit, and a parallelism adjusting set. The printing platform has a plurality of detecting points. The distance sensor is configured to detect and obtain a plurality of detected vertical height values corresponding to the detecting points. The control unit controls the driving unit to drive the printhead to move, receives the detected vertical height values from the distance sensor, and converts the detected vertical height values into a plurality of adjusted vertical height values. The parallelism adjusting set includes a plurality of adjusting and fastening units configured to adjust a degree of parallelism between the printing platform and the horizontal movement plane of the printhead according to the adjusted vertical height values.

Abstract: The present disclosure relates to a printing platform supporting module and a three-dimensional printer using same. The printing platform supporting module comprises a supporting frame, the printing platform, a heating assembly, an adjusting module, and a printing plate. The heating assembly is disposed on the printing platform. The adjusting module is disposed on the printing platform and comprises a plurality of locking units. The printing plate has a working surface and a mounting surface opposite to the working surface. The mounting surface is urged against the heating assembly. The printing plate is removably disposed on the printing platform by means of a locking action and an unlocking action of the locking units.

Abstract: A steel wire transmission system includes plural slide rail seats, plural slide rails, plural wheel sets corresponding to the plural slide rails, plural slide blocks, plural steel wires, plural guide rods and a printhead module. The plural slide rails are disposed on the corresponding slide rail seats. Each wheel set includes a driving wheel and a driven wheel corresponding to the driving wheel. The driving wheel and the driven wheel of each wheel set are fixed at two ends of the corresponding slide rail. Each slide block is sheathed around the corresponding slide rail and movable between the corresponding driving wheel and the corresponding driven wheel. The plural steel wires are wound around the corresponding wheel sets. Each guide rod is connected with two corresponding slide blocks. The printhead module is connected with the plural guide rods.