Abstract: To improve quality assurance and durability of coated components, a multifaceted inspection coupon is provided that includes opposing flat surfaces, separated by sides which include one or more curves or fillets representing surfaces of the coated components to be inspected. The inspection coupon is coated on all sides in the same manner as the components to be inspected, whereby later analysis of the coupon provides quality assurance of all coated surfaces of the components at once.

Abstract: A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle relative to a horizontal plane.

Abstract: A fluid heat dissipation device includes a first cold plate, a first adapter and a fluid delivery pipeline. The first cold plate is used to cool a first heat source, the first adapter is connected to the first cold plate, and the fluid delivery pipeline is connected to the first adapter and fluidly communicated with the first cold plate to improve the production efficiency and quality of the fluid heat dissipation device.

Abstract: The electrochemical biosensor strip includes an electrode layer, a spacer, a reagent layer and a cover layer. The electrode layer is disposed on a substrate, and the electrode layer includes a first electrode, a second electrode and a third electrode. The spacer is disposed on the electrode layer, and the spacer includes a first opening, a second opening and a groove which are not communicated with each other. The groove is recessed inwardly from a side of the spacer. The first and second openings are adjacent to the groove. The first opening, the second opening and the groove respectively correspond to and expose the first electrode, the second electrode and the third electrode. The reagent layer is disposed on the first electrode and the second electrode, and the reagent layer is not disposed on the third electrode exposed from the groove. The cover layer is disposed on the spacer.

Abstract: A speaker module, including: a speaker enclosure, including: a recessed portion; a transducer, including: a top surface; a bottom surface; a perimeter surface positioned between the top surface and the bottom surface; a rubber cap including: a top side; a bottom side; and edges extending between the top side and the bottom side, wherein the edges define an inside perimeter of the rubber cap and include a slot extending along the inside perimeter of the rubber cap, wherein, the transducer is coupled to the rubber cap such that the rubber cap surrounds the transducer and the perimeter surface of the transducer is positioned within the slot of the plurality of edges of the rubber cap, wherein, the transducer is coupled to the speaker enclosure such that the transducer is positioned within the recessed portion of the speaker enclosure and the rubber cap is positioned between the transducer and the speaker.

Abstract: An optical sensing apparatus is provided. The optical sensing apparatus includes a substrate, one or more pixels supported by the substrate, where each of the one or more pixels includes an absorption region, a field control region, a first contact region, a second contact region and a carrier confining region. The field control region and the first contact region are doped with a dopant of a first conductivity type. The second contact region is doped with a dopant of a second conductivity type. The carrier confining region includes a first barrier region and a channel region, where the first barrier region is doped with a dopant of the second conductivity type and has a first peak doping concentration, and where the channel region is intrinsic or doped with a dopant of the second conductivity type and has a second peak doping concentration lower than the first peak doping concentration.

Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, an integrated pipe, and a fluid driving module. The power supply module is electrically connected to the control module, the integrated pipe includes a plurality of inlets and an outlet to collect and output a cooled working fluid, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, integrated pipe, and fluid driving module are all arranged in the casing.

Abstract: A liquid cooling head includes an upper casing, an impeller, a bottom casing and a skived fin cooling plate. The upper casing has an inlet and an outlet, the upper casing is fixed on the bottom casing, and the impeller is arranged between the upper casing and the skived fin cooling plate. In addition, the skived fin cooling plate is fixed on the bottom casing, and the impeller sucks the heat-dissipating liquid from the inlet and drives the heat-dissipating liquid passing through the skived fin cooling plate, upwardly passing through the impeller and then discharged from the outlet.

Abstract: The disclosure provides stable antimicrobial (e.g., antibacterial or antifungal or both) peptides (SAMPs) that may be used in methods of preventing or treating a bacterial disease (e.g., a Liberibacter disease, such as citrus greening disease (also called Huanglongbing (HLB)) or potato Zebra Chip disease, and other bacterial diseases such as those caused by Agrobacterium tumefaciens (also known as Rhizobium radiobacter) and Pseudomonas syringae) in plants (e.g., citrus plants or potato plants). SAMPs disclosed herein may be heat stable, as well as stable in plant extracts and/or in plant lysates (e.g., citrus lysates).

Abstract: An electrical connector includes an outer shell, an insulating element, and a central conductive terminal. The outer shell includes a mounting hole. The insulating element is installed in the mounting hole. The central conductive terminal includes a first fitting portion, a second fitting portion and an intermediate portion. When a signal is transmitted in the first fitting portion, it encounters an impedance having a first impedance value. When the signal is transmitted in the second fitting portion, it encounters an impedance having a second impedance value. The intermediate portion includes an impedance transition area. When the signal is transmitted in the impedance transition area, it encounters an impedance having a gradually changing third impedance value. The first impedance value, the third impedance value and the second impedance value generally have a smooth transition. An adapter and a test device having the electrical connector are disclosed.

Abstract: A bolster is provided and includes a bottom plate including a side plate extending upwards from a side of the bottom plate and a holding portion bending inwards from an edge of the side plate, a pillar vertically provided on the bottom plate and adjacent to the holding portion, and a torsion bar including two end portions and a main body portion, where one of the two end portions is fixed in the pillar and restricted by the holding portion, and the main body portion is restricted by the side plate. The bolster can effectively reduce warpage and deformation of the bottom plate.

Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

Abstract: An optical element driving mechanism is provided and includes a movable portion and a fixed portion. The movable portion includes a carrier for carrying an optical member with a first optical axis. The fixed portion has a top surface, a first side surface and a second side surface. The top surface extends in a direction that is parallel to the first optical axis. The first side surface and the second side surface extend in a direction that is not parallel to the first optical axis from the edge of the top surface and face different sides of the optical member. The shortest distance between the optical member and the first side surface is shorter than the shortest distance between the optical member and the second side surface. The optical element driving mechanism includes a noise-reducing structure configured to avoid a noise entering a photosensitive member.

Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

Abstract: A wafer includes a plurality of testing dies, a plurality of non-testing dies, and a dicing region. Each testing die includes: a first active area including one or more first active devices, and one or more first device pads electrically coupled to the one or more first active devices. Each non-testing die includes: a second active area including one or more second active devices, and one or more second device pads electrically coupled to the one or more second active devices. The dicing region includes one or more testing pads electrically coupled to the one or more first device pads. The one or more testing pads are arranged to receive one or more external probes for determining one or more characteristics of the one or more first active devices of the plurality of testing dies. The plurality of non-testing dies are electrically isolated from the dicing region.

Abstract: In an embodiment, a device includes: a first semiconductor nanostructure; a second semiconductor nanostructure adjacent the first semiconductor nanostructure; a first source/drain region on a first sidewall of the first semiconductor nanostructure; a second source/drain region on a second sidewall of the second semiconductor nanostructure, the second source/drain region completely separated from the first source/drain region; and a source/drain contact between the first source/drain region and the second source/drain region.

Abstract: A reference voltage generator circuit includes: a first transistor and a second transistor, wherein the first transistor and the second transistor are coupled with each other and are located on a substrate, wherein the first transistor has a first conduction threshold voltage and a first rated voltage, wherein the second transistor has a second conduction threshold voltage and a second rated voltage, wherein the first rated voltage is higher than the second rated voltage; wherein the reference voltage generator circuit is configured to generate a bandgap reference voltage with temperature compensation according to a difference between the first conduction threshold voltage and the second conduction threshold voltage.

Abstract: A molding method of a support rod that first passing a plurality of long fibers through a resin bath for impregnating with resin, then passing the plurality of long fibers impregnated with resin through a bundling hole of a position-constrained vertical plate on a machine to preliminarily form a bundle end; providing a coating layer on the machine, one end of the coating layer obliquely passes through a guiding portion on the position-constrained vertical plate to downwardly contact the bundle end; then placing the one end of the coating layer and the bundle end into a mold cavity of a mold at the same time to form a long rod body; and then cutting the long rod body into multi-segment support rods through a cutting process.

Abstract: The present disclosure provides a test system and method. The test system is configured to analyze a system platform and includes a data collector and a test monitor. The data collector is configured to receive a signal transmitted between a controller and a memory of the system platform and is configured to process the signal to generate a processed signal. The test monitor is configured to encode the processed signal into a log information, so as to determine an operation status of the system platform according to the log information.

Abstract: An automatic calculation method of gray-to-white-matter ratio for head computed tomography of patients with cardiac arrest is disclosed and includes an image registration step, a K-means segmentation step, a segmentation refinement step and a GWR calculation step. Measure the gray-white-matter ratio through brain computed tomography early after cardiac arrest to automatically identify the corpus callosum, caudate nucleus, putamen, and posterior branch of the internal brain cyst. It is a 3D three-dimensional structure rather than a manually selected flat circular area to evaluate the effectiveness of predicting neurological prognosis at discharge.